IP Library › Granted Patent US 12,306,480
Granted Patent B2
US 12,306,480 · App. 17/470,652 · Granted May 20, 2025

Glass interposer optical resonator device and method

Inventors: Hiroki Tanaka (Chandler, AZ); Brandon C Marin (Chandler, AZ); Kristof Darmawikarta (Chandler, AZ); Srinivas Venkata Ramanuja Pietambaram (Chandler, AZ); Jeremy D Ecton (Gilbert, AZ); Rajeev Ranjan (Phoenix, AZ)
Assignee: Intel Corporation
G02F1/035G02F1/0311
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Quick Facts
Patent No.
US 12,306,480
App. No.
17/470,652
Granted
May 20, 2025
Kind
B2
Abstract

An electro-optical system having one or more electro-optical devices integrally formed within a substrate and associated methods are disclosed. An electro-optical system including an electro-optic switch is shown. An electro-optical system including an electro-optic modulator is shown. An electro-optical system including an optical resonator is shown.

Claims (28)

1. An electro-optic system, comprising:

a photonic die;

a glass interposer coupled to the photonic die;

an optical fiber connector coupled to the glass interposer, and an optical resonator integrated with the glass interposer and coupled between the optical fiber connector and the photonic die, wherein:

the photonic die is paired with a semiconductor die in a chip sub-assembly; and

the photonic die and semiconductor die are coupled together by a bridge die located beneath both the photonic die and the semiconductor die.

2. The electro-optic system of claim 1 , wherein the optical resonator includes a cavity in the glass interposer and a pair of partially reflective mirrors.

3. The electro-optic system of claim 1 , wherein the optical resonator includes a rare earth material region and a pair of partially reflective mirrors.

4. The electro-optic system of claim 3 , wherein the rare earth material region includes Er3+ dopant in the glass interposer.

5. The electro-optic system of claim 1 , wherein the photonic die is recessed within a cavity in the glass interposer to align with at least one waveguide formed in the glass interposer.

6. The electro-optic system of claim 1 , wherein multiple optical resonators are coupled in series, and integrated with the glass interposer and coupled between the optical fiber connector and the photonic die.

7. The electro-optic system of claim 1 , further including a wavelength multiplexer between the optical fiber connector and the photonic die with multiple waveguides multiplexed to a single optical fiber.

8. The electro-optic system of claim 7 , wherein each of the multiple waveguides includes a respective optical resonator.

9. A computing system, comprising:

a device housing;

an electro-optic system within the device housing, the electro-optic system comprising:

a photonic die;

a glass interposer coupled to the photonic die;

an optical fiber connector coupled to the glass interposer, and an optical resonator integrated with the glass interposer and coupled between the optical fiber connector and the photonic die, wherein:

the photonic die is paired with a semiconductor die in a chip sub-assembly; and

the photonic die and semiconductor die are coupled together by a bridge die located beneath both the photonic die and the semiconductor die; and

one or more memory dies coupled to the electro-optic system.

10. The computing system of claim 9 , further including an antenna.

11. The computing system of claim 9 , wherein the device housing includes a server device housing.

12. The computing system of claim 9 , wherein the photonic die is paired with a semiconductor die in a chip sub-assembly.

13. The computing system of claim 9 , wherein the photonic die is recessed within a cavity in the glass interposer to align with at least one waveguide formed in the glass interposer.

14. The computing system of claim 9 , wherein multiple optical resonators are coupled in series, and integrated with the glass interposer and coupled between the optical fiber connector and the photonic die.

15. The computing system of claim 9 , further including a wavelength multiplexer between the optical fiber connector and the photonic die with multiple waveguides multiplexed to a single optical fiber.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 16, 2022
From: TANAKA, HIROKI; MARIN, BRANDON C; DARMAWIKARTA, KRISTOF; PIETAMBARAM, SRINIVAS VENKATA RAMANUJA; ECTON, JEREMY D; RANJAN, RAJEEV
To: INTEL CORPORATION
Reel/Frame 059027/0418 →
Continuity (1)
Related Publication 20230072096A1 · Mar 9, 2023
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