Glass interposer optical switching device and method
An electro-optical system having one or more electro-optical devices integrally formed within a substrate and associated methods are disclosed. An electro-optical system including an electro-optic switch is shown. An electro-optical system including an electro-optic modulator is shown. An electro-optical system including an optical resonator is shown.
1. An electro-optic system, comprising:
a plurality of photonic dies;
a glass interposer coupled to the plurality of photonic dies; and
an electro-optic switch integrated with the glass interposer and coupled between two or more of the plurality of photonic dies, wherein:
a photonic die of the plurality of photonic dies is paired with a semiconductor die in a chip sub-assembly; and
the photonic die and the semiconductor die are coupled together by a bridge die located beneath both the photonic die and the semiconductor die.
2. The electro-optic system of claim 1 , wherein the glass interposer includes an electro-optical material layer and wherein the electro-optic switch includes a pair of parallel waveguides that are at least partially formed from the electro-optical material layer.
3. The electro-optic system of claim 2 , wherein the electro-optical material layer includes LiNbO 3 .
4. The electro-optic system of claim 1 , wherein the glass interposer includes an electro-optical material layer and wherein the photonic die of the plurality of photonic dies is recessed within a cavity in the glass interposer to align with at least one waveguide formed in the electro-optical material layer.
5. The electro-optic system of claim 1 , wherein the glass interposer includes an electro-optical material layer and wherein the electro-optic switch includes a pair of parallel waveguides that are at least partially formed from the electro-optical material layer, and
further including one or more control electrodes of the electro-optic switch formed from a metallic layer on the electro-optical material layer.
6. The electro-optic system of claim 1 , further including a wirebond coupled between the photonic die and the electro-optic switch to control the electro-optic switch.
7. A computing system, comprising:
a device housing;
an electro-optic system within the device housing, the electro-optic system comprising:
a photonic die;
a glass interposer coupled to the photonic die;
an optical fiber connector coupled to the glass interposer; and
an electro-optic switch integrated with the glass interposer and coupled between the optical fiber connector and the photonic die, wherein:
the photonic die is paired with a semiconductor die in a chip sub-assembly; and
the photonic die and the semiconductor die are coupled together by a bridge die located beneath both the photonic die and the semiconductor die; and
one or more memory dies coupled to the electro-optic system.
8. The computing system of claim 7 , further including an antenna.
9. The computing system of claim 7 , wherein the device housing includes a server device housing.
10. The computing system of claim 7 , wherein the photonic die is paired with a semiconductor die in a chip sub-assembly.
11. The computing system of claim 7 , wherein the glass interposer includes an electro-optical material layer and wherein a waveguide of the electro-optic switch is at least partially formed from the electro-optical material layer.
12. The computing system of claim 11 , wherein the electro-optical material layer includes LiNbO 3 .
13. The computing system of claim 7 , wherein the glass interposer includes an electro-optical material layer and wherein the photonic die is recessed within a cavity in the glass interposer to align with at least one waveguide formed in the electro-optical material layer.
14. The computing system of claim 7 , wherein the glass interposer includes an electro-optical material layer and wherein the electro-optic switch includes a pair of parallel waveguides that are at least partially formed from the electro-optical material layer, and
further including one or more control electrodes of the electro-optic switch formed from a metallic layer on the electro-optical material layer.
15. The computing system of claim 7 , further including a wirebond coupled between the photonic die and the electro-optic switch to control the electro-optic switch.