Multi-path cooling for robotic systems

1. A robotic system, comprising:

a base supporting one or more articulating links, the base comprising:

a front portion comprising a front wall;

a rear portion removably attached to the front portion and comprising a back wall;

a bracket supporting a heat generating component, a first side of the bracket attached to the back wall of the rear portion of the base to form a first thermally conductive path that, in use, dissipates heat from the heat generating component; and

a thermal pad attached to a second side of the bracket, the thermal pad contacting the front wall of the base to form a second thermally conductive path that, in use, dissipates heat from the heat generating component.

2. The system of claim 1 , wherein the heat generating component comprises an amplifier.

3. The system of claim 2 , wherein the amplifier is mounted on the bracket such that a longitudinal axis of the amplifier extends in a substantially horizontal direction.

4. The system of claim 1 , wherein at least one of the front wall of the front portion and the back wall of the rear portion comprises one or more fins configured to dissipate heat.

5. The system of claim 1 , wherein an integrated controller is positioned within the base and in thermal contact with a heat sink positioned on one of the front portion and the rear portion of the base.

6. The system of claim 1 , wherein the bracket comprises:

a first flange connected to the back wall of the rear portion;

a second flange, wherein the thermal pad is positioned on an outer surface of the second flange so as to contact the front wall of the front portion; and

a plate extending between the first flange and the second flange, wherein the heat generating component is mounted to the plate.

7. The system of claim 6 , wherein the first flange and the second flange extend in a substantially vertical direction, and the plate extends in a substantially horizontal direction.

8. A robotic system, comprising:

a heat generating component positioned within a base that supports one or more articulating links;

a bracket supporting the heat generating component, wherein the heat generating component is mounted on and directly contacts the bracket, wherein the bracket is thermally conductive;

a first thermally conductive path configured to dissipate heat from the heat generating component, the first thermally conductive path comprising the bracket and a first heatsink connected to the bracket, wherein the first heatsink is positioned on a first side of the base; and

a second thermally conductive path configured to dissipate heat from the heat generating component, the second thermally conductive path comprising the bracket, a thermal pad positioned on the bracket, and a second heatsink positioned on a second side of the base, wherein the thermal pad is in thermal communication with the second heatsink.

9. The system of claim 8 , wherein the heat generating component comprises an amplifier.

10. The system of claim 9 , wherein the amplifier is mounted on the bracket such that a longitudinal axis of the amplifier extends in a horizontal direction.

11. The system of claim 8 , wherein:

the first heatsink is disposed on a first wall of the base; and

the second heatsink is disposed on a second wall of the base, wherein the first and second wall are positioned on substantially opposite sides of the base.

12. The system of claim 8 , wherein the bracket comprises:

a first flange connected to the first heatsink;

a second flange, wherein the thermal pad is positioned on an outer surface of the second flange so as to contact the second heatsink; and

a plate extending between the first flange and the second flange, wherein the heat generating component is mounted to the plate.

13. The system of claim 12 , wherein the first flange and the second flange extend in a substantially vertical direction, and the plate extends in a substantially horizontal direction.

14. A method for dissipating heat in a robotic system, the method comprising:

mounting a heat generating component on a bracket within a base of a robotic arm, the bracket being thermally conductive;

attaching the bracket to a first heatsink positioned on a first side of the base to form a first thermally conductive path configured to dissipate heat from the heat generating component; and

contacting a thermal pad positioned on the bracket to a second side of the base to form a second thermally conductive path configured to dissipate heat from the heat generating component to a second heatsink positioned on the second side of the base.

15. The method of claim 14 , wherein contacting the thermal pad comprises attaching a rear portion of the housing to a front portion of the housing, wherein the first heatsink is disposed on the rear portion of the housing and the bracket is connected to the rear portion of the housing, and wherein the second heatsink is disposed on the front portion of the housing.

16. The method of claim 14 , wherein the heat generating component comprises an amplifier, and wherein mounting the heat generating component on the bracket comprises mounting the amplifier on the bracket such that a longitudinal axis of the amplifier extends in a generally horizontal direction.

17. The method of claim 14 , wherein the first heatsink comprises one of more fins formed on the first side of the base.

18. The method of claim 14 , wherein the second heatsink comprises one of more fins formed on the second side of the base.