IP Library Granted Patent US 10,864,709
Granted Patent B2
US 10,864,709 · App. 15/117,580 · Granted Dec 15, 2020

Heat conductive sheet and method for producing heat conductive sheet

Inventor: Masayuki Matsushima (Tochigi, JP)
Assignee: DEXERIALS CORPORATION
B32B27/30B32B7/06B32B7/12B32B27/08B32B27/16B32B27/20B32B27/302B32B27/306B32B27/308H01L23/3737B32B2264/102B32B2264/105B32B2270/00B32B2274/00B32B2305/72B32B2307/302B32B2307/50B32B2307/54B32B2307/748B32B2457/00H01L21/4871H01L23/3735H01L23/42H01L2924/0002
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Quick Facts
Patent No.
US 10,864,709
App. No.
15/117,580
Granted
Dec 15, 2020
Kind
B2
Abstract

A heat conductive sheet having excellent adhesion between an acrylic resin layer and a supporting sheet is provided. The heat conductive sheet includes a heat conductive resin layer including a heat conductive acrylic resin composition; and a supporting resin layer (supporting sheet) containing a polyvinyl acetal resin and a styrene-vinyl isoprene block copolymer. Crosslinking of the supporting sheet with acrylic monomers of the acrylic heat conductive resin layer enables improvements in adhesion between the heat conductive resin layer and the supporting sheet.

Claims (22)

1. A heat conductive sheet comprising:

a heat conductive resin layer comprising a heat conductive acrylic resin composition; and

a supporting resin layer containing a polyvinyl acetal resin and a styrene-vinyl isoprene block copolymer, wherein:

the polyvinyl acetal resin and the styrene-vinyl isoprene block copolymer are blended at a mass ratio from 9:1 to 7:3, and

a degree of acetalization of the polyvinyl acetal resin is in a range of from 50 to 90 mol % wherein the heat conductive resin layer overlays with the supporting resin layer along a thickness direction of the heat conductive sheet, and at least a portion of an edge of the heat conductive resin layer is in contact with at least a portion of an edge of the supporting resin layer.

2. The heat conductive sheet according to claim 1 , wherein the polyvinyl acetal resin is polyvinyl acetal or polyvinyl butyral.

3. The heat conductive sheet according to claim 2 , wherein the polyvinyl acetal resin has a molecular weight from 5×10 4 to 20×10 4 .

4. The heat conductive sheet according to claim 2 , wherein the polyvinyl acetal resin has a glass transition temperature from 50 to 150° C.

5. The heat conductive sheet according to claim 2 , wherein the styrene-vinyl isoprene block copolymer has a glass transition temperature from −40 to +40° C.

6. The heat conductive sheet according to claim 1 , wherein the polyvinyl acetal resin has a molecular weight from 5×10 4 to 20×10 4 .

7. The heat conductive sheet according to claim 6 , wherein the polyvinyl acetal resin has a glass transition temperature from 50 to 150° C.

8. The heat conductive sheet according to claim 6 , wherein the styrene-vinyl isoprene block copolymer has a glass transition temperature from −40 to +40° C.

9. The heat conductive sheet according to claim 1 , wherein the polyvinyl acetal resin has a glass transition temperature from 50 to 150° C.

10. The heat conductive sheet according to claim 9 , wherein the styrene-vinyl isoprene block copolymer has a glass transition temperature from −40 to +40° C.

11. The heat conductive sheet according to claim 1 , wherein the styrene-vinyl isoprene block copolymer has a glass transition temperature from −40 to +40° C.

12. The heat conductive sheet according to claim 1 , wherein the styrene-vinyl isoprene block copolymer has a styrene content from 10% to 30%.

13. The heat conductive sheet according to claim 12 , wherein the polyvinyl acetal resin and the styrene-vinyl isoprene block copolymer are blended at a mass ratio from 8.5:1.5 to 8:2.

14. A method for manufacturing a heat conductive sheet comprising the steps of:

forming a supporting resin layer by mixing and sheet-forming a polyvinyl acetal resin and a styrene-vinyl isoprene block copolymer; and

forming a heat conductive resin layer by curing a heat conductive acrylic resin composition in a state of contact with the supporting resin layer, wherein:

the polyvinyl acetal resin and the styrene-vinyl isoprene block copolymer are blended at a mass ratio from 9:1 to 7:3, and

a degree of acetalization of the polyvinyl acetal resin is in a range of from 50 to 90 mol % wherein the heat conductive resin layer overlays with the supporting resin layer along a thickness direction of the heat conductive sheet, and at least a portion of an edge of the heat conductive resin layer is in contact with at least a portion of an edge of the supporting resin layer.

Assignments (4)
NUNC PRO TUNC ASSIGNMENT Recorded Aug 12, 2025
From: DEXERIALS CORPORATION
To: SEKISUI CHEMICAL CO., LTD.
Reel/Frame 071999/0883 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 1, 2025
From: DEXERIALS CORPORATION
To: SEKISUI CHEMICAL CO., LTD.
Reel/Frame 072311/0985 →
CHANGE OF ADDRESS Recorded Jun 30, 2025
From: DEXERIALS CORPORATION
To: DEXERIALS CORPORATION
Reel/Frame 071756/0646 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 9, 2016
From: MATSUSHIMA, MASAYUKI
To: DEXERIALS CORPORATION
Reel/Frame 039384/0953 →
Priority Claims (1)
JP 2014-074776 · Mar 31, 2014 · national
Continuity (1)
Related Publication 20160355000A1 · Dec 8, 2016