IP Library Assignment 071756/0646
Patent Assignment
Reel/Frame 071756/0646

Change of Address

Recorded: 2025-06-30 Pages: 4
Assignor
DEXERIALS CORPORATION
Executed: 2021-07-13
Assignee
DEXERIALS CORPORATION
1724 SHIMOTSUBOYAMA, SHIMOTSUKE-SHI, TOCHIGI, 323-0194, JAPAN
Covered Properties (24)
Magnetic Sheet, Method for Producing the Magnetic Sheet, Antenna, and Portable Communication Device
Patent: 8,295,786 →
Application: 12/633,393 →
Publication: US 2010/0099365
Thermally Conductive Sheet and Process for Producing Same
Patent: 8,808,607 →
Application: 13/702,438 →
Publication: US 2013/0136895
Thermally Conductive Sheet and Process for Producing Same
Patent: 9,308,695 →
Application: 14/323,313 →
Publication: US 2014/0346710
Thermally Conductive Sheet and Process for Producing Same
Patent: 9,365,001 →
Application: 14/323,423 →
Publication: US 2014/0349067
Heat Conductive Sheet
Application: 14/401,954 →
Publication: US 2015/0166771
Method of Producing Heat Conductive Sheet
Patent: 9,944,840 →
Application: 14/402,195 →
Publication: US 2015/0144316
Method of Producing Heat Conductive Sheet
Application: 14/404,741 →
Publication: US 2015/0118505
Thermally Conductive Sheet
Application: 14/770,794 →
Publication: US 2016/0009963
Thermally Conductive Sheet, Method for Producing Same, and Semiconductor Device
Patent: 9,966,324 →
Application: 14/892,724 →
Publication: US 2016/0104657
Method of Manufacturing Heat Conductive Sheet, Heat Conductive Sheet, and Heat Dissipation Member
Patent: 9,560,791 →
Application: 14/898,858 →
Publication: US 2016/0150680
Method of Manufacturing Heat Conductive Sheet
Patent: 9,536,804 →
Application: 14/899,221 →
Publication: US 2016/0141223
Thermally Conductive Sheet and Method for Producing Thermally Conductive Sheet
Application: 14/962,788 →
Publication: US 2016/0091265
Thermally Conductive Sheet
Patent: 9,437,521 →
Application: 14/989,686 →
Publication: US 2016/0118316
Heat Conductive Sheet and Method for Producing Heat Conductive Sheet
Application: 15/117,580 →
Publication: US 2016/0355000
Multilayer Heat-Conductive Sheet, and Manufacturing Method for Multilayer Heat-Conductive Sheet
Application: 15/257,013 →
Publication: US 2016/0372400
Heat Diffusion Sheet
Application: 15/300,400 →
Publication: US 2017/0141009
Heat Conduction Sheet, Heat Conduction Sheet Manufacture Method, Heat Radiation Member, and Semiconductor Device
Patent: 9,922,901 →
Application: 15/521,426 →
Publication: US 2017/0309542
Thermally Conductive Sheet, Production Method for Thermally Conductive Sheet, Heat Dissipation Member, and Semiconductor Device
Application: 16/072,334 →
Publication: US 2019/0055443
Electromagnetic Wave Absorbing Heat Conductive Sheet, Method for Producing Electromagnetic Wave Absorbing Heat Conductive Sheet, and Semiconductor Device
Application: 16/085,263 →
Publication: US 2019/0080978
Semiconductor Device Having an Electromagnetic Wave Absorbing Thermal Conductive Sheet Between a Semiconductor Element and a Cooling Member
Application: 16/473,249 →
Publication: US 2020/0152581
Semiconductor Device and Method of Producing the Same
Application: 16/973,035 →
Publication: US 2021/0272879
