Organopolysiloxane cured product film and usage, manufacturing method, and manufacturing apparatus therefor
Provided is: an organopolysiloxane cured film that is superior as a thin film and, in terms of flatness, has significantly superior smoothness and flatness at the film surface, in addition to generally having high dielectric breakdown strength against a load voltage; along with a usage and manufacturing method therefor. The organopolysiloxane cured film, in which an arithmetic average height (Sa) of the film surface is less than 0.50 μm, while an average thickness at the center of the film is within a range of 1 to 20 μm. It is possible to obtain such a film by a manufacturing method including a die coating step in which a slot die is used to coat a curable organopolysiloxane composition on a continuously traveling substrate supported between a pair of support rolls by means of a tension support system.
1 . An organopolysiloxane cured film in which an arithmetic average height (Sa) of the film surface is less than 0.50 μm, while an average thickness at the center of the film is within a range of 1 to 20 μm;
wherein the organopolysiloxane cured film is obtained by curing a curable organopolysiloxane composition comprising:
(A) an organopolysiloxane with at least two curing reactive groups having a carbon-carbon double bond in a molecule;
(B) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule in an amount in which the silicon-bonded hydrogen atoms are within a range of 0.1 to 2.5 mols per 1 mol of carbon-carbon double bonds in component (A);
(C) an effective amount of a hydrosilylation reaction catalyst;
(D1) reinforcing fine particles or a composite thereof having an average BET specific surface area of greater than 100 m 2 /g that are surface treated with one or more types of organic silicon compounds; and
(D2) reinforcing fine particles or a composite thereof having an average BET specific surface area within a range of 10 to 100 m 2 /g that are surface treated with one or more types of the organic silicon compounds, where the one or more types of the organic silicon compounds are the same as or different from the one or more types of organic silicon compounds used to treat component (D1);
wherein a portion or all of component (A) or component (B) is an organopolysiloxane or an organohydrogenpolysiloxane, respectively, having a high dielectric functional group selected from: a) halogen atoms and groups containing a halogen atom; b) groups containing a nitrogen atom; c) groups containing an oxygen atom; d) heterocyclic groups; e) groups containing a boron atom; f) groups containing phosphorus; and g) groups containing a sulfur atom;
wherein the mass ratio of component (D1) and component (D2) is within a range of 50:50 to 99:1;
wherein the total viscosity of the curable organopolysiloxane composition measured at 25° C. and a shear rate of 10.0 (S −1 ) is within the range of 1,000 to 100,000 mPa·s; and
wherein the organopolysiloxane cured film has the following mechanical properties measured when heated and molded into a sheet having a thickness of 2.0 mm, based on JIS K 6249:
(1) the Young's modulus (MPa) at room temperature is within a range of 0.1 to 2.5 MPa;
(2) the tear strength (N/mm) at room temperature is within a range of 2 N/mm or higher;
(3) the tensile strength (MPa) at room temperature is within a range of 2 MPa or higher; and
(4) the elongation at break (%) is within a range of 200 to 1000%.
2 . The organopolysiloxane cured film according to claim 1 , wherein the average thickness at the center of the film is within a range of 1 to 10 μm.
3 . The organopolysiloxane cured film according to claim 1 , wherein the film is substantially free of organic solvents.
4 . The organopolysiloxane cured film according to claim 1 , wherein the mass ratio of component (D1) and component (D2) is within a range of 70:30 to 97:3.
5 . The organopolysiloxane cured film according to claim 1 , wherein the curable organopolysiloxane composition is a solvent-free or low-solvent type composition.
6 . An electronic material or a member for a display device, comprising the organopolysiloxane cured film according to claim 1 .
7 . A laminated body having a structure in which the organopolysiloxane cured film according to claim 1 is laminated onto a sheet-like substrate provided with a release layer.
8 . An electronic component or display device, comprising the organopolysiloxane cured film according to claim 1 .
9 . A manufacturing method for the organopolysiloxane cured film according to claim 1 , comprising a die coating step in which a slot die is used to coat a curable organopolysiloxane composition on a continuously traveling substrate supported between a pair of support rolls.
10 . The manufacturing method for the organopolysiloxane cured film according to claim 9 , wherein the substrate is a film-like substrate having a release layer.
11 . The manufacturing method for the organopolysiloxane cured film according to claim 9 , comprising coating the curable organopolysiloxane composition using the slot die onto the substrate, then curing the curable organopolysiloxane composition.
12 . The manufacturing method for the organopolysiloxane cured film according to claim 9 , wherein the curable organopolysiloxane composition is a multi-component composition, further comprising a mixing step for preparing the curable organopolysiloxane composition by mixing each component via a stirring device using mechanical force, as a pre-step to feeding the curable organopolysiloxane composition into the slot die.
13 . The manufacturing method for the organopolysiloxane cured film according to claim 12 , wherein the stirring device using mechanical force is a static mixer and the mixing step for preparing the curable organopolysiloxane composition and the step of feeding the curable organopolysiloxane composition into the slot die are continuous.
14 . The manufacturing method for the organopolysiloxane cured film according to claim 9 , wherein the curable organopolysiloxane composition is a solvent-free or low-solvent type composition that does not include a step involving dilution with a solvent.
15 . The manufacturing method for the organopolysiloxane cured film according to claim 10 , including a step involving curing the curable organopolysiloxane composition in a state sandwiched between separators having the release layer.
16 . A manufacturing device for the organopolysiloxane cured film according to claim 1 , the manufacturing device comprising:
at least one pair of support rolls;
a continuously traveling substrate supported between the pair of support rolls via a tension support system;
a slot die for coating a curable organopolysiloxane composition on the substrate; and
a stirring and mixing device using mechanical force for feeding the curable organopolysiloxane composition into the slot die.
17 . The organopolysiloxane cured film according to claim 1 , wherein component (A) is an organopolysiloxane mixture comprising:
(a1) a straight chain or branched chain organopolysiloxane having an alkenyl group only at an end of a molecular chain; and
(a2) an organopolysiloxane resin comprising an alkenyl group having at least one branched siloxane unit.
18 . The organopolysiloxane cured film according to claim 1 , wherein the arithmetic average height (Sa) of the film surface is within a range of 0.01 to 0.50 μm.
19 . The organopolysiloxane cured film according to claim 1 , wherein the organopolysiloxane cured film is manufactured by coating the curable organopolysiloxane composition on a continuously traveling substrate supported between a pair of support rolls via a tension support system with use of a slot die.
20 . The organopolysiloxane cured film according to claim 19 , wherein the force between the support rolls is within a range of from 5 to 150 kg/250 mm per unit width.