Thermally conductive sheet
A thermally conductive sheet in which an adhesive thermally conductive layer and a non-adhesive resin layer are stacked. The adhesive thermally conductive layer includes an acrylic resin formed by curing an acrylic compound and a thermally conductive filler, a glass transition temperature of the acrylic resin is from −80 to 15° C., a tack property of the adhesive thermally conductive layer is higher than a tack property of the non-adhesive resin layer, the tack property of the non-adhesive resin layer is from 6 to 30 kN/m2. The non-adhesive resin layer has a glass transition temperature from 60 to 110° C. The tack property is measured by pressing probe on a layer and peeling the probe under conditions of pressing speed of 30 mm/min, peeling speed of 120 mm/min, load of 196 g, pressing time of 5.0 sec, pulling distance of 5 mm, probe heating of 40° C. and sheet stage heating of 40° C.
1. A thermally conductive sheet comprising an adhesive thermally conductive layer and a non-adhesive resin layer which are stacked between a first release film layer and a second release film layer, each release layer being formed from one of a polyethylene terephthalate, polyethylene naphthalate, polyolefin, or glassine paper layer,
wherein the first release film layer or the second release film layer is in direct contact with the non-adhesive resin layer;
wherein the adhesive thermally conductive layer comprises an acrylic resin formed by curing a composition comprising:
an acrylic compound and
a thermally conductive filler,
wherein a glass transition temperature of the acrylic resin is from −80 to 15° C., a tack property of the adhesive thermally conductive layer is higher than a tack property of the non-adhesive resin layer, the tack property of the non-adhesive resin layer is from 6 to 30 kN/m 2 ,
the non-adhesive resin layer has a glass transition temperature from 60 to 110° C., wherein a resin forming the non-adhesive resin layer is selected from a polyvinyl butyral resin, a polyester resin and a urethane resin, wherein the resin forming the non-adhesive resin layer is incompatible with the acrylic resin, wherein the non-adhesive resin layer has a low adhesion property, and wherein
the tack property is measured as a probe tack by pressing an aluminum cylindrical probe on the adhesive thermally conductive layer or the non-adhesive resin layer and peeling the aluminum cylindrical probe from the adhesive thermally conductive layer or the non-adhesive resin layer under conditions of pressing speed of 30 mm/min, peeling speed of 120 mm/min, load of 196 g, pressing time of 5.0 sec, pulling distance of 5 mm, probe heating of 40° C. and sheet stage heating of 40° C.
2. The thermally conductive sheet as claimed in claim 1 , wherein a heat conductivity in a thickness direction of the thermally conductive sheet is 1.5 W/m·K or more.
3. The thermally conductive sheet as claimed in claim 1 , wherein the acrylic compound forming the adhesive thermally conductive layer is a monofunctional (meth)acrylate monomer.
4. The thermally conductive sheet as claimed in claim 1 , wherein the adhesive thermally conductive layer comprises from 20 to 80 parts by weight of one or more plasticizers selected from an adipic acid compound, a sebacic acid compound, a phosphoric acid compound, a castor oil compound, an oleic acid compound and an acrylic acid compound based on 100 parts by weight of a monomer unit of the acrylic compound.
5. The thermally conductive sheet as claimed in claim 2 , wherein the acrylic compound forming the adhesive thermally conductive layer is a monofunctional (meth)acrylate monomer.
6. The thermally conductive sheet as claimed in claim 2 , wherein the adhesive thermally conductive layer comprises from 20 to 80 parts by weight of one or more plasticizers selected from an adipic acid compound, a sebacic acid compound, a phosphoric acid compound, a castor oil compound, an oleic acid compound and an acrylic acid compound based on 100 parts by weight of a monomer unit of the acrylic compound.
7. A thermally conductive sheet comprising an adhesive thermally conductive layer and a non-adhesive resin layer which are stacked between a first release film layer and a second release film layer, each release layer being formed from one of a polyethylene terephthalate, polyethylene naphthalate, polyolefin, or glassine paper layer,
wherein the first release film layer or the second release film layer is in direct contact with the non-adhesive resin layer;
wherein the adhesive thermally conductive layer comprises an acrylic resin formed by curing a composition comprising:
an acrylic compound and
a thermally conductive filler,
wherein a glass transition temperature of the acrylic resin is from −80 to 15° C., a tack property of the adhesive thermally conductive layer is higher than a tack property of the non-adhesive resin layer,
the non-adhesive resin layer has a glass transition temperature from 60 to 110° C.,
a resin forming the non-adhesive resin layer is incompatible with the acrylic resin,
the non-adhesive resin layer has a low adhesion property,
a T-peel strength between the non-adhesive resin layer and the adhesive thermally conductive layer is 0.2 N/cm or more,
the tack property is measured as a probe tack by pressing an aluminum cylindrical probe on the adhesive thermally conductive layer or the non-adhesive resin layer and peeling the aluminum cylindrical probe from the adhesive thermally conductive layer or the non-adhesive resin layer under conditions of pressing speed of 30 mm/min, peeling speed of 120 mm/min, load of 196 g, pressing time of 5.0 sec, pulling distance of 5 mm, probe heating of 40° C. and sheet stage heating of 40° C., and
wherein a resin forming the non-adhesive resin layer is selected from a polyvinyl butyral resin, a polyester resin and a urethane resin.
8. The thermally conductive sheet as claimed in claim 7 , wherein a heat conductivity in a thickness direction of the thermally conductive sheet is 1.5 W/m·K or more.
9. The thermally conductive sheet as claimed in claim 7 , wherein the acrylic compound forming the adhesive thermally conductive layer is a monofunctional (meth)acrylate monomer.
10. The thermally conductive sheet as claimed in claim 8 , wherein the acrylic compound forming the adhesive thermally conductive layer is a monofunctional (meth)acrylate monomer.
11. The thermally conductive sheet as claimed in claim 8 , wherein the adhesive thermally conductive layer comprises from 20 to 80 parts by weight of one or more plasticizers selected from an adipic acid compound, a sebacic acid compound, a phosphoric acid compound, a castor oil compound, an oleic acid compound and an acrylic acid compound based on 100 parts by weight of a monomer unit of the acrylic compound.
12. The thermally conductive sheet as claimed in claim 7 , wherein the adhesive thermally conductive layer comprises from 20 to 80 parts by weight of one or more plasticizers selected from an adipic acid compound, a sebacic acid compound, a phosphoric acid compound, a castor oil compound, an oleic acid compound and an acrylic acid compound based on 100 parts by weight of a monomer unit of the acrylic compound.