IP Library Assignment 042128/0224
Patent Assignment
Reel/Frame 042128/0224

Assignment of Assignor's Interest

Recorded: 2017-04-24 Pages: 5
Assignors
ARAMAKI, KEISUKE
Executed: 2017-04-03
KANAYA, HIROKI
Executed: 2017-04-15
DAIMON, MASAHIDE
Executed: 2017-04-06
Assignee
DEXERIALS CORPORATION
GATE CITY OSAKI, EAST TOWER 8TH FLOOR, 11-2, OSAKI 1-CHOME, SHINAGAWA-KU, TOKYO, 141-0032, JAPAN
Covered Property (1)
Heat Conduction Sheet, Heat Conduction Sheet Manufacture Method, Heat Radiation Member, and Semiconductor Device
Patent: 9,922,901 →
Application: 15/521,426 →
Publication: US 2017/0309542
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address Jun 30, 2025
From: DEXERIALS CORPORATION
To: DEXERIALS CORPORATION
Reel/Frame 071756/0646 →
Nunc Pro Tunc Assignment Aug 12, 2025
From: DEXERIALS CORPORATION
To: SEKISUI CHEMICAL CO., LTD.
Reel/Frame 071999/0883 →