Package with windowed heat spreader
A semiconductor device has a substrate and a first semiconductor die disposed over the substrate. A subpackage is also disposed over the substrate. A stiffener is disposed over the substrate around the first semiconductor die and subpackage. A heat spreader is disposed over the stiffener. The heat spreader is thermally coupled to the first semiconductor die. The heat spreader has an opening over the subpackage.
1. A method of making a semiconductor device, comprising:
providing a substrate;
disposing a first semiconductor die over the substrate;
disposing a subpackage over the substrate;
disposing a stiffener over the substrate around the first semiconductor die and subpackage; and
disposing a heat spreader over the stiffener, wherein the heat spreader is thermally coupled to the first semiconductor die, and wherein the heat spreader includes an opening over the subpackage.
2. The method of claim 1 , further including forming a plurality of openings in the heat spreader over the subpackage.
3. The method of claim 1 , wherein the subpackage is disposed completely within a footprint of the opening.
4. The method of claim 1 , further including disposing a second semiconductor die over the substrate and thermally coupled to the heat spreader, wherein a height of the first semiconductor die is different from a height of the second semiconductor die.
5. The method of claim 1 , further including forming a cavity or protrusion on the heat spreader over the first semiconductor die.
6. The method of claim 1 , wherein the stiffener includes a compartment stiffener.
7. A method of making a semiconductor device, comprising:
providing a substrate;
disposing a stiffener over a first surface of the substrate;
disposing a first electrical component over the first surface of the substrate; and
disposing a heat spreader over the stiffener with an opening of the heat spreader disposed over the first electrical component, wherein a footprint of the opening is larger than a footprint of the first electrical component.
8. The method of claim 7 , further including a second electrical component disposed over a second surface of the substrate opposite the first surface.
9. The method of claim 7 , further including disposing a second electrical component over the substrate and thermally coupled to the heat spreader.
10. The method of claim 7 , wherein the stiffener includes a compartment stiffener.
11. The method of claim 7 , further including a protrusion or cavity formed in the heat spreader.
12. A semiconductor device, comprising:
a substrate;
a first semiconductor die disposed over the substrate;
a subpackage disposed over the substrate;
a stiffener disposed over the substrate around the first semiconductor die and subpackage; and
a heat spreader disposed over the stiffener, wherein the heat spreader is thermally coupled to the first semiconductor die, and wherein the heat spreader includes an opening over the subpackage.
13. The semiconductor device of claim 12 , further including a plurality of openings formed in the heat spreader over the subpackage.
14. The semiconductor device of claim 12 , wherein the subpackage is disposed completely within a footprint of the opening.
15. The semiconductor device of claim 12 , further including a second semiconductor die disposed over the substrate and thermally coupled to the heat spreader, wherein a height of the first semiconductor die is different from a height of the second semiconductor die.
16. The semiconductor device of claim 12 , wherein the heat spreader includes a cavity or protrusion.
17. The semiconductor device of claim 12 , wherein the stiffener includes a compartment stiffener.
18. A semiconductor device, comprising:
a substrate;
a first electrical component disposed over the substrate;
a stiffener disposed over the substrate; and
a heat spreader disposed over the stiffener, wherein the heat spreader includes an opening disposed over the first electrical component, and wherein a footprint of the opening is larger than a footprint of the first electrical component.
19. The semiconductor device of claim 18 , further including a second electrical component disposed over the substrate and thermally coupled to the heat spreader.
20. The semiconductor device of claim 18 , wherein the stiffener includes a compartment stiffener.
21. The semiconductor device of claim 18 , further including a protrusion or cavity formed in the heat spreader.