Schottky rectifier with surge-current ruggedness
A SiC Schottky rectifier with surge current ruggedness is described. The Schottky rectifier includes one or more multi-layer bodies that provide multiple types of surge current protection.
1. A Schottky rectifier device, comprising:
a Silicon Carbide (SiC) layer;
a channel region of a first conductivity type formed on the SiC layer;
a metal contact formed on the channel region;
a multi-layer body of a second conductivity type formed within the channel region and extending from the metal contact in a direction of the SiC layer, the multi-layer body including a first layer adjacent to the metal contact and having a first doping concentration, a second layer adjacent to the first layer and having a second doping concentration less than the first doping concentration, and a third layer adjacent to the second layer and having a third doping concentration less than the second doping concentration; and
a charge-balanced region that includes the third layer and a portion of the channel region adjacent to the third layer, wherein, within the charge-balanced region, charges of non-compensated acceptors and donors in the third layer and the portion of the channel region have a deviation of approximately 1×10 13 cm −2 or lower.
2. The Schottky rectifier device of claim 1 , wherein the second layer has a doping concentration between 1×10 18 cm −3 and 1×10 19 cm −3 .
3. The Schottky rectifier device of claim 1 , wherein the first layer is degenerately doped and provides a tunnel contact between the metal contact and the second layer.
4. The Schottky rectifier device of claim 1 , wherein the multi-layer body extends at least thirty percent of a distance between the metal contact and the SiC layer.
5. The Schottky rectifier device of claim 1 , wherein the metal contact extends over an active region of the Schottky rectifier device that includes the channel region and the multi-layer body, and further comprising
a p-n diode rim that surrounds the active region with a continuous body of the second conductivity type and an array of deep rim bodies of the second conductivity type that are parallel to the multi-layer body.
6. The Schottky rectifier device of claim 5 , wherein the metal contact overlaps the active region and at least a portion of the p-n diode rim.
7. The Schottky rectifier device of claim 5 , comprising a junction termination region outside of the p-n diode rim, the junction termination region comprising: a junction termination (JT) body surrounding the p-n diode rim and connected to a plurality of deep JT bodies extending parallel to the multi-layer body and the deep rim bodies.
8. The Schottky rectifier device of claim 7 , wherein a width of each of the deep JT bodies decreases with distance from the p-n diode rim.
9. The Schottky rectifier device of claim 1 , wherein the multi-layer body extends an entire distance from the metal contact to the SiC layer.
10. A method of making a Schottky rectifier device, the method comprising:
forming a Silicon Carbide (SiC) substrate;
forming an epitaxial layer of a first conductivity type on the SiC substrate;
forming a portion of a charge-balancing body having donors of a second conductivity type;
repeating the forming of the epitaxial layer and the forming the portion of the charge-balancing body until the charge-balancing body reaches a specified thickness, wherein, within a charge-balanced region that includes the charge-balancing body and a surrounding portion of the epitaxial layer, charges of non-compensated acceptors and donors in the charge-balancing body and the surrounding portion of the epitaxial layer have a deviation of approximately 1×10 13 cm −2 or lower;
forming an injection layer on the charge-balancing body, the injection layer having a doping concentration of the second conductivity type that is higher than a doping concentration of the charge-balancing body;
forming a contact layer on the injection layer; and
forming a metal contact over the contact layer and the epitaxial layer.
11. The method of claim 10 , wherein the contact layer, the injection layer, and the charge-balancing body extend at least thirty percent of a distance from the metal contact to the SiC substrate.
12. The method of claim 10 , wherein the contact layer has a doping concentration that is higher than the doping concentration of the injection layer.
13. A Schottky rectifier device, comprising:
a Silicon Carbide (SiC) layer;
a channel region of a first conductivity type formed on the SiC layer;
a metal contact formed on the channel region;
a multi-layer body of a second conductivity type formed within the channel region and extending from the metal contact in a direction of the SiC layer, the multi-layer body including a tunnel contact layer adjacent to the metal contact, an injection layer adjacent to the tunnel contact layer, and a deep layer adjacent to the injection layer; and
a charge-balanced region that includes the deep layer and a portion of the channel region adjacent to the deep layer, wherein, within the charge-balanced region, charges of non-compensated acceptors and donors in the deep layer and the portion of the channel region have a deviation of approximately 1×10 13 cm −2 or lower,
wherein the multi-layer body extends at least thirty percent of a distance between the metal contact and the SiC layer.
14. The Schottky rectifier device of claim 13 , wherein the multi-layer body extends an entire distance from the metal contact to the SiC layer.
15. The Schottky rectifier device of claim 13 , wherein the metal contact extends over an active region of the Schottky rectifier device that includes the channel region and the multi-layer body, and further comprising
a p-n diode rim that surrounds the active region with a continuous body of the second conductivity type and an array of deep rim bodies of the second conductivity type that are parallel to the multi-layer body.
16. The Schottky rectifier device of claim 15 , comprising a junction termination region outside of the p-n diode rim, the junction termination region comprising: a junction termination (JT) body surrounding the p-n diode rim and connected to a plurality of deep JT bodies extending parallel to the multi-layer body and the deep rim bodies.
17. The Schottky rectifier device of claim 13 , comprising a silicide Ohmic contact between the tunnel contact layer and the metal contact.