IP Library Granted Patent US 12,127,351
Granted Patent B2
US 12,127,351 · App. 17/433,649 · Granted Oct 22, 2024

Method and assembly for board to board connection of active devices

Inventor: David R. Rolston (Beaconsfield, CA)
Assignee: Smiths Interconnect Canada Inc.
H05K3/365H01L25/0657
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Quick Facts
Patent No.
US 12,127,351
App. No.
17/433,649
Granted
Oct 22, 2024
Kind
B2
Abstract

A method and assembly for board to board connection of active devices are described herein. The assembly comprises first and second superposed active devices, a first interfacing member electrically coupled to the first active device, and a flexible printed wiring board having a first end and a second end, the first end electrically coupled to the first interfacing member.

Claims (17)

1. An assembly comprising:

a first active device;

a second active device stacked with the first active device;

a first interfacing member electrically coupled to the first active device, wherein the first interfacing member comprises a coupling plate and a base supporting the coupling plate; and

a flexible printed wiring board having a first end and a second end, the first end electrically coupled to the first interfacing member, the second end extending away from the stacked first and second active devices, wherein the first end of the flexible printed wiring board is interposed between the base and the coupling plate of the first interfacing member.

2. The assembly of claim 1 , wherein the first interfacing member is interposed between the first active device and the second active device and is electrically coupled to the first active device via a bottom surface of the first active device.

3. The assembly of claim 1 , wherein the first interfacing member has a same form factor as the first active device and the second active device.

4. The assembly of claim 1 , wherein the first active device comprises a first connecting end on a first side surface thereof, and the second active device comprises a second connecting end on a second side surface thereof.

5. The assembly of claim 4 , further comprising a first board coupled to the first active device and the second active device through the first connecting end and the second connecting end, respectively.

6. The assembly of claim 5 , wherein the first board is a connector board.

7. The assembly of claim 1 , further comprising a second interfacing member electrically coupled to the second active device.

8. The assembly of claim 7 , wherein the second interfacing member is electrically coupled to the second active device via a bottom surface of the second active device.

9. The assembly of claim 1 , further comprising a second board electrically coupled to the second active device and to the second end of the flexible printed wiring board.

10. The assembly of claim 9 , further comprising a second interfacing member interposed between the second active device and the second board.

11. The assembly of claim 9 , further comprising an attachment member securing the second end of the flexible printed wiring board to the second board.

12. The assembly of claim 9 , further comprising an additional interfacing member interposed between the second end of the flexible printed wiring board and the second board.

13. The assembly of claim 1 , wherein the first active device and the second active device are identical.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 6, 2024
From: ROLSTON, DAVID
To: REFLEX PHOTONICS INC.
Reel/Frame 067318/0737 →
CHANGE OF NAME Recorded May 6, 2024
From: REFLEX PHOTONICS INC.
To: SMITHS INTERCONNECT CANADA INC.
Reel/Frame 067318/0833 →
Continuity (2)
Provisional Application 62810062 · Feb 25, 2019
Related Publication 20220151079A1 · May 12, 2022