Tiered immersion cooling system

1. A tiered immersion cooling system, comprising:

a chassis;

a cabinet frame slidably mounted to the chassis, the cabinet frame being slidable between (i) a first internal position in which the cabinet frame is substantially within the chassis and (ii) a first external position in which the cabinet frame is substantially external to the chassis, sliding motion of the cabinet frame being in a horizontal direction along a depth of the chassis;

an upper immersion tank configured to store and cool a first electronic device, the upper immersion tank being slidably mounted to the chassis, the upper immersion tank being slidable with the cabinet frame in the horizontal direction, the upper immersion tank sliding relative to the cabinet frame in a vertical direction along a height of the chassis; and

a lower immersion tank configured to store and cool a second electronic device, the lower immersion tank being positioned below the upper immersion tank in the vertical direction, the lower immersion tank being mounted to slide independently from the cabinet frame in the horizontal direction, the lower immersion tank sliding between (i) a second internal position in which the lower immersion tank is substantially within the chassis and (ii) a second external position in which the lower immersion tank is substantially external to the chassis.

2. The tiered immersion cooling system of claim 1 , wherein the upper immersion tank stores a plurality of servers, the upper immersion tank including a liquid coolant for cooling the plurality of servers.

3. The tiered immersion cooling system of claim 2 , further comprising a third electronic device positioned within the chassis and coupled to a server of the plurality of servers.

4. The tiered immersion cooling system of claim 3 , wherein the third electronic device is a switch system.

5. The tiered immersion cooling system of claim 3 , wherein the third electronic device is coupled to the server via a cable and remains coupled to the server regardless of a position of the upper immersion tank.

6. The tiered immersion cooling system of claim 2 , wherein the plurality of servers is arranged vertically.

7. The tiered immersion cooling system of claim 1 , wherein the lower immersion tank stores a plurality of servers, the lower immersion tank including a liquid coolant for cooling the plurality of servers.

8. The tiered immersion cooling system of claim 7 , further comprising a third electronic device positioned within the chassis and coupled to a server of the plurality of servers via a cable, the third electronic device remaining coupled to the server regardless of a position of the lower immersion tank.

9. The tiered immersion cooling system of claim 7 , wherein the plurality of servers is arranged vertically.

10. The tiered immersion cooling system of claim 1 , wherein the chassis further includes a pulley system coupled to the upper immersion tank, the pulley system being configured to lower and raise the upper immersion tank in the vertical direction.

11. The tiered immersion cooling system of claim 10 , wherein the pulley system includes a wheel that (i) lowers the upper immersion tank when the wheel is rotated clockwise and (ii) raises the upper immersion tank when the wheel is rotated counterclockwise.

12. The tiered immersion cooling system of claim 1 , wherein the lower immersion tank slides in the horizontal direction regardless of a position of the cabinet frame.

13. A method for removing an electronic device from a tiered immersion cooling system, the method comprising:

slidably mounting a cabinet frame, an upper immersion tank, and a lower immersion tank in a chassis of an immersion cooling system, the upper immersion tank storing and cooling an electronic device;

pulling the cabinet frame in a horizontal direction that is along a depth of the chassis, thereby sliding the cabinet frame and the upper immersion tank between a first position substantially within the chassis and a second position substantially external to the chassis;

lowering the upper immersion tank relative to the cabinet frame in a vertical direction along a height of the chassis; and

removing the electronic device from the upper immersion tank.

14. The method of claim 13 , further comprising:

storing a plurality of servers in the upper immersion tank; and

cooling the plurality of servers with a liquid coolant within the upper immersion tank.

15. The method of claim 14 , wherein at least one server of the plurality of servers is coupled to another electronic device of the chassis via a cable, the at least one server remaining coupled to the another electronic device regardless of a position of the upper immersion tank.

16. The method of claim 14 , wherein the plurality of servers is arranged vertically.

17. The method of claim 13 , further comprising:

sliding the cabinet frame via a pulley system that is coupled to the upper immersion tank; and

rotating in a clockwise direction a wheel of the pulley system to lower the upper immersion tank.

18. The method of claim 13 , further comprising returning the upper immersion tank to the first position.

19. The method of claim 13 , further comprising:

mounting a lower immersion below the upper immersion tank;

sliding the lower immersion tank between a third position substantially within the chassis and a fourth position substantially external to the chassis; and

removing another electronic device from the lower immersion tank.

20. The method of claim 19 , wherein the another electronic device is from the lower immersion tank after the upper immersion tank is returned to the first position.