IP Library Granted Patent US 8,808,607
Granted Patent B2
US 8,808,607 · App. 13/702,438 · Granted Aug 19, 2014

Thermally conductive sheet and process for producing same

Inventors: Hiroyuki Usui (Tochigi, JP); Keisuke Aramaki (Tochigi, JP)
Assignee: Dexerials Corporation
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Quick Facts
Patent No.
US 8,808,607
App. No.
13/702,438
Granted
Aug 19, 2014
Kind
B2
Abstract

A thermally conductive sheet has cut surfaces with low surface roughness and hence shows reduced thermal resistance at the interfaces, and high thermal conductivity in the thickness direction. Thus, the thermally conductive sheet can be interposed between any of various heat sources and a radiation member. The process for producing the thermally conductive sheet includes at least: an extrusion molding step in which a thermally conductive composition containing a polymer, an anisotropic thermally conductive filler, and a filler is extruded with an extruder to thereby mold an extrusion-molded product in which the anisotropic thermally conductive filler has been oriented along the extrusion direction; a curing step in which the extrusion-molded product is cured to obtain a cured object; and a slicing step in which the cured object is sliced into a given thickness with an ultrasonic cutter in the direction perpendicular to the extrusion direction.

Claims (9)

1. A method for producing a thermally conductive sheet comprising at least the steps of:

extruding a thermally conductive composition containing a polymer, an anisotropic thermally conductive filler and another filler through an extruder, thereby extrusion molding an extrusion molded product in which the anisotropic thermally conductive filler is oriented along the extrusion direction;

curing the extrusion molded product to form a cured object; and

cutting the cured object in a direction perpendicular to the extrusion direction into a given thickness with an ultrasonic cutter,

wherein the anisotropic thermally conductive filler is prepared as carbon fibers and has an average fiber length of 100 μm or more, and

the other filler is prepared as spherical alumina particles and has an average particle size in a range from 1 μm to 40 μm.

2. The method for producing a thermally conductive sheet according to claim 1 , wherein the anisotropic thermally conductive filler has a content of 16% by volume to 25% by volume in the thermally conductive composition.

3. The method for producing a thermally conductive sheet according to claim 1 , wherein the polymer is a silicone resin.

4. The method for producing a thermally conductive sheet according to claim 1 , wherein the other filler has an average particle size in a range from 3 μm to 10 μm.

Assignments (3)
NUNC PRO TUNC ASSIGNMENT Recorded Aug 12, 2025
From: DEXERIALS CORPORATION
To: SEKISUI CHEMICAL CO., LTD.
Reel/Frame 071999/0883 →
CHANGE OF ADDRESS Recorded Jun 30, 2025
From: DEXERIALS CORPORATION
To: DEXERIALS CORPORATION
Reel/Frame 071756/0646 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 8, 2013
From: USUI, HIROYUKI; ARAMAKI, KEISUKE
To: DEXERIALS CORPORATION
Reel/Frame 029786/0651 →
Priority Claims (3)
JP 2010-138334 · Jun 17, 2010 · national
JP 2010-138417 · Jun 17, 2010 · national
JP 2011-079976 · Mar 31, 2011 · national
Continuity (1)
Related Publication 20130136895A1 · May 30, 2013