THERMALLY CONDUCTIVE COMPOSITION AND METHOD FOR PRODUCING THE SAME
A thermally conductive composition contains a base polymer, an adhesive polymer, and thermally conductive particles. A thermal conductivity of the thermally conductive composition is 0.3 W/m·K or more. The thermally conductive particles include inorganic particles (a) with a specific surface area of 1 m 2 /g or less. The inorganic particles (a) are coated with the adhesive polymer. The production method includes a first mixing process of mixing the adhesive polymer and the inorganic particles (a) with a specific surface area of 1 m 2 /g or less so that the inorganic particles (a) are coated with the adhesive polymer, a second mixing process of adding and mixing the base polymer; and a curing process. Thus, the present invention provides a thermally conductive composition that has high thermal conductive properties, a high compression repulsive force, and less interfacial debonding resulting from stress, and a method for producing the thermally conductive composition.
1 . A thermally conductive composition comprising:
a base polymer, an adhesive polymer, and thermally conductive particles,
wherein a thermal conductivity of the thermally conductive composition is 0.3 W/m·K or more,
the thermally conductive particles include inorganic particles (a) with a specific surface area of 1 m 2 /g or less,
the inorganic particles (a) are coated with the adhesive polymer, and
the adhesive polymer contains a methyl hydrogen polysiloxane, an epoxy group-containing alkyltrialkoxysilane, and a cyclic polysiloxane oligomer.
2 . The thermally conductive composition according to claim 1 , wherein the base polymer is a silicone polymer.
3 . The thermally conducive composition according to claim 1 , wherein a tensile lap-shear strength of the adhesive polymer with respect to an aluminum plate is 50 N/cm 2 or more.
4 . (canceled)
5 . The thermally conductive composition according to claim 1 , wherein the base polymer is an addition curable silicone polymer.
6 . The thermally conductive composition according to claim 1 , further comprising a silicone oil.
7 . The thermally conductive composition according to claim 1 , wherein the thermally conductive particles are composed of at least one selected from a metal oxide, a metal hydroxide, a metal nitride, and silica.
8 . The thermally conductive composition according to claim 1 , further comprising inorganic particles (b) with a specific surface area of more than 1 m 2 /g.
9 . The thermally conductive composition according to claim 8 , wherein the inorganic particles (b) are surface treated with a silane compound, a titanate compound, an aluminate compound, or partial hydrolysates thereof.
10 . The thermally conductive composition according to claim 1 , wherein the thermally conductive composition is in the form of a sheet.
11 . The thermally conductive composition according to claim 1 , wherein an amount of the adhesive polymer is 5 to 35 parts by weight with respect to 100 parts by weight of the base polymer.
12 . A method for producing a thermally conductive composition comprising a base polymer, an adhesive polymer, and thermally conductive particles,
wherein a thermal conductivity of the thermally conductive composition is 0.3 W/m·K or more,
the thermally conductive particles include inorganic particles (a) with a specific surface area of 1 m2/g or less,
the inorganic particles (a) are coated with the adhesive polymer, and
the adhesive polymer contains a methyl hydrogen polysiloxane, an epoxy group-containing alkyltrialkoxysilane, and a cyclic polysiloxane oligomer,
the method comprising:
a first mixing process of mixing the adhesive polymer and the inorganic particles (a) with a specific surface area of 1 m 2 /g or less so that the inorganic particles (a) are coated with the adhesive polymer;
a second mixing process of adding and mixing the base polymer; and
a curing process.
13 . The method according to claim 12 , wherein inorganic particles (b) with a specific surface area of more than 1 m 2 /g are added in the second mixing process.
14 . The method according to claim 12 , wherein an amount of the adhesive polymer is 5 to 35 parts by weight with respect to 100 parts by weight of the base polymer.
15 . The method according to claim 12 , wherein the base polymer is a silicone polymer.
16 . The method according to claim 12 , wherein the base polymer is an addition curable silicone polymer.
17 . The method according to claim 12 , wherein the thermally conductive composition further comprises a silicone oil.
18 . The method according to claim 12 , wherein the thermally conductive particles are composed of at least one selected from a metal oxide, a metal hydroxide, a metal nitride, and silica.
19 . The method according to claim 12 , wherein the thermally conductive composition is formed into a sheet.
20 . The method according to claim 12 , wherein a tensile lap-shear strength of the adhesive polymer with respect to an aluminum plate is 50 N/cm2 or more.