Optoelectronic semiconductor chip and method for producing an optoelectronic semiconductor chip

1. An optoelectronic semiconductor chip comprising:

a semiconductor layer sequence with a first layer, a second layer and an active layer arranged between the first layer and the second layer, the semiconductor layer sequence having at least one injection region,

wherein the first layer comprises a first conductivity type,

wherein the second layer comprises a second conductivity type,

wherein the semiconductor layer sequence comprises the first conductivity type within the entire injection region,

wherein the injection region, starting from the first layer, at least partially penetrates the active layer,

wherein side surfaces of the semiconductor layer sequence are formed at least in places by the injection region, and

wherein the injection region is configured to inject charge carriers directly into the active layer.

2. The optoelectronic semiconductor chip according to claim 1 , wherein the semiconductor layer sequence in the active layer comprises a lower dopant concentration than in the injection region.

3. The optoelectronic semiconductor chip according to claim 1 ,

wherein the entire injection region comprises a dopant concentration of at least 10 18 dopant atoms per cm 3 , and

wherein the dopant concentration within the active layer outside the injection region is at least one order of magnitude lower or opposite than in the injection region.

4. The optoelectronic semiconductor chip according to claim 1 , wherein at least 50% of the side surfaces of the semiconductor layer sequence are formed by the injection region.

5. The optoelectronic semiconductor chip according to claim 1 , wherein the side surfaces of the semiconductor layer sequence are formed by a plurality of non-contiguous injection regions.

6. An optoelectronic semiconductor chip comprising:

a semiconductor layer sequence with a first layer, a second layer and an active layer arranged between the first layer and the second layer, the semiconductor layer sequence having at least one injection region,

wherein the first layer comprises a first conductivity type,

wherein the second layer comprises a second conductivity type,

wherein the semiconductor layer sequence comprises the first conductivity type within the entire injection region,

wherein the injection region, starting from the first layer, at least partially penetrates the active layer,

wherein side surfaces of the semiconductor layer sequence are formed at least in places by the injection region,

wherein the injection region is configured to inject charge carriers directly into the active layer,

wherein the active layer comprises a quantum well structure with at least one quantum well layer,

wherein at least one barrier layer is arranged between each two adjacent quantum well layers, and

wherein a band gap between a valence band and a conduction band in a region of the quantum well layer is smaller than in a region of the barrier layer and the injection region.

7. The optoelectronic semiconductor chip according to claim 1 ,

wherein the injection region tapers from the first layer towards the second layer,

wherein the injection region completely penetrates the active layer and projects into the second layer, and

wherein the injection region projects at least 50 nm and at most 300 nm into the second layer.

8. The optoelectronic semiconductor chip according to claim 1 ,

wherein the injection region tapers from the first layer towards the second layer, and

wherein the injection region comprises a thickness between 50 nm and 5 μm inclusive,

wherein the thickness of the injection region is measured perpendicular to the side surface from the side surface to the active layer.

9. The optoelectronic semiconductor chip according to claim 1 , wherein, in the injection region, an indium concentration alternates along a stack direction of the semiconductor layer sequence.

10. The optoelectronic semiconductor chip according to claim 1 , wherein the semiconductor chip comprises an extension of at most 20 μm along a main extension direction of the active layer.

11. The optoelectronic semiconductor chip according to claim 1 ,

wherein the semiconductor chip comprises an extension of at least 3 μm along a main extension direction of the active layer,

wherein the semiconductor chip comprises at least one additional injection region, and

wherein the additional injection region is laterally surrounded by a continuous path of the active layer.

12. A method for producing an optoelectronic semiconductor chip, the method comprising:

providing a semiconductor layer sequence with a first layer of a first conductivity type, a second layer of a second conductivity type, and an active layer arranged between the first layer and the second layer, the active layer being capable of absorbing or emitting electromagnetic radiation;

forming a laterally defined and laterally limited injection region by doping the semiconductor layer sequence so that the semiconductor layer sequence comprises the same conductivity type as the first layer within the entire injection region, the injection region, starting from the first layer, at least partially penetrates the active layer, and the active layer is less or oppositely doped than in the injection region; and

separating the semiconductor layer sequence to form at least one semiconductor chip by cutting through the semiconductor layer sequence along imaginary cutting lines,

wherein the cutting lines run at least partially through the injection region, and

wherein, after the separation, side surfaces of the semiconductor layer sequence are formed at least in places by the injection region.

13. The method according to claim 12 , wherein the injection region forms a regular grid in plan view of the semiconductor layer sequence or a plurality of injection regions are arranged along grid lines of a regular grid.

14. The method according to claim 12 , further comprising:

applying a mask to the side of the first layer facing away from the active layer, wherein the mask comprises at least one opening in which the semiconductor layer sequence is exposed; and

performing doping by an ion implantation process in a region of the opening, wherein based on the mask the doping is laterally defined and laterally limited.

15. The optoelectronic semiconductor chip according to claim 6 , wherein the barrier layer along a stack direction of a semiconductor layer stack comprises a thickness of at least 1 nm.

16. The optoelectronic semiconductor chip according to claim 6 , wherein the semiconductor layer sequence in the active layer comprises a lower dopant concentration than in the injection region.

17. The optoelectronic semiconductor chip according to claim 6 ,

wherein the entire injection region comprises a dopant concentration of at least 10 18 dopant atoms per cm 3 , and

wherein the dopant concentration within the active layer outside the injection region is at least one order of magnitude lower or opposite than in the injection region.

18. The optoelectronic semiconductor chip according to claim 6 ,

wherein the injection region tapers from the first layer towards the second layer,

wherein the injection region completely penetrates the active layer and projects into the second layer, and

wherein the injection region projects at least 50 nm and at most 300 nm into the second layer.

19. The optoelectronic semiconductor chip according to claim 6 , wherein, in the injection region, an indium concentration alternates along a stack direction of the semiconductor layer sequence.