THERMALLY CONDUCTIVE SHEET AND METHOD FOR MANUFACTURING THERMALLY CONDUCTIVE SHEET
Provided is a thermally conductive sheet which is highly flexible and of which the thermal resistance value has small load dependency. A thermally conductive sheet 1 contains a curable resin composition 2 , a flaky thermally conductive filler 3 , and a non-flaky thermally conductive filler 4 , wherein the amount of change between the thermal resistance value at load of 1 kgf/cm 2 and the thermal resistance value at load in a range greater than 1 kgf/cm 2 and not greater than 3 kgf/cm 2 is not greater than 0.4° C.·cm 2 /W, and the amount of change between the compression rate at load of 3 kgf/cm 2 and the compression rate at load of 1 kgf/cm 2 is not less than 20%.
1 . A thermally conductive sheet, comprising:
a curable resin composition;
a flake-like thermally conductive filler; and
a non-flake-like thermally conductive filler,
wherein a difference between a thermal resistance value at a load of 1 kgf/cm 2 and a thermal resistance value at a load of 3 kgf/cm 2 is 0.4° C.·cm 2 /W or less, and
a difference between a compression ratio at a load of 3 kgf/cm 2 and a compression ratio at a load of 1 kgf/cm 2 is 20% or more.
2 . The thermally conductive sheet according to claim 1 , wherein the curable resin composition is a liquid silicon resin formed by subjecting two liquids, which are a silicone primary agent and a curing agent, to an addition reaction,
the mass ratio of the silicone primary agent and the curing agent (silicone primary agent:curing agent) being from 5:5 to 7:3.
3 . The thermally conductive sheet according to claim 1 , wherein an average particle diameter (D50) of the flake-like thermally conductive filler is from 20 to 50 μm.
4 . The thermally conductive sheets according to claim 1 , wherein a peak value of effective thermal conductivity is 7 W/m·K or more in a range in which the compression ratio is from 5 to 35%.
5 . The thermally conductive sheet according to claim 1 , wherein a total content of the flake-like thermally conductive filler and the non-flake-like thermally conductive filler in the thermally conductive sheet is less than 70 percent by volume relative to a total volume of the thermally conductive sheet.
6 . The thermally conductive sheet according to claim 1 , wherein a thickness of the thermally conductive sheet is from 0.5 to 3 mm.
7 . The thermally conductive sheet according to claim 1 , wherein the compression ratio at a load of 3 kgf/cm 2 is 20% or more.
8 . A method for manufacturing a thermally conductive sheet, comprising:
dispersing a flake-like thermally conductive filler and a non-flake-like thermally conductive filler in a curable resin composition to obtain a resin composition;
forming a molded body block from the resin composition; and
slicing the molded body block into sheets to obtain the thermally conductive sheet,
wherein a difference between a thermal resistance value at a load of 1 kgf/cm 2 and a thermal resistance value at a load of 3 kgf/cm 2 is 0.4° C.·cm 2 /W or less, and a difference between a compression ratio at a load of 3 kgf/cm 2 and a compression ratio at a load of 1 kgf/cm 2 is 20% or more.
9 . The method according to claim 8 , wherein the molded body block is formed by an extrusion molding method or a die molding method from the resin composition.
10 . The method according to claim 8 , wherein the molded body block is composed of a cured product of the resin composition having a columnar shape, and is formed by an extrusion molding method, and the thermally conductive sheet is obtained by slicing the molded body block in a direction substantially orthogonal to a length direction of the molded body block.
11 . An electronic device, comprising:
a heat generating body;
a heat dissipating body; and
the thermally conductive sheet according to claim 1 disposed between the heat generating body and the heat dissipating body.