Semiconductor Device and Method of Producing the Same
Application: 16/973,765 →
Publication: US 2021/0225777
Semiconductor Device
Application: 17/041,440 →
Publication: US 2021/0020542
Electronic Device
Application: 17/053,248 →
Publication: US 2021/0296264
Related Assignments (19)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 8, 2009
From: ARAMAKI, KEISUKE; SUGITA, JUNICHIRO; SEKIGUCHI, MORIO
To: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
Reel/Frame 023622/0108 →
Corrective Assignment to Correct the Execution Date for the Second(2ND) Assignor, Sugita, Junichiro, Previously Recorded on Reel 023622 Frame 0108. Assignor(S) Hereby Confirms the Assignment. Feb 15, 2011
From: ARAMAKI, KEISUKE; SUGITA, JUNICHIRO; SEKIGUCHI, MORIO
To: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
Reel/Frame 025792/0858 →
Assignment of Assignor's Interest Feb 8, 2013
From: USUI, HIROYUKI; ARAMAKI, KEISUKE
To: DEXERIALS CORPORATION
Reel/Frame 029786/0651 →
Change of Name Feb 8, 2013
From: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
To: DEXERIALS CORPORATION
Reel/Frame 029778/0641 →
Assignment of Assignor's Interest Nov 18, 2014
From: ARAMAKI, KEISUKE; ISHII, TAKUHIRO
To: DEXERIALS CORPORATION
Reel/Frame 034198/0662 →
Assignment of Assignor's Interest Nov 19, 2014
From: ARAMAKI, KEISUKE
To: DEXERIALS CORPORATION
Reel/Frame 034209/0978 →
Assignment of Assignor's Interest Dec 1, 2014
From: ARAMAKI, KEISUKE
To: DEXERIALS CORPORATION
Reel/Frame 034288/0615 →
Assignment of Assignor's Interest Aug 26, 2015
From: SUGITA, JUNICHIRO
To: DEXERIALS CORPORATION
Reel/Frame 036431/0337 →
Assignment of Assignor's Interest Nov 20, 2015
From: ARAMAKI, KEISUKE; YOSHINARI, ATSUYA; ISHII, TAKUHIRO; UCHIDA, SHIN-ICHI
To: DEXERIALS CORPORATION
Reel/Frame 037101/0289 →
Assignment of Assignor's Interest Dec 8, 2015
From: ARAMAKI, KEISUKE
To: DEXERIALS CORPORATION
Reel/Frame 037241/0545 →
Assignment of Assignor's Interest Dec 16, 2015
From: ARAMAKI, KEISUKE; YOSHINARI, ATSUYA; ISHII, TAKUHIRO; UCHIDA, SHINICHI
To: DEXERIALS CORPORATION
Reel/Frame 037305/0083 →
Assignment of Assignor's Interest Dec 17, 2015
From: ARAMAKI, KEISUKE; YOSHINARI, ATSUYA; ISHII, TAKUHIRO; UCHIDA, SHINICHI
To: DEXERIALS CORPORATION
Reel/Frame 037315/0016 →
Assignment of Assignor's Interest Feb 11, 2016
From: ARAMAKI, KEISUKE; ISHII, TAKUHIRO; ITO, MASAHIKO; UCHIDA, SHINICHI
To: DEXERIALS CORPORATION
Reel/Frame 037711/0501 →
Assignment of Assignor's Interest Aug 9, 2016
From: MATSUSHIMA, MASAYUKI
To: DEXERIALS CORPORATION
Reel/Frame 039384/0953 →
Assignment of Assignor's Interest Sep 29, 2016
From: NAGASHIMA, MINORU; HIYAMA, TERUO
To: DEXERIALS CORPORATION
Reel/Frame 039893/0165 →
Assignment of Assignor's Interest Oct 14, 2016
From: SUGITA, JUNICHIRO
To: DEXERIALS CORPORATION
Reel/Frame 040354/0745 →
Assignment of Assignor's Interest Apr 24, 2017
From: ARAMAKI, KEISUKE; KANAYA, HIROKI; DAIMON, MASAHIDE
To: DEXERIALS CORPORATION
Reel/Frame 042128/0224 →
Assignment of Assignor's Interest Aug 1, 2025
From: DEXERIALS CORPORATION
To: SEKISUI CHEMICAL CO., LTD.
Reel/Frame 072311/0985 →
Nunc Pro Tunc Assignment Aug 12, 2025
From: DEXERIALS CORPORATION
To: SEKISUI CHEMICAL CO., LTD.
Reel/Frame 071999/0883 →