Electronic converter designed on the basis of welding technologies
A converter including a semiconductor module and a cooling housing. The semiconductor module includes a semiconductor chip, a substrate having a first side and a second side, a base plate having a first side and a second side, and a molding compound. The semiconductor chip connects to the first side of the substrate. The second side of the substrate connects to the first side of the base plate, the second side of the base plate has a first region and a second region. The first region has a surface expansion, and the first region having the surface expansion contacts with a coolant liquid in an operating state. The second region forms a closed path around the first region, the cooling housing has a plate including at least one hole, and the plate is connected around the hole to the second region of the base plate by welding.
1 . A converter comprising:
at least one semiconductor module and a cooling housing,
wherein the at least one semiconductor module comprises a semiconductor chip, a substrate having a first side opposite a second side, a base plate having a first side opposite a second side, and a molding compound,
wherein the first side of the substrate is connected to the semiconductor chip,
wherein the second side of the substrate is connected to the first side of the base plate,
wherein the second side of the base plate has a first region and a second region,
wherein the first region has a surface expansion in the form of a cooling structure, such that, in an operating state, the first region having the surface expansion is in direct contact with a coolant liquid,
wherein the second region forms a closed path around the first region wherein the second regions extends perpendicular from the second side of the base plate in a protrusion direction to form a shoulder,
wherein the cooling housing comprises a housing plate with at least one recess, and the second region of the base plate is welded to the housing plate around a corresponding one of the at least one recess,
wherein the second side of the base plate comprises an edge and the second region coincides with the edge.
2 . The converter as claimed in claim 1 , wherein the housing plate is formed from aluminum or an aluminum-based alloy.
3 . The converter as claimed in claim 1 , wherein the semiconductor chip and the substrate are embedded in a molding compound by means of epoxy resin.
4 . A method for producing a converter, comprising:
a) introducing at least one semiconductor module into a housing plate of a cooling housing, the at least one semiconductor module comprising a semiconductor chip, a substrate having a first side opposite a second side, a base plate having a first side opposite a second side, and a molding compound;
b) welding the second side of the base plate of the at least one semiconductor module to the housing plate;
c) applying a cover to the housing plate; and
d) welding the cover to the housing plate and thus forming a cooling path,
wherein the second side of the base plate comprises an edge and a second region coincides with the edge; and
wherein the second region further comprises one or more sidewalls which extend perpendicular from the second side of the base plate in a protrusion direction to form a shoulder.
5 . The converter as claimed in claim 1 , wherein the second region is welded to the housing plate in a plane which sits aligned with a base of the cooling structure relative to a protrusion direction of the surface expansion.
6 . The converter as claimed in claim 1 , wherein the second region is welded to the housing plate in a plane which sits between a base and a tip of the cooling structure relative to a protrusion direction of the surface expansion.
7 . The converter as claimed in claim 1 , wherein the second region is welded to the housing plate in a plane which sits aligned with a tip of the cooling structure relative to a protrusion direction of the surface expansion.
8 . The converter as claimed in claim 1 , wherein the shoulder is aluminum coated.
9 . The converter of claim 1 , wherein the second region extends in the protrusion direction such that a bottom of the second region sits co-planar with a tip of the cooling structure.
10 . The converter of claim 9 , wherein the bottom of the second region that is co-planar with the tip of the cooling structure is welded to the housing plate.
11 . The method of claim 4 , wherein the second region extends in the protrusion direction such that a bottom of the second region sits co-planar with a tip of the cooling structure.
12 . The method of claim 11 , wherein the bottom of the second region that is co-planar with the tip of the cooling structure is welded to the housing plate.
13 . The converter of claim 1 , wherein the base plate is formed from aluminum silicon carbide (AlSiC) and has an aluminum-rich zone on a region corresponding to the weld between the base plate and the housing plate.
14 . The method of claim 4 , wherein the base plate is formed from aluminum silicon carbide (AlSiC) and has an aluminum-rich zone on a region corresponding to the weld between the base plate and the housing plate.