Thermally conductive sheet and method for manufacturing thermally conductive sheet
A thermally conductive sheet having a binder resin, a first thermally conductive filler, and a second thermally conductive filler, wherein the first thermally conductive filler and the second thermally conductive filler are dispersed in the binder resin, and the specific permittivity and the thermal conductivity are different in the thickness direction B and the surface direction A of the thermally conductive sheet. A thermally conductive sheet includes step A of preparing a resin composition for forming a thermally conductive sheet by dispersing a first thermally conductive filler and a second thermally conductive filler in a binder resin, step B of forming a molded block from the resin composition for forming a thermally conductive sheet, and step C of slicing the molded block into a sheet and obtaining a thermally conductive sheet having different relative permittivity and thermal conductivity in the thickness direction and the surface direction.
1. A thermally conductive sheet containing: a binder resin; a first thermally conductive filler which is a scaly boron nitride; and a second thermally conductive filler comprising a non-scaly and non-fibrous thermally conductive filler, the first thermally conductive filler and the second thermally conductive filler being dispersed in the binder resin,
wherein relative permittivity and thermal conductivity in the thickness direction of the thermally conductive sheet and relative permittivity and thermal conductivity in the surface direction of the thermally conductive sheet are different,
wherein the thermally conductive sheet contains no carbon fibers,
wherein the binder resin comprises a two-part addition reaction type silicone resin prepared by curing a silicone having an alkenyl group as a main component with a curing agent having a hydrosilyl group,
wherein the first thermally conductive filler is oriented in the thickness direction of the thermally conductive sheet,
wherein a content of the first thermally conductive filler is 20 to 35% by volume, and
wherein the second thermally conductive filler comprises aluminum nitride particles and spherical alumina particles, and at least one of (i) a content of the spherical alumina particles is 10 to 25% by volume and (ii) a content of the aluminum nitride particles is 10 to 25% by volume.
2. The thermally conductive sheet according to claim 1 , wherein the first thermally conductive filler has an average particle size of 20 to 100 μm.
3. The thermally conductive sheet according to claim 1 , wherein the spherical alumina particles have an average particle size of 1 to 3 μm.
4. The thermally conductive sheet according to claim 1 , wherein the content of the spherical alumina particles is 10 to 25% by volume.
5. The thermally conductive sheet according to claim 1 wherein the aluminum nitride particles have an average particle size of 1 to 5 μm.
6. The thermally conductive sheet according to claim 1 , wherein the content of the aluminum nitride particles is 10 to 25% by volume.
7. The thermally conductive sheet according to claim 1 , wherein a thermal conductivity in an orientation direction of the first thermally conductive filler is twice or more of a thermal conductivity in a non-orientation direction of the first thermally conductive filler.
8. An electronic device comprising:
a heat-generating element;
a heat-dissipating element;
the thermally conductive sheet according to claim 1 and disposed between the heat-generating element and the heat-dissipating element.
9. The thermally conductive sheet according to claim 1 , wherein no fibers are present.