Substrate treating apparatus and substrate treating method
Disclosed is a substrate treating apparatus. The substrate treating apparatus includes an imaging unit that photographs loci of the one or more discharge liquids discharged from the plurality of nozzles, and an inspection unit that calculates impact points of the one or more discharge liquids discharged from the plurality of nozzles and determines whether the impact points of the one or more discharge liquids discharged from the plurality of nozzles are normal. The inspection unit includes an image synthesizing unit that synthesizes a plurality of images captured by the imaging unit, a pre-processing unit that pre-processes image data generated through the image synthesizing unit, and a calculation unit that calculates whether the impact points of the one or more discharge liquids discharged from the plurality of nozzles are normal by comparing the image data pre-processed by the pre-processing unit.
1. A substrate treating apparatus for treating a substrate, the substrate treating apparatus comprising:
a bowl provided to surround the substrate;
a nozzle discharging discharge liquid to the substrate drawing parabolas;
an imaging unit configured to photograph loci of the discharge liquid discharged from the nozzle; and
an inspection unit configured to:
convert a coordinate system into a polar coordinate system;
calculate an impact point of the discharge liquid discharged from the nozzle and determine whether the impact point of the discharge liquid discharged from the nozzle are normal by comparing whether the impact point of the discharge liquid discharged from the nozzle corresponds to threshold values ranges of the nozzle by using data values obtained in the converted polar coordinate system, the threshold value ranges of the nozzles being determined based on flow rate values in the nozzle and location of the loci according to the flow rate values; and
generate a binarized image of the loci,
wherein the nozzle protrudes from a basin of the bowl, such that, in a plan view, the nozzle is located outside of the substrate, and
wherein, in the comparing, the inspection unit compares an angle of the impact point, which is derived from an actually captured image, and an angle of the impact point set depending on the flow rate values in the nozzle.
2. The substrate treating apparatus of claim 1 , wherein the inspection unit includes:
a processor coupled to a memory storing instructions to permit the processor to function as:
an image synthesizing unit configured to synthesize a plurality of images captured by the imaging unit;
a pre-processing unit configured to pre-process image data generated through the image synthesizing unit; and
a calculation unit configured to calculate whether the impact point of the discharge liquid discharged from the nozzle are normal by comparing the image data pre-processed by the pre-processing unit.
3. The substrate treating apparatus of claim 2 , wherein the image synthesizing unit synthesizes the plurality of images, and synthesizes a maximum brightness value image of the plurality of images.
4. The substrate treating apparatus of claim 3 , wherein the pre-processing unit performs distance distortion correction of the image data generated through the image synthesizing unit.
5. The substrate treating apparatus of claim 4 , wherein the pre-processing unit detects a shape of the substrate from the image data, on which the distance distortion correction has been performed, and calculates a center point of the detected shape of the substrate.
6. The substrate treating apparatus of claim 5 , wherein the pre-processing unit converts the coordinate system into the polar coordinate system with respect to the center point.
7. The substrate treating apparatus of claim 1 , wherein the imaging unit is disposed at a location, at which the substrate is photographed obliquely.