Heat conduction sheet, heat conduction sheet manufacture method, heat radiation member, and semiconductor device
A thermally conductive sheet including a sheet body that is a cured product of a thermally conductive resin composition including a binder resin and carbon fibers covered with insulating coating films, wherein the carbon fibers exposed on a surface of the sheet body are not covered with the insulating coating films and are covered with a component of the binder resin.
1. A thermally conductive sheet comprising
a sheet body that is a cured product of a thermally conductive resin composition including a binder resin and carbon fibers covered with insulating coating films,
wherein the carbon fibers exposed on a surface of the sheet body are not covered with the insulating coating films and are covered with a component of the binder resin.
2. The thermally conductive sheet according to claim 1 , wherein a surface of the thermally conductive sheet includes convex portions derived from the carbon fibers exposed on the surface of the sheet body.
3. The thermally conductive sheet according to claim 1 , wherein the insulating coating films covering the carbon fibers are silicon oxide, and
wherein an average thickness of the insulating coating films is 50 nm or more but less than 100 nm as observed through cross-sectional TEM observation.
4. The thermally conductive sheet according to claim 1 , wherein a Shore OO hardness of the thermally conductive sheet is 70 or lower as measured by a measurement method according to ASTM-D2240.
5. The thermally conductive sheet according to claim 1 , wherein the sheet body includes thermally conductive fillers.
6. The thermally conductive sheet according to claim 1 , wherein the surface of the sheet body is covered with an uncured component of the binder resin.
7. A method for producing a thermally conductive sheet, the method comprising:
molding a thermally conductive resin composition, including a binder resin and carbon fibers covered with insulating coating films, into a predetermined shape and curing the thermally conductive resin composition, to thereby obtain a molded product of the thermally conductive resin composition;
cutting the molded product into a sheet to obtain a sheet body; and
covering the carbon fibers exposed on a surface of the sheet body with a component of the binder resin,
wherein in the cutting, the insulating coating films covering the carbon fibers exposed on the surface of the sheet body are removed.
8. The method for producing a thermally conductive sheet according to claim 7 , wherein the covering is pressing the sheet body to cover the surface of the sheet body and the carbon fibers exposed from the surface of the sheet body with an uncured component of the binder resin oozed out from the sheet body.
9. The method for producing a thermally conductive sheet according to claim 7 , wherein the covering is leaving the sheet body to stand to cover the surface of the sheet body and the carbon fibers exposed from the surface of the sheet body with an uncured component of the binder resin oozed out from the sheet body.
10. The method for producing a thermally conductive sheet according to claim 7 , wherein the thermally conductive resin composition is extruded and charged into a hollow mold, and the thermally conductive resin composition is thermally cured to form the molded product where the carbon fibers are randomly oriented with respect to a direction of extrusion.
11. A heat-dissipating member comprising:
a heat spreader configured to dissipate heat generated by an electronic part; and
the thermally conductive sheet according to claim 1 , the thermally conductive sheet being disposed on the heat spreader and held between the heat spreader and the electronic part.
12. A semiconductor device comprising:
a semiconductor element;
a heat spreader configured to dissipate heat generated by the semiconductor element; and
the thermally conductive sheet according to claim 1 , the thermally conductive sheet being disposed on the heat spreader and held between the heat spreader and the semiconductor element.
13. The semiconductor device according to claim 12 , further comprising a heat sink,
wherein a thermally conductive sheet is held between the heat spreader and the heat sink,
wherein the thermally conductive sheet held between the heat spreader and the heat sink comprises a sheet body that is a cured product of a thermally conductive resin composition including a binder resin and carbon fibers covered with insulating coating films, and
wherein the carbon fibers exposed on a surface of the sheet body are not covered with the insulating coating films and are covered with a component of the binder resin.