POLISHING MECHANISM, POLISHING DEVICE, AND POLISHING METHOD
A polishing system for polishing a workpiece includes a sensor group detecting pressure information of the workpiece and generating a pressure sequence; a processor coupled to the sensor group and configured to: receive the pressure sequence; generate indication information including a predetermined track of a polishing head to polish the workpiece; based on the pressure sequence and the indication information, generate a deviation sequence of the pressure sequence; and based on the deviation sequence, generate an adjustment instruction, to adjust a position of the polishing head. A polishing method, an assistant polishing device, an assistant polishing system, and an assistant polishing method are also disclosed.
1 . A polishing system configured to polish a workpiece, the polishing system comprising:
a sensor group configured to detect pressure information of the workpiece and generate a pressure sequence;
a processor coupled to the sensor group and configured to:
receive the pressure sequence;
generate indication information, wherein the indication information is configured to indicate a polishing head polishing the workpiece at a predetermined track;
based on the pressure sequence and the indication information, generate a deviation sequence of the pressure sequence; and
based on the deviation sequence, generate an adjustment instruction, wherein the adjustment instruction is configured to adjust a position of the polishing head to polish the workpiece.
2 . The polishing system according to claim 1 , wherein the indication information further comprises a preset position and a conversion relationship, wherein the preset position is a calculable position of the polish head relative to polish the workpiece, and the conversion relationship is a conversion formula of a relationship between pressures generated by the polish head and deformation information of polish material of the polish head, the processor is further configured to:
according to a rigid parameter of material of the polish head, determine the conversion relationship;
based on the pressure sequence and the conversion relationship, generate deformation information, wherein the deformation information correspond to the pressure sequence; and
based on the pressure sequence and the preset position, generate the deviation sequence.
3 . The polishing system according to claim 1 , wherein the processor is further configured to:
generate adjusted pressure sequence by a filter according to the pressure sequence; and
determine the deviation sequence according to the adjusted pressure sequence and the indication information.
4 . The polishing system according to claim 1 , wherein the indication information further comprises a first operating track, the processor is further configured to:
select an apparatus to polish the workpiece comprising a machine assembly and the polish head; and
generate the first operating track based on the selected apparatus to polish the workpiece comprising the machine assembly and the polish head, wherein the first operating track is an operating track of the polish head of the apparatus; and
generate the deviation sequence based on the pressure sequence and the first operating track.
5 . The polishing system according to claim 4 , wherein the processor is further configured to:
based on the selected apparatus to polish the workpiece comprising the machine assembly and the polish head, generate a base track and a first adjustment value; wherein the base track is an operating track of the polish head and the base track is on a planar formed by a first direction and a third direction; the first adjustment value is an adjustment sequence loaded on the base track and on a planar formed by a second direction and the third direction; the first, the second, and the third directions are perpendicular to each other; and the first direction is a direction of the polish head towards the workpiece;
based on the base track and the first adjustment value, generate the first operating track.
6 . The polishing system according to claim 4 , wherein the processor is further configured to:
based on the selected apparatus comprising the machine assembly and the polish head, generate a base track and a third adjustment value; the base track is an operating track of the polish head on a planar formed by a first direction and a third direction; the third adjustment value is a fixed value loaded on the base track in the first direction; the first direction is perpendicular to the third direction; and the first direction is a direction of the polish head towards the workpiece; and
based on the base track and the third adjustment value, generate the first operating track.
7 . The polishing system according to claim 4 , wherein the processor is further configured to:
based on the selected apparatus comprising the machine assembly and the polish head, generate a base track and a fourth adjustment value; the base track is an operating track of the polish head on a planar formed by a first direction and a third direction; the fourth adjustment value is a variation loaded on the base track in the first direction; the first direction is perpendicular to the third direction; and the first direction is a direction of the polish head towards the workpiece;
based on the base track and the fourth adjustment value, generate the first operating track.
8 . The polishing system according to claim 7 , wherein the indication information further comprises a second operating track, the processor is further configured to:
determine the selected apparatus further comprises a holder, wherein the holder is configured to hold, rotate, and move the workpiece;
based on the selected apparatus further comprises the holder, generate the second operating track, the second track is a move track of the workpiece;
based on the pressure sequence, the first operating track, and the second operating track, generate the deviation sequence.
9 . The polishing system according to claim 8 , wherein the indication information further comprises rounding information, the processor is further configured to:
based on the selected apparatus further comprises the holder, determine the rounding information;
based on the rounding information, calculate a rounding track of the first operating track corresponding to the rounding information; and
based on the rounding track, generate the second operating track.
10 . The polishing system according to claim 9 , wherein the processor is further configured to:
based on the second operating track and the rounding track, adjust the first operating track and the third operating track; and
based on the pressure sequence, the third operating track, and the second operating track, generate the deviation sequence.
11 . A polishing method configured to control a polish head of a machine assembly to polish a workpiece, the polishing method comprising:
receiving a pressure sequence, the pressure sequence generated based on detecting pressure information of the workpiece by a sensor group;
generating indication information, wherein the indication information is configured to indicate a polishing head polishing the workpiece;
based on the pressure sequence and the indication information, generating a deviation sequence of the pressure sequence; and
based on the deviation sequence, generating an adjustment instruction, wherein the adjustment instruction is configured to adjust a position of the polishing head to polish the workpiece.
12 . The polishing method according to claim 11 , wherein the indication information further comprises a preset position and a conversion relationship, wherein the preset position is a calculable position of the polish head relative to polish the workpiece, and the conversion relationship is a conversion formula of a relationship between pressures generated by the polish head and deformation information of polish material of the polish head, the polishing method further comprises:
according to a rigid parameter of the polish material of the polish head, determining the conversion relationship;
based on the pressure sequence and the conversion relationship, generating deformation information, wherein the deformation information correspond to the pressure sequence; and
based on the pressure sequence and the preset position, generating the deviation sequence.
13 . The polishing method according to claim 11 , wherein the generating a deviation sequence of the pressure sequence comprising:
generating adjusted pressure sequence by a filter according to the pressure sequence; and
determining the deviation sequence according to the adjusted pressure sequence and the indication information.
14 . The polishing method according to claim 11 , wherein the indication information further comprises a first operating track, the generating the deviation sequence comprises:
selecting an apparatus to polish the workpiece comprising a machine assembly and the polish head;
generating the first operating track based on the selected apparatus to polish the workpiece comprising the machine assembly and the polish head, wherein the first operating track is an operating track of the polish head of the apparatus; and
generating the deviation sequence based on the pressure sequence and the first operating track.
15 . The polishing method according to claim 14 , wherein the generating the first operating track comprises:
based on the selected apparatus to polish the workpiece comprising the machine assembly and the polish head, generating a base track and a first adjustment value; wherein the base track is an operating track of the polish head and the base track is on a planar formed by a first direction and a third direction; the first adjustment value is an adjustment sequence loaded on the base track and on a planar formed by a second direction and the third direction; the first, the second, and the third directions are perpendicular to each other; and the first direction is a direction of the polish head towards the workpiece;
based on the base track and the first adjustment value, generating the first operating track.
16 . The polishing method according to claim 14 , wherein the generating the first operating track comprises:
based on the selected apparatus comprising the machine assembly and the polish head, generating a base track and a third adjustment value; the base track is an operating track of the polish head on a planar formed by a first direction and a third direction; the third adjustment value is a fixed value loaded on the base track in the first direction; the first direction is perpendicular to the third direction; and the first direction is a direction of the polish head towards the workpiece; and
based on the base track and the third adjustment value, generating the first operating track.
17 . The polishing method according to claim 14 , wherein the generating the first operating track comprises:
based on the selected apparatus comprising the machine assembly and the polish head, generating a base track and a fourth adjustment value; the base track is an operating track of the polish head on a planar formed by a first direction and a third direction; the fourth adjustment value is a variation loaded on the base track in the first direction; the first direction is perpendicular to the third direction; and the first direction is a direction of the polish head towards the workpiece;
based on the base track and the fourth adjustment value, generating the first operating track.
18 . The polishing method according to claim 17 , wherein the indication information further comprises a second operating track, the generating a deviation sequence of the pressure sequence comprising:
determining the selected apparatus further comprises a holder, wherein the holder is configured to hold, rotate, and move the workpiece;
based on the selected apparatus further comprises the holder, generating the second operating track, the second track is a move track of the workpiece;
based on the pressure sequence, the first operating track, and the second operating track, generating the deviation sequence.
19 . The polishing method according to claim 18 , wherein the indication information further comprises rounding information, the generating the second operating track comprises:
based on the selected apparatus further comprises the holder, determine the rounding information;
based on the rounding information, calculate a rounding track of the first operating track corresponding to the rounding information; and
based on the rounding track, generate the second operating track.
20 . The polishing method according to claim 19 , wherein the generating a deviation sequence of the pressure sequence comprises:
based on the second operating track and the rounding track, adjusting the first operating track and the third operating track; and
based on the pressure sequence, the third operating track, and the second operating track, generating the deviation sequence.