Semiconductor device having an electromagnetic wave absorbing thermal conductive sheet between a semiconductor element and a cooling member
Provided is a semiconductor device having excellent heat transferring performance and electromagnetic wave suppression effect. A semiconductor device 1 comprises: a semiconductor element 30 formed on a substrate 50 ; a conductive shield can 20 having an opening 21 , covering at least a part of the semiconductor element 30 , and connected to a ground 60 ; a cooling member 40 located above the conductive shield can 20 ; and an electromagnetic wave absorbing thermal conductive sheet 10 formed between the semiconductor element 30 and the cooling member 40 at least through the opening 21 of the conductive shield can 20.
1. A semiconductor device comprising:
a semiconductor element formed on a substrate;
a conductive shield can having an opening, covering at least a part of the semiconductor element, and connected to a ground;
a cooling member located above the conductive shield can; and
an electromagnetic wave absorbing thermal conductive sheet formed between the semiconductor element and the cooling member at least through the opening of the conductive shield can,
wherein the electromagnetic wave absorbing thermal conductive sheet covers part of at least one of an upper surface and a lower surface of the conductive shield can and a covering area of the electromagnetic wave absorbing thermal conductive sheet is larger than an area of the opening of the conductive shield can, and
the electromagnetic wave absorbing thermal conductive sheet has higher thermal conductivity in a sheet central portion than in a sheet peripheral portion.
2. The semiconductor device according to claim 1 , wherein the electromagnetic wave absorbing thermal conductive sheet covers part of the upper surface of the conductive shield can.
3. The semiconductor device according to claim 1 , wherein the electromagnetic wave absorbing thermal conductive sheet covers part of each of the upper surface and the lower surface of the conductive shield can.
4. The semiconductor device according to claim 1 , wherein the electromagnetic wave absorbing thermal conductive sheet is made up of a plurality of sheets.
5. The semiconductor device according to claim 1 , wherein the electromagnetic wave absorbing thermal conductive sheet contains fibrous thermal conductive fillers.
6. The semiconductor device according to claim 5 , wherein the fibrous thermal conductive fillers are carbon fibers.
7. The semiconductor device according to claim 6 , wherein the electromagnetic wave absorbing thermal conductive sheet further contains magnetic metal powders.