IP Library › Granted Patent US 11,412,966
Granted Patent B2
US 11,412,966 · App. 17/446,280 · Granted Aug 16, 2022

Transcutaneous analyte sensor systems and methods

Inventors: Jason Halac (San Diego, CA); John Michael Gray (San Diego, CA); Neal Davis Johnston (Dallas, TX); Justen Deering England (San Francisco, CA); Peter C. Simpson (Cardiff by the Sea, CA); Paul V. Neale (San Diego, CA); Jennifer Blackwell (San Diego, CA); Maria Noel Brown Wells (San Diego, CA); Kenneth Pirondini (San Diego, CA); Andrew Michael Reinhardt (Santee, CA); Mark Douglas Kempkey (Vista, CA)
Assignee: DexCom, Inc.
A61B5/14865A61B5/14532A61B5/14546A61B5/688A61B5/6832A61B5/6848A61B5/6849A61B5/68335A61B2560/063
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Quick Facts
Patent No.
US 11,412,966
App. No.
17/446,280
Granted
Aug 16, 2022
Kind
B2
Abstract

Systems for applying a transcutaneous monitor to a person can include a telescoping assembly, a sensor, and a base with adhesive to couple the sensor to skin. The sensor can be located within the telescoping assembly while the base protrudes from a distal end of the system. The system can be configured to couple the sensor to the base by compressing the telescoping assembly.

Claims (56)

1. A sensor applicator system configured for delivery to a host, the sensor applicator system configured to apply an on-skin sensor assembly provided as part of the sensor applicator system to a skin of the host, the applicator system comprising:

a shell;

an on-skin sensor assembly disposed in the applicator system, the on-skin sensor assembly comprising:

at least one electrical interconnect;

a transcutaneous analyte sensor comprising an in-vivo portion and an ex-vivo portion;

sensor electronics configured to process a signal received from the transcutaneous analyte sensor;

an electrical connection established between the transcutaneous analyte sensor and the sensor electronics;

a first mechanical connection established between the transcutaneous analyte sensor and the at least one electrical interconnect;

a second mechanical connection established between the sensor electronics and the at least one electrical interconnect;

wherein the first mechanical connection and the second mechanical connection are configured to establish the electrical connection between the transcutaneous analyte sensor and the sensor electronics;

a base comprising a hole and an adhesive to adhere the on-skin sensor assembly to a skin of a host; and

wherein the transcutaneous analyte sensor is configured to extend during use from the electrical interconnect, through the hole in the base, to under the skin of the host; and

a needle configured to guide the sensor under the skin of the host; and

a user removable cap removably coupled to the shell and covering the on-skin sensor assembly and the needle.

2. The applicator system of claim 1 , wherein the user removable cap seals the on-skin sensor assembly and the needle from contaminants prior to application of the on-skin sensor assembly to the skin of the host.

3. The applicator system of claim 2 , wherein the shell comprises a first material, wherein the cap comprises a second material, and wherein the second material is softer than the first material.

4. The applicator system of claim 1 , wherein the system is configured to retain the needle in the shell after the on-skin sensor assembly is applied to the host.

5. The applicator system of claim 1 , wherein the needle comprises a channel, and wherein the transcutaneous analyte sensor extends from the first mechanical connection into the channel of the needle.

6. The applicator system of claim 5 , comprising a compressed spring configured for pushing the needle and the in-vivo portion of the transcutaneous analyte sensor under the skin of the host.

7. The applicator system of claim 1 , wherein the electrical connection is sealed to prevent fluid ingress after application of the on-skin sensor assembly to the skin of the host.

8. The applicator system of claim 1 , wherein the electrical interconnect comprises a spring.

9. The applicator system of claim 8 , wherein the spring comprises a leaf spring.

10. The applicator system of claim 1 , wherein the electrical interconnect is compressed between the first mechanical connection and the second mechanical connection.

11. The applicator system of claim 1 , wherein the electrical interconnect comprises a plated portion.

12. The applicator system of claim 10 , wherein the plated portion is gold plated.

13. The applicator system of claim 1 , wherein the needle is sterilized.

14. The applicator system of claim 13 , wherein the sensor electronics is not sterilized.

15. A sensor applicator system configured for delivery to a host, the sensor applicator system configured to apply an on-skin sensor assembly provided as part of the sensor applicator system to a skin of the host, the applicator system comprising:

a shell;

an on-skin sensor assembly disposed in the applicator system, the on-skin sensor assembly comprising:

a sensor module comprising a sensor module housing and an electrical interconnect, wherein the electrical interconnect is mounted to the sensor module housing;

a transcutaneous analyte sensor comprising an in-vivo portion and an ex-vivo portion;

sensor electronics configured to process a signal received from the transcutaneous analyte sensor;

an electrical connection established between the transcutaneous analyte sensor and the sensor electronics;

a first mechanical connection established between the transcutaneous analyte sensor and the electrical interconnect, wherein the ex-vivo portion of the transcutaneous analyte sensor is pressed against a portion of the electrical interconnect;

a second mechanical connection established between the sensor electronics and the electrical interconnect;

wherein the electrical connection is established by conductive material of the electrical interconnect that extends from the first mechanical connection to the second mechanical connection;

a base comprising a hole and an adhesive to adhere the on-skin sensor assembly to a skin of a host; and

wherein the transcutaneous analyte sensor is configured to extend during use from the electrical interconnect, through the hole in the base, to under the skin of the host;

a needle configured to guide the sensor under the skin of the host; and

a user removable cap removably coupled to the shell and covering the on-skin sensor assembly and the needle.

16. The applicator system of claim 15 , wherein the ex-vivo portion of the transcutaneous analyte sensor is pressed between the portion of the electrical interconnect and the sensor module housing.

17. The applicator system of claim 15 , wherein the sensor module housing comprises a groove, and wherein the electrical interconnect comprises a tab positioned in the groove to inhibit rotation of the electrical interconnect.

18. The applicator system of claim 15 , wherein the user removable cap seals the on-skin sensor assembly and the needle from contaminants prior to application of the on-skin sensor assembly to the skin of the host.

19. The applicator system of claim 18 , wherein the shell comprises a first material, wherein the cap comprises a second material, and wherein the second material is softer than the first material.

20. The applicator system of claim 15 , wherein the system is configured to retain the needle in the shell after the on-skin sensor assembly is applied to the host.

21. The applicator system of claim 15 , wherein the needle comprises a channel, and wherein the transcutaneous analyte sensor extends from the first mechanical connection into the channel of the needle.

22. The applicator system of claim 21 , comprising a compressed spring configured for pushing the needle and the in-vivo portion of the transcutaneous analyte sensor under the skin of the host.

23. The applicator system of claim 15 , wherein the electrical connection is sealed to prevent fluid ingress after application of the on-skin sensor assembly to the skin of the host.

24. The applicator system of claim 15 , wherein the electrical interconnect comprises a spring.

25. The applicator system of claim 24 , wherein the spring comprises a leaf spring.

26. The applicator system of claim 24 , wherein the electrical interconnect is compressed between the first mechanical connection and the second mechanical connection.

27. The applicator system of claim 15 , wherein the electrical interconnect comprises a plated portion.

28. The applicator system of claim 27 , wherein the plated portion is gold plated.

29. The applicator system of claim 15 , wherein the needle is sterilized.

30. The applicator system of claim 29 , wherein the sensor electronics is not sterilized.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 3, 2021
From: HALAC, JASON; GRAY, JOHN MICHAEL; JOHNSTON, NEAL DAVIS; ENGLAND, JUSTEN DEERING; SIMPSON, PETER C.; NEALE, PAUL V.; BLACKWELL, JENNIFER; WELLS, MARIA NOEL BROWN; PIRONDINI, KENNETH; REINHARDT, ANDREW MICHAEL; KEMPKEY, MARK DOUGLAS
To: DEXCOM, INC.
Reel/Frame 057385/0773 →
Continuity (4)
Continuation 15387088 · Dec 21, 2016
Provisional Application 62412100 · Oct 24, 2016
Provisional Application 62272983 · Dec 30, 2015
Related Publication 20210386342A1 · Dec 16, 2021