IP Library › Granted Patent US 11,775,004
Granted Patent B2
US 11,775,004 · App. 17/471,442 · Granted Oct 3, 2023

Phase aligning and calibrating clocks from one phase lock loop (PLL) for a two-chip die module

Inventors: Douglas J. Malone (Pleasant Valley, NY); Andreas H. A. Arp (Nufringen, DE); Franklin M. Baez (Fishkill, NY); Daniel M. Dreps (Georgetown, TX); Jason Lee Frankel (Wappingers Falls, NY); Chad Andrew Marquart (Austin, TX); Ching Lung Tong (Highland Mills, NY); Lily Jielu Zhang (Wappingers Falls, NY)
Assignee: International Business Machines Corporation
G06F1/12G06F1/08H03L7/085
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Quick Facts
Patent No.
US 11,775,004
App. No.
17/471,442
Granted
Oct 3, 2023
Kind
B2
Abstract

A two-chip die module with minimal chip-to-chip clock skew is provided. The two-chip die module includes a common substrate, first and second chips operably disposed on the common substrate to be communicative in parallel with one another and a single phase lock loop (PLL). The PLL is disposed within one of the first and second chips to provide a source for a common clock signal for the first and second chips. PLL signals of the PLL to the first and second chips are nearly equal and clock sample signals of the first and second chips are nearly equal.

Claims (27)

1. A computer-implemented method of clock calibration for each of a first chip and a second chip of a two-chip die module, the first chip comprising a clock distribution unit to generate an output for a clock sample point of the first chip and the second chip comprising a clock distribution unit to generate an output for a clock sample point of the second chip, the method comprising:

arranging layouts of the first and second chips to provide equal delays between a skew adjust and phase detect unit of the second chip and the clock sample points of each of the first and second chips;

setting a voltage signal to a prescribed value for each of the first and second chips;

programming each of the first and second chips for minimal chip switching activity;

setting a programmable delay to a predefined value for each of the first and second chips;

starting clocks on each of the first and second chips and measuring a skew of the second chip from a comparison of relative edge positions of the clock of each of the first and second chips;

incrementally adjusting a latency of the second chip until the skew of each of the first and second chips shows phase alignment of the clock of each of the first and second chips; and

storing the skew of the second chip as a setting once the phase alignment is achieved.

2. The computer-implemented method according to claim 1 , wherein the predefined value is a 50% midpoint for both of the first and second chips.

3. The computer-implemented method according to claim 1 , wherein the incrementally adjusting of the latency of the second chip comprises increasing or decreasing the latency of the second chip.

4. The computer-implemented method according to claim 1 , further comprising:

periodically sampling a clock phase of one of the first and second chips versus the clock phase of the other of the first and second chips; and

making appropriate programmable delay adjustments to along the clock phase of the one of the first and second chips with the clock phase of the other of the first and second chips.

5. A computer program product for clock calibration for each of a first chip and a second chip of a two-chip die module, the first chip comprising a clock distribution unit to generate an output for a clock sample point of the first chip and the second chip comprising a clock distribution unit to generate an output for a clock sample point of the second chip, the computer program product comprising:

a computer-readable storage medium having program instructions embodied therewith, the program instructions executable by one or more processors to cause the one or more processors to perform a method comprising:

arranging layouts of the first and second chips to provide equal delays between a skew adjust and phase detect unit of the second chip and the clock sample points of each of the first and second chips;

setting a voltage signal to a prescribed value for each of the first and second chips;

programming each of the first and second chips for minimal chip switching activity;

setting a programmable delay to a predefined value for each of the first and second chips;

starting clocks on each of the first and second chips and measuring a skew of the second chips from a comparison of relative edge positions of the clock of each of the first and second chips;

incrementally adjusting a latency of the second chip until the skew of each of the first and second chips shows phase alignment of the clock of each of the first and second chips; and

storing the skew of the second chip as a setting once the phase alignment is achieved.

6. The computer program product according to claim 5 , wherein the predefined value is a 50% midpoint for both of the first and second chips.

7. The computer program product according to claim 5 , wherein the incrementally adjusting of the latency of the second chip comprises increasing or decreasing the latency of the second chip.

8. The computer program product according to claim 5 , wherein the method further comprises:

periodically sampling a clock phase of one of the first and second chips versus the clock phase of the other of the first and second chips; and

making appropriate programmable delay adjustments to along the clock phase of the one of the first and second chips with the clock phase of the other of the first and second chips.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 10, 2021
From: MALONE, DOUGLAS J.; ARP, ANDREAS H. A.; BAEZ, FRANKLIN M.; DREPS, DANIEL M.; FRANKEL, JASON LEE; MARQUART, CHAD ANDREW; TONG, CHING LUNG; ZHANG, LILY JIELU
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 057444/0507 →
Continuity (1)
Related Publication 20230085155A1 · Mar 16, 2023
Cited By (1)
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