IP Library › Granted Patent US 12,328,856
Granted Patent B2
US 12,328,856 · App. 17/937,953 · Granted Jun 10, 2025

Component shielding

Inventors: Wen Shian Lin (New Taipei, TW); Chien Hua Hsu (New Taipei, TW); Shihwen Lee (New Taipei, TW); Bing-Feng Wang (New Taipei, TW); Chijer Wang (Taipei, TW)
Assignee: Google LLC
H05K9/0028H05K9/0032H05K9/0037
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Quick Facts
Patent No.
US 12,328,856
App. No.
17/937,953
Granted
Jun 10, 2025
Kind
B2
Abstract

Techniques and apparatuses directed to component shielding are described in this document. A first aspect relates to a system including a printed circuit board (PCB) oriented along a first plane, a device on the PCB, and a component shield having a wall structure oriented perpendicular to the first plane and a cover structure connected to the wall structure. The system includes a housing structure oriented along a second plane that is substantially parallel to the first plane. The first and second planes define a shielded space within which the component shield and the device reside. The system further includes a shielding layer residing at least partially between the cover and housing structures. The shielding layer has an irregular cross-section along a fourth plane perpendicular to at least one of the first or second planes and a third plane. The irregular cross-section includes a protrusion that extends from the third plane.

Claims (32)

1. A system comprising:

a printed circuit board oriented along a first plane, the printed circuit board having a device that extends in a direction away from the first plane and is at least one of capable of producing a radiated signal or is sensitive to a radiated signal produced by another device;

a component shield having a wall structure and a cover structure, the wall structure oriented perpendicular to the first plane, and the cover structure connected to the wall structure and oriented parallel to the first plane;

a housing structure oriented along a second plane, the second plane being substantially parallel to the first plane and the first and second planes defining a shielded space within which the component shield and the device reside; and

a shielding layer, the shielding layer:

disposed in contact with the cover structure of the component shield and with the housing structure;

configured to attenuate radiated signals;

oriented along a third plane substantially parallel with the second plane;

residing in the shielded space; and

having an irregular cross-section along a fourth plane perpendicular to at least one of the first, second, or third planes, the irregular cross-section being at least in a region between the cover structure of the component shield and the housing structure and having a protrusion from the third plane in which the shielding layer is oriented.

2. The system of claim 1 , wherein the protrusion is a partial sphere protruding from the third plane and providing a mechanical resistance to a force between the housing structure and the cover structure.

3. The system of claim 1 , wherein the protrusion is a button protruding from the third plane and providing a mechanical resistance to a force between the housing structure and the cover structure.

4. The system of claim 1 , wherein the protrusion is a semi-spherical shape protruding from the third plane and providing a mechanical resistance to a force between the housing structure and the cover structure.

5. The system of claim 1 , wherein the protrusion includes a void relative to an outer surface of the protrusion and the third plane.

6. The system of claim 1 , wherein the protrusion is solid relative to an outer surface of the protrusion and the third plane.

7. The system of claim 1 , wherein the system is within a mobile communication device.

8. The system of claim 1 , further comprising an antenna and wherein the device is a system-on-chip (SoC) and the antenna is sensitive to radiated signals.

9. The system of claim 1 , wherein the housing structure is a midframe of a mobile communication device.

10. The system of claim 1 , wherein the shielding layer comprises a foil portion and an adhesive portion configured to adhere the foil portion to a portion of the component shield.

11. The system of claim 10 , wherein the foil portion is 50% or more elemental copper.

12. The system of claim 1 , wherein the shielding layer covers all gaps over an aperture defined in the component shield.

13. The system of claim 1 , wherein the protrusion of the shielding layer comprises a plurality of protrusions.

14. A system comprising:

a printed circuit board oriented along a first plane, the printed circuit board having a device that extends in a direction away from the first plane and is at least one of capable of producing a radiated signal or is sensitive to a radiated signal produced by another device;

a component shield having a wall structure and a cover structure, the wall structure oriented perpendicular to the first plane, and the cover structure connected to the wall structure and oriented parallel to the first plane;

a housing structure oriented along a second plane, the second plane being substantially parallel to the first plane and the first and second planes defining a shielded space within which the component shield and the device reside; and

a shielding layer, the shielding layer:

disposed in contact with the cover structure of the component shield and with the housing structure;

configured to attenuate radiated signals;

oriented along a third plane substantially parallel with the second plane;

residing in the shielded space; and

having an irregular cross-section along a fourth plane perpendicular to at least one of the first, second, or third planes, the irregular cross-section being at least in a region between the cover structure of the component shield and the housing structure and having a protrusion from the third plane in which the shielding layer is oriented, the protrusion compressed by contact with the housing structure.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 6, 2023
From: LIN, WEN SHIAN; HSU, CHIEN HUA; LEE, SHIHWEN; WANG, BING-FENG; WANG, CHIJER
To: GOOGLE LLC
Reel/Frame 062598/0301 →
Continuity (2)
Provisional Application 63378189 · Oct 3, 2022
Related Publication 20240114670A1 · Apr 4, 2024
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