Thermally conductive resin composition and thermally conductive sheet using the same
A thermally conductive resin composition capable of maintaining high thermal conductivity and a thermally conductive sheet using the same. A thermally conductive resin composition contains: an addition reaction type silicone resin; a hindered phenol-based antioxidant; a thiol-based antioxidant; a dispersant having a hydrophilic functional group and a silicone chain; and a thermally conductive filler, wherein the thermally conductive resin composition contains 65 to 90% by volume of the thermally conductive filler.
1. A thermally conductive resin composition containing:
an addition reaction type silicone resin;
a hindered phenol-based antioxidant;
a sulfur-based antioxidant;
a dispersant having a hydrophilic functional group and a silicone chain; and
a thermally conductive filler,
wherein the thermally conductive resin composition contains 65 to 90% by volume of the thermally conductive filler,
wherein the thermally conductive filler is a mixture of aluminum nitride, alumina, and magnesium oxide, and
wherein the composition contains 0.6 to 0.7 parts by weight of the hindered phenol-based antioxidant with respect to 100 parts by weight of the addition reaction type silicone resin, 0.3 to 1.9 parts by weight of the sulfur-based antioxidant with respect to 100 parts by weight of the addition reaction type silicone resin, and 9.3 to 23.8 parts by weight of the dispersant having a hydrophilic functional group and a silicone chain with respect to 100 parts by weight of the addition reaction type silicone resin.
2. The thermally conductive resin composition according to claim 1 , wherein the hindered phenol-based antioxidant has a structure represented by Formula 1:
wherein, in Formula 1,
R 1 and R 2 represent a t-butyl group, and R 3 represents a hydrogen atom; or
R 1 represents a methyl group, R 2 represents a t-butyl group, and R 3 represents a hydrogen atom; or
R 1 represents a hydrogen atom, R 2 represents a t-butyl group, and R 3 represents a methyl group.
3. The thermally conductive resin composition according to claim 1 , wherein the hindered phenol-based antioxidant is a hindered phenol-based antioxidant having an ester bond.
4. The thermally conductive resin composition according to claim 1 , wherein the dispersant contains at least one silicone compound selected from a group of polyether-modified silicone-based compound, a polyglycerin-modified silicone-based compound, a polyetheracrylic-modified silicone-based compound, a polyglycerin acrylic-modified silicone-based compound, and an acrylic silicone-based compound.
5. A thermally conductive resin composition containing:
an addition reaction type silicone resin;
a hindered phenol-based antioxidant;
a sulfur-based antioxidant;
a dispersant having a hydrophilic functional group and a silicone chain; and
a thermally conductive filler,
wherein the thermally conductive resin composition exhibits a thermal conductivity of 2.5 W/m*K or more after curing,
wherein the thermally conductive filler is a mixture of aluminum nitride, alumina, and magnesium oxide, and
wherein the composition contains 0.6 to 0.7 parts by weight of the hindered phenol-based antioxidant with respect to 100 parts by weight of the addition reaction type silicone resin, 0.3 to 1.9 parts by weight of the sulfur-based antioxidant with respect to 100 parts by weight of the addition reaction type silicone resin, and 9.3 to 23.8 parts by weight of the dispersant having a hydrophilic functional group and a silicone chain with respect to 100 parts by weight of the addition reaction type silicone resin.
6. A thermally conductive sheet comprising a cured product of the thermally conductive resin composition according to claim 1 .
7. The thermally conductive sheet according to claim 6 , wherein the thermally conductive sheet has a thermal conductivity of 4.5 W/m*K or more.
8. The thermally conductive sheet according to claim 6 , wherein the maintenance rate of the thermal conductivity represented by Formula 2 is 70% or more when aged at 200° C. for 24 hours:
(thermal conductivity of thermally conductive sheet after aging treatment/thermal conductivity of thermally conductive sheet before aging treatment)×100. Formula 2:
9. A heat dissipating structure in which a cured product of the thermally conductive resin composition according to claim 1 is sandwiched between a heat-generating element and a heat dissipating member.
10. A heat dissipating structure in which the thermally conductive sheet according to claim 6 is sandwiched between a heat-generating element and a heat dissipating member.
11. An article comprising a heat dissipating structure according to claim 9 .
12. The thermally conductive resin composition according to claim 2 , wherein the hindered phenol-based antioxidant is a hindered phenol-based antioxidant having an ester bond.
13. The thermally conductive resin composition according to claim 2 , wherein the dispersant contains at least one silicone compound selected from a group of polyether-modified silicone-based compound, a polyglycerin-modified silicone-based compound, a polyetheracrylic-modified silicone-based compound, a polyglycerin acrylic-modified silicone-based compound, and an acrylic silicone-based compound.
14. The thermally conductive resin composition according to claim 3 , wherein the dispersant contains at least one silicone compound selected from a group of polyether-modified silicone-based compound, a polyglycerin-modified silicone-based compound, a polyetheracrylic-modified silicone-based compound, a polyglycerin acrylic-modified silicone-based compound, and an acrylic silicone-based compound.
15. The thermally conductive resin composition according to claim 1 , wherein the sulfur-based antioxidant is an antioxidant with a thioether skeleton.
16. The thermally conductive resin composition according to claim 5 , wherein the sulfur-based antioxidant is an antioxidant with a thioether skeleton.