Smart bandage
A sensing chip attached to a bandage monitors the healing process of a wound by detecting growth factors, thrombin and fibrinogen. The complementary metal-oxide semiconductor includes a functionalized working electrode, functionalized counter electrode and functionalized reference electrode. The healing progress is stimulated by generating oxygen in the wound.
1. A disposable wound-healing monitoring device comprising:
a bandage having a first surface configured to face a wound;
a sensor attached to the bandage on the first surface, the sensor comprising a complementary metal-oxide semiconductor chip, the complementary metal-oxide semiconductor chip comprising an electrode; and
a selectively thrombin-binding or selectively fibrinogen-binding aptamer attached to a wound-facing surface of the electrode,
wherein the complementary metal-oxide semiconductor chip is configured to monitor an amount of thrombin or fibrinogen in the wound as a function of time by
detecting over time an absence or presence of thrombin or fibrinogen in the wound based on the selectively thrombin-binding aptamer binding or not binding to thrombin or the selectively fibrinogen-binding aptamer binding or not binding to fibrinogen,
generating a corresponding signal, and
monitoring healing of the wound over time based on said corresponding signal.
2. The device of claim 1 , wherein the sensor is configured to generate oxygen within the wound.
3. The device of claim 2 , wherein the sensor is configured to be powered wirelessly by a reader device, and to communicate wirelessly with the reader device.
4. The device of claim 3 , wherein the sensor and the reader device each comprise a coil, the coils configured to transmit power to the sensor and to communicate between the sensor and the reader device.
5. The device of claim 1 , further comprising a thiol group attached to the