Heat sink with counter flow diverging microchannels
The present invention provides a microchannel heat sink with plural microchannels, each having a respective inlet and outlet to permit flow, in particular two-phase flow, of a working fluid. The plural microchannels are arranged such that adjacent microchannels accommodate flow of working fluid in opposite directions and are thermally coupled to each other to enable heat exchange between the corresponding adjacent microchannels. In one aspect, a microchannel inlet is positioned at an angle (e.g., 90 degrees) with respect to its outlet. The plural microchannels define parallel longitudinal axes that are optionally arranged on the same plane and/or side-by-side in a single layer. Further, in one aspect, each microchannel cross-sectional area increases as the channel length progresses from an upstream end (e.g., adjacent to the inlet) to a downstream end (e.g., adjacent to the outlet) of the corresponding microchannel.
1. A microchannel heat sink, comprising:
a plurality of approximately parallel microchannels, each microchannel including a working fluid inlet including an opening for receiving the working fluid and a working fluid outlet including an opening for discharging the working fluid away from the heat sink positioned at approximately opposite ends of the heat sink,
each working fluid inlet of a first microchannel being positioned adjacent to a working fluid outlet of a second, adjacent microchannel such that the plurality of approximately parallel microchannels have alternating working fluid flows in opposite directions for each adjacent pair of microchannels,
each microchannel is thermally coupled to an adjacent microchannel for heat exchange between the adjacent microchannels;
each microchannel being dimensioned and configured such that the working fluid entering the microchannel experiences two-phase flow of the working fluid including at least one vapor phase and at least one liquid phase, and wherein each microchannel working fluid inlet is at an angle to its corresponding working fluid outlet.
2. The microchannel heat sink of claim 1 , wherein each microchannel working fluid inlet is at an angle of approximately 90 degrees with respect to its corresponding working fluid outlet.
3. The microchannel heat sink of claim 1 , wherein each microchannel includes a pair of microchannel sidewalls.
4. The microchannel heat sink of claim 3 , wherein the pair of microchannel sidewalls diverges at an angle of between zero and one degree.
5. The microchannel heat sink of claim 1 , wherein the plurality of microchannels define parallel longitudinal axes that are arranged on the same plane.
6. The microchannel heat sink of claim 1 , wherein each of the plurality of microchannels has a cross-sectional area that gradually increases between the microchannel working fluid inlet and the corresponding microchannel working fluid outlet.
7. The microchannel heat sink of claim 1 , wherein each of the plurality of microchannels has a depth that gradually increases between the microchannel working fluid inlet and the corresponding microchannel working fluid outlet.
8. The microchannel heat sink of claim 1 , wherein each of the plurality of microchannels has a width that gradually increases between the microchannel working fluid inlet and the corresponding microchannel working fluid outlet.
9. The microchannel heat sink of claim 1 , wherein each of the plurality of microchannels has an approximately similar size and shape.
10. The microchannel heat sink of claim 1 , wherein each microchannel includes a pair of microchannel walls arranged to separate corresponding adjacent microchannels such that each adjacent microchannel shares one common wall to enable thermal coupling between the corresponding adjacent microchannels.
11. The microchannel heat sink of claim 1 , wherein the heat sink comprises one or more thermally conductive metals, alloys or composites.
12. The microchannel heat sink of claim 11 , wherein the heat sink comprises one or more of aluminum, an aluminum alloy, copper, or a copper alloy.
13. The microchannel heat sink of claim 10 , wherein the microchannel walls are connected to form a continuous wall in a boustrophedonic form.
14. The microchannel heat sink of claim 10 , wherein each of the microchannel walls includes one or more surfaces that are roughened, include projections, or include recesses to provide bubble nucleation sites.
15. A thermal management system comprising:
one or more microchannel heat sinks of claim 1 ;
a working fluid storage container for storing working fluid; and
a fluid circulation system fluidly connected with the working fluid storage and the one or more microchannel heat sinks.
16. An electronic device or component positioned adjacent to a microchannel heat sink of claim 1 .