IP Library › Granted Patent US 7,982,676
Granted Patent B2
US 7,982,676 · App. 12/289,486 · Granted Jul 19, 2011

Antenna structure for a mobile phone

Assignee: Auden Techno Corp.
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Quick Facts
Patent No.
US 7,982,676
App. No.
12/289,486
Granted
Jul 19, 2011
Kind
B2
Abstract

An antenna structure for a mobile phone to improve its hearing aid compatibility (HAC) character by metal obscuring, the antenna structure mainly is composed of an antenna base board and a copper foil; the antenna base board is provided in a housing of the mobile phone near a sound outputting hole, and a metallic thin layer is made in the housing of the mobile phone in corresponding by position with the antenna base board, the ground surface between the metallic thin layer and a circuit board in the housing of the mobile phone will form an electrically conductive connection. With this structure, distribution of the strength of the electric field of the antenna structure will be improved; thereby the test results for HAC near the sound outputting hole can be evidently improved.

Claims (6)

1. An antenna structure for a mobile phone having an improved hearing aid compatibility (HAC) character, said mobile phone having a sound output hole, said antenna structure being provided in said mobile phone and being connected with a circuit board having a ground surface in a housing of said mobile phone for wireless signal transmission, said antenna structure comprising:

an antenna base board provided in said housing of said mobile phone near said sound output hole;

three insulating pads surrounding three edges inside of said housing of said mobile phone

a metallic thin layer being a copper foil which envelops said antenna base board from outside of said housing of said mobile phone at a location disposed in correspondence with said antenna base board to be in spaced relationship with said antenna base board, said copper foil being composed of a main copper foil and two wing copper foils for enveloping said housing of said mobile phone with respective edges thereof folded upwardly toward vertical outer surfaces of said insulating pads to form a kind of inverse U-shaped envelopment, said circuit board having a grounding line extending out to one of said wing copper foils, in order that said copper foil contacts said grounding line to form an electric conductive connection with said ground surface of said circuit board.

2. The antenna structure for a mobile phone as defined in claim 1 , wherein said metallic thin layer forms an electrically conductive connection with said circuit board having said ground surface.

3. The antenna structure for a mobile phone as defined in claim 1 , wherein a length L, a right side length RL, a width W and a height H of said copper foil positioned on said housing are respectively 40 mm, 35 mm, 60 mm and 13.3 mm.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 12, 2008
From: CHEN, CHUN-HUA; TANG, CHIA-LUN
To: AUDEN TECHNO CORP.
Reel/Frame 021825/0960 →
Continuity (1)
Related Publication 20100103068A1 · Apr 29, 2010