Granted Patent B2

US 12,210,338 · App. 17/456,228 · Granted Jan 28, 2025

Inventors: Kosuke Matsumoto (Tokyo, JP); Satoshi Takada (Tokyo, JP); Hideki Nakayama (Tokyo, JP); Miyuki Fukuda (Tokyo, JP); Kozo Miyake (Tokyo, JP); Yuya Isomae (Tokyo, JP)

Assignee: Hitachi High-Tech Corporation

G05B19/41875G05B19/4184G06T7/0004

Abstract

Claims (44)

1. A computer system for an electron beam inspection apparatus that inspects a semiconductor sample using an image obtained by scanning an electron beam over the semiconductor sample,

wherein the computer system:

outputs control signals that control the electron beam inspection apparatus to move the semiconductor sample to a reference position and irradiate the semiconductor sample with the electron beam;

acquires a plurality of images for a plurality of chip regions repeatedly formed on a surface of the semiconductor sample from the electron beam inspection apparatus;

calculates a similarity of each image by comparing a reference image obtained at the reference position with each of the plurality of images;

sets each similarity that is equal to or greater than a threshold similarity as a candidate similarity;

specifies a shot region of the plurality of chip regions for each of the candidate similarities based on the similarity of each image; and

inspects the semiconductor sample with the electron beam inspection apparatus using the shot region;

wherein the computer system specifies a period or size of the shot region based on a period or size of the chip region; and

wherein the computer system provides a graphical user interface that displays an image at a reference position and an image at a position moved from the reference position at the period of the chip region or the period of the shot region for enabling a user to check and correct the period of the chip region or the period of the shot region based on a user operation of accepting or rejecting the period of the chip region or the period of the shot region.

2. The computer system of an observation device according to claim 1 ,

wherein the computer system performs control such that the specified shot region is displayed.

3. The computer system of an observation device according to claim 1 ,

wherein the graphical user interface provides for enabling to designate information regarding the period or size of the chip region based on a user operation.

4. The computer system of an observation device according to claim 1 ,

wherein the computer system provides a graphical user interface for enabling to designate information including positions at which the plurality of images on the surface of the semiconductor sample are captured based on a user operation.

5. The computer system of an observation device according to claim 1 ,

wherein the computer system selects a predetermined plurality of chip regions associated with observation or inspection alignment positions of the semiconductor sample based on the specified shot region and predetermined rules.

6. A computer system for an electron beam inspection apparatus that inspects a semiconductor sample using an image obtained by scanning an electron beam over the semiconductor sample,

wherein the computer system:

controls the electron beam inspection apparatus to move the semiconductor sample to a plurality of positions and irradiate the semiconductor sample with the electron beam;

acquires a plurality of images, including an image at each of the plurality of positions, for a plurality of chip regions repeatedly formed on a surface of semiconductor sample from the electron beam inspection apparatus;

calculates a feature amount of each of the plurality of images;

specifies a shot period and a shot region of the plurality of chip regions based on comparison of the feature amount between the plurality of images; and

inspects the semiconductor sample with the electron beam inspection apparatus using the shot period and the shot region;

wherein the computer system specifies a period or size of the shot region based on a period or size of the chip region; and

wherein the computer system provides a graphical user interface that displays an image at a reference position and an image at a position moved from the reference position at the period of the chip region or the period of the shot region for enabling a user to check and correct the period of the chip region or the period of the shot region based on a user operation of accepting or rejecting the period of the chip region or the period of the shot region.

7. A processing method in a computer system for an electron beam inspection apparatus that inspects a semiconductor sample using an image obtained by scanning an electron beam over the semiconductor sample, the method comprising:

outputting control signals for controlling the electron beam inspection apparatus to move the semiconductor sample to a reference position and irradiate the semiconductor sample with the electron beam;

acquiring, by the computer system, a plurality of images for a plurality of chip regions repeatedly formed on a surface of the semiconductor sample from the electron beam inspection apparatus;

calculating, by the computer system, a similarity of each image by comparing a reference image obtained at the reference position with each of the plurality of images; and

setting each similarity that is equal to or greater than a threshold similarity as a candidate similarity;

specifying, by the computer system, a shot region of the plurality of chip regions for each of the candidate similarities based on the similarity of each image; and

inspecting the semiconductor sample with the electron beam inspection apparatus using the shot region;

wherein the computer system specifies a period or size of the shot region based on a period or size of the chip region; and

wherein the computer system provides a graphical user interface that displays an image at a reference position and an image at a position moved from the reference position at the period of the chip region or the period of the shot region for enabling a user to check and correct the period of the chip region or the period of the shot region based on a user operation of accepting or rejecting the period of the chip region or the period of the shot region.

8. A processing method in a computer system for an electron beam inspection apparatus that inspects a semiconductor sample using an image obtained by scanning an electron beam over the semiconductor sample, the method comprising:

controlling the electron beam inspection apparatus to move the semiconductor sample to a plurality of positions and irradiate the semiconductor sample with the electron beam;

acquiring, by the computer system, a plurality of images, including an image at each of the plurality of positions, for a plurality of chip regions repeatedly formed on a surface of the semiconductor sample from the observation unit;

calculating, by the computer system, a feature amount of each of the plurality of images;

specifying, by the computer system, a shot period and a shot region of the plurality of chip regions based on comparison of the feature amount between the plurality of images; and

inspecting the semiconductor sample with the electron beam inspection apparatus using the shot period and the shot region;

wherein the computer system specifies a period or size of the shot region based on a period or size of the chip region; and

wherein the computer system provides a graphical user interface that displays an image at a reference position and an image at a position moved from the reference position at the period of the chip region or the period of the shot region for enabling a user to check and correct the period of the chip region or the period of the shot region based on a user operation of accepting or rejecting the period of the chip region or the period of the shot region.

Assignments (1)

Priority Claims (1)

Continuity (1)

References Cited (27)