Image display element
An image display element provides an image display element including a plurality of micro light-emitting elements arrayed in an array manner, and a semiconductor layer at which a drive circuit is disposed, the drive circuit being configured to supply a current to each of the plurality of micro light-emitting elements to cause light to be emitted, in which a transistor that constitutes the drive circuit and a wiring layer are disposed at a first surface of the semiconductor layer, the plurality of micro light-emitting elements are disposed at a second surface of the semiconductor layer that is an opposite side of the first surface, and the transistor and the wiring layer are electrically coupled to the micro light-emitting elements through a through substrate via that extends through the semiconductor layer.
1. An image display element comprising:
a plurality of micro light-emitting elements arrayed in an array manner; and
a semiconductor layer at which a drive circuit is disposed, the drive circuit being configured to supply a current to each of the plurality of micro light-emitting elements to emit light, wherein
the drive circuit comprises a transistor, the transistor and a wiring layer are disposed at a first surface of the semiconductor layer,
the plurality of micro light-emitting elements is disposed at a second surface of the semiconductor layer that is an opposite side of the first surface,
the transistor and the wiring layer are electrically coupled to the plurality of micro light-emitting elements through a through substrate via that extends through the semiconductor layer,
the plurality of micro light-emitting elements includes:
a first electrode disposed at a light emitting surface side of the plurality of micro light-emitting elements; and
a second electrode having a polarity opposite a polarity of the first electrode and disposed at a surface at an opposite side of the light emitting surface, and
the second electrode is electrically conductive to the through substrate via.
2. The image display element according to claim 1 ,
wherein the through substrate via has a cross section in a plan view in which an insulating layer is disposed outside and a conductive body is disposed inside.
3. The image display element according to claim 1 ,
wherein the through substrate via corresponds to each of the plurality of micro light-emitting elements.
4. The image display element according to claim 1 ,
wherein, at the second surface, the through substrate via is entirely covered with an electrode connection section.
5. The image display element according to claim 1 ,
wherein, at the second surface, the through substrate via is entirely covered with electrodes of the micro light-emitting elements at one side.
6. The image display element according to claim 1 ,
wherein, at the first surface, the through substrate via is coupled to an N-type diffusion layer or a P-type diffusion layer.
7. The image display element according to claim 1 ,
wherein the second surface is covered with an insulating film except for the through substrate via.
8. The image display element according to claim 1 ,
wherein, at the second surface of the semiconductor layer, the through substrate via is covered with a diffusion layer having a conductivity type opposite to a semiconductor layer main body which is a inner part of the semiconductor layer.
9. The image display element according to claim 1 ,
wherein, in a pixel area where the plurality of micro light-emitting elements are disposed,
a first well where the transistor is disposed is disposed at a first surface side of the semiconductor layer, and a third well having a conductivity type opposite to the first well is disposed at the second surface side of the first well.
10. The image display element according to claim 9 ,
wherein the third well is coupled to the wiring layer through a second well having a conductivity type opposite to the first well.
11. An image display element comprising:
a plurality of micro light-emitting elements arrayed in an array manner; and
a semiconductor layer at which a drive circuit is disposed, the drive circuit being configured to supply a current to each of the plurality of micro light-emitting elements to emit light, wherein
the drive circuit comprises a transistor, the transistor and a wiring layer are disposed at a first surface of the semiconductor layer,
the plurality of micro light-emitting elements is disposed at a second surface of the semiconductor layer that is an opposite side of the first surface,
the transistor and the wiring layer are electrically coupled to the plurality of micro light-emitting elements through a through substrate via that extends through the semiconductor layer,
the plurality of micro light-emitting elements includes:
a first electrode disposed at a light emitting surface side of the plurality of micro light-emitting elements; and
a second electrode having a polarity opposite a polarity of the first electrode and disposed at a surface at an opposite side of the light emitting surface,
the second electrode is electrically conductive to the through substrate via,
a connection area is disposed outside of a pixel area where the plurality of micro light-emitting elements is disposed, and
in the connection area, a connection element that connects the first electrode of the plurality of micro light-emitting elements and the wiring layer is disposed and a through substrate via coupled to the connection element is disposed.
12. The image display element according to claim 1 ,
wherein the micro light-emitting elements include an excitation light emitting element and a wavelength conversion portion.
13. The image display element according to claim 1 ,
wherein a periphery of the micro light-emitting elements is surrounded by a partition formed at the second surface of the semiconductor layer.
14. The image display element according to claim 13 ,
wherein the partition includes a protruding portion disposed at the second surface of the semiconductor layer and comprised of the semiconductor layer.