Granted Patent B2

US 12,359,878 · App. 17/438,082 · Granted Jul 15, 2025

Inventor: Shunsuke Sekimoto (Kyoto, JP)

Assignee: SHIMADZU CORPORATION

F28D15/06

Abstract

Claims (28)

1. A cooling device for performing cooling by utilizing latent heat of vaporization without using a compressor, the cooling device comprising:

a liquid feeding unit configured to feed a refrigerant;

an evaporator configured to evaporate the fed refrigerant;

a condenser configured to condense the evaporated refrigerant;

a controller configured to control a flow rate of the refrigerant;

a first temperature sensor configured to acquire a temperature of a wall of the evaporator; and

a second temperature sensor configured to acquire a refrigerant temperature in a refrigerant flow path of the evaporator and is different from the first temperature sensor,

wherein the controller is configured to determine whether or not dryout has occurred based on a difference between the temperature of a wall of the evaporator acquired by the first temperature sensor and the refrigerant temperature in the refrigerant flow path of the evaporator acquired by the second temperature sensor, the dryout being defined as a state in which a gas-phase refrigerant is in contact with an inner surface of the refrigerant flow path of the evaporator, and

wherein the first temperature sensor and the second temperature sensor are provided in the vicinity of an outlet of the evaporator.

2. The cooling device as recited in claim 1 ,

wherein the controller is configured to determine that the dryout has occurred on the inner surface of the refrigerant flow path of the evaporator when the difference between the temperature of a wall of the evaporator acquired by the first temperature sensor and the refrigerant temperature in the refrigerant flow path of the evaporator acquired by the second temperature sensor is equal to or greater than a threshold temperature difference based on a design value of an amount of heat generation of a heat source.

3. The cooling device as recited in claim 1 ,

wherein when the controller determines that the dryout has occurred on the inner surface of the refrigerant flow path of the evaporator, the controller is configured to perform control to increase a flow rate of the refrigerant to be fed to the evaporator.

4. The cooling device as recited in claim 1 ,

wherein the first temperature sensor is provided in the vicinity of the refrigerant flow path near the outlet of the evaporator, and

wherein the controller is configured to acquire the temperature of the evaporator by the first temperature sensor.

5. The cooling device as recited in claim 1 ,

wherein the cooling device includes a plurality of the evaporators, and the liquid feeding unit includes a pump capable of feeding the refrigerant to the plurality of the evaporators,

wherein the cooling device further comprises a plurality of flow rate control valves each for adjusting a flow rate of the refrigerant to each of the plurality of evaporators, and

wherein when the controller determines that the dryout has occurred in at least one of the plurality of the evaporators, the controller is configured to perform control of the flow rate control valve corresponding to the at least one of the plurality of the evaporators in which the dryout has occurred so as to increase the flow rate of the refrigerant to be supplied to the at least one of the plurality of the evaporators.

6. The cooling device as recited in claim 1 ,

wherein the evaporator is configured to be in contact with a heat source to remove heat of the heat source by heat conduction.

7. The cooling device as recited in claim 1 ,

wherein the refrigerant has a boiling point of 15° C. or above and 50° C. or below.

8. The cooling device as recited in claim 1 ,

wherein the cooling device is configured to cool an electronic device.

9. The cooling device as recited in claim 1 ,

wherein the cooling device is configured to be mounted on a moving body.

Assignments (1)

Continuity (1)

References Cited (15)