FinFET with shorter fin height in drain region than source region and related method
A FinFET includes a semiconductor fin, and a source region and a drain region in the same semiconductor fin. The drain region has a first fin height above a trench isolation; and the source region has a second fin height above the trench isolation. The first fin height is less than the second fin height. The FinFET may be used, for example, in a scaled laterally diffused metal-oxide semiconductor (LDMOS) application, and exhibits reduced parasitic capacitance for improved radio frequency (RF) performance. A drain extension region may have the first fin height, and a channel region may have the second fin height. A method of making the FinFET is also disclosed.
1. A laterally diffused metal-oxide semiconductor (LDMOS) fin-type field effect transistor (FinFET), comprising:
a semiconductor fin having a trench isolation adjacent thereto;
a drain region in the semiconductor fin, the drain region having a first fin height above the trench isolation;
a source region in the same semiconductor fin as the drain region, the source region having a second fin height above the trench isolation;
a drain extension region in the same semiconductor fin as the source region and the drain region, the drain extension region having the first fin height above the trench isolation;
a gate extending across the semiconductor fin; and
a channel region under the gate in the same semiconductor fin as the source region and the drain region, the channel region positioned between the drain extension region and the source region, the channel region having the second fin height above the trench isolation.
2. The LDMOS FinFET of claim 1 , wherein the first fin height is between 40% and 60% of the second fin height.
3. The LDMOS FinFET of claim 1 , wherein the drain extension region is in an n- well in the semiconductor fin, and the channel region is in a p-well in the semiconductor fin.
4. The LDMOS FinFET of claim 3 , wherein a transition between the first fin height and the second fin height is positioned in a gap between the p-well and the n-well in the semiconductor fin.
5. The LDMOS FinFET of claim 1 , wherein the gate includes a work function metal layer and a gate conductor over the work function metal layer.
6. A laterally diffused metal-oxide semiconductor (LDMOS) fin-type field effect transistor (FinFET), comprising:
a semiconductor fin having a trench isolation adjacent thereto;
a drain region in the semiconductor fin, the drain region having a first fin height above the trench isolation;
a source region in the same semiconductor fin as the drain region, the source region having a second fin height above the trench isolation;
a drain extension region in the same semiconductor fin as the source region and the drain region, the drain extension region having the first fin height above the trench isolation;
a gate extending across the semiconductor fin; and
a channel region under the gate in the same semiconductor fin as the source region and the drain region, the channel region positioned between the drain extension region and the source region, the channel region having the second fin height above the trench isolation,
wherein the first fin height is less than the second fin height.
7. The LDMOS FinFET of claim 6 , wherein the first fin height is between 40% and 60% of the second fin height.
8. The LDMOS FinFET of claim 6 , wherein the drain extension region is in an n-well in the semiconductor fin, and the channel region is in a p-well in the semiconductor fin.
9. The LDMOS FinFET of claim 8 , wherein a transition between the first fin height and the second fin height is positioned in a gap between the p-well and the n-well in the semiconductor fin.
10. The LDMOS FinFET of claim 8 , wherein the p-well includes a p-type dopant, and the n-well includes an n-type dopant.
11. The LDMOS FinFET of claim 6 , wherein the source region includes a source region epitaxial portion above the trench isolation, and the drain region includes a drain region epitaxial portion above the trench isolation.
12. The LDMOS FinFET of claim 11 , wherein the source region epitaxial region is wider than the drain region epitaxial portion.
13. The LDMOS FinFET of claim 6 , wherein the trench isolation is higher relative to a bottom of the semiconductor fin in the drain region than in the source region.
14. The LDMOS FinFET of claim 6 , wherein the drain region includes a first drain region epitaxial portion above the trench isolation and a second drain region epitaxial portion below an upper surface of the trench isolation.
15. The LDMOS FinFET of claim 6 , wherein the trench isolation is a shallow trench isolation (STI).