Formation method of semiconductor device with contact structures
A structure and a formation method of a semiconductor device are provided. The method includes forming a first source/drain structure and a second source/drain structure over a semiconductor substrate. The method also includes forming a dielectric layer over the first source/drain structure and the second source/drain structure and forming a conductive contact on the first source/drain structure. The method further includes forming a first conductive via over the conductive contact, and the first conductive via is misaligned with the first source/drain structure. In addition, the method includes forming a second conductive via directly above the second source/drain structure, and the second conductive via is longer than the first conductive via.
1. A method for forming a semiconductor device structure, comprising:
forming a first source/drain structure and a second source/drain structure over a semiconductor substrate;
forming a dielectric layer over the first source/drain structure and the second source/drain structure;
forming a conductive contact on the first source/drain structure;
forming a first conductive via over the conductive contact, wherein the first conductive via is misaligned with the first source/drain structure; and
forming a second conductive via directly above the second source/drain structure, wherein the second conductive via is longer than the first conductive via.
2. The method for forming a semiconductor device structure as claimed in claim 1 , further comprising:
forming a first opening in the dielectric layer to expose the conductive contact;
forming a second opening in the dielectric layer, wherein the second opening exposes the second source/drain structure; and
forming a conductive material in the first opening and the second opening to form the first conductive via and the second conductive via, respectively.
3. The method for forming a semiconductor device structure as claimed in claim 2 , wherein the first opening is formed before the second opening.
4. The method for forming a semiconductor device structure as claimed in claim 2 , wherein the first opening and the second opening are formed in different etching processes.
5. The method for forming a semiconductor device structure as claimed in claim 1 , further comprising:
forming a first conductive line on the first conductive via; and
forming a second conductive line on the second conductive via, wherein a portion of the second conductive line is directly above the second source/drain structure.
6. The method for forming a semiconductor device structure as claimed in claim 1 , further comprising:
etching back the conductive contact such that a top surface of the conductive contact is lower than a top surface of the dielectric layer; and
forming a protective element over the conductive contact before the first conductive via is formed.
7. The method for forming a semiconductor device structure as claimed in claim 6 , further comprising:
forming a protective material layer over the conductive contact after the etching back of the conductive contact; and
partially removing the protective material layer using a planarization process, wherein a remaining portion of the protective material layer forms the protective element.
8. The method for forming a semiconductor device structure as claimed in claim 6 , wherein a top surface of the protective element is substantially level with the top surface of the dielectric layer.
9. The method for forming a semiconductor device structure as claimed in claim 6 , further comprising:
partially removing the protective element to form an opening exposing the conductive contact;
forming a conductive material layer to fill the opening; and
partially removing the conductive material layer using a planarization process, wherein a remaining portion of the conductive material layer forms the first conductive via.
10. The method for forming a semiconductor device structure as claimed in claim 6 , further comprising:
partially removing the protective element to form a first opening exposing the conductive contact;
partially removing the dielectric layer to form a second opening exposing the second source/drain structure;
forming a conductive material layer to fill the first opening and the second opening; and
partially removing the conductive material layer using a planarization process, wherein a first remaining portion and a second remaining portion of the conductive material layer form the first conductive via and the second conductive via, respectively.
11. A method for forming a semiconductor device structure, comprising:
forming a first source/drain structure and a second source/drain structure over a semiconductor substrate;
forming a dielectric layer over the first source/drain structure and the second source/drain structure;
forming a first opening laterally surrounded by the dielectric layer, wherein the first opening is vertically misaligned with the first source/drain structure;
forming a second opening laterally surrounded by the dielectric layer, wherein the second opening exposes the second source/drain structure;
forming a first conductive via in the first opening; and
forming a second conductive via in the second opening, wherein a top of the second conductive via is substantially level with a top of the first conductive via.
12. The method for forming a semiconductor device structure as claimed in claim 11 , further comprising:
forming a conductive contact electrically connected to the first source/drain structure;
etching back the conductive contact such that a top surface of the conductive contact is lower than a top surface of the dielectric layer; and
forming a protective element over the conductive contact before the first conductive via is formed.
13. The method for forming a semiconductor device structure as claimed in claim 12 , further comprising partially removing the protective element such that the first opening is formed.
14. The method for forming a semiconductor device structure as claimed in claim 11 , further comprising:
forming a conductive material layer to fill the first opening and the second opening; and
partially removing the conductive material layer, wherein a first remaining portion and a second remaining portion of the conductive material layer form the first conductive via and the second conductive via, respectively.
15. The method for forming a semiconductor device structure as claimed in claim 11 , wherein the second opening is deeper than the first opening.
16. A method for forming a semiconductor device structure, comprising:
forming a first source/drain structure and a second source/drain structure over a semiconductor substrate;
forming a conductive contact electrically connected to the first source/drain structure;
forming a protective element over the conductive contact;
forming a first conductive via to penetrate through the protective element and to electrically connect the conductive contact; and
forming a second conductive via electrically connected to the second source/drain structure, wherein the second conductive via is longer than the first conductive via.
17. The method for forming a semiconductor device structure as claimed in claim 16 , wherein the first conductive via is formed to be vertically misaligned with the first source/drain structure.
18. The method for forming a semiconductor device structure as claimed in claim 16 , wherein the second conductive via is formed to be vertically aligned with the second source/drain structure.
19. The method for forming a semiconductor device structure as claimed in claim 16 , wherein the protective element is formed to have a sidewall, and the sidewall directly meets a sidewall of the conductive contact.
20. The method for forming a semiconductor device structure as claimed in claim 16 , wherein the second conductive via is formed to have an inclined portion, and the inclined portion extends downwards to exceed the interface between the first conductive via and the conductive contact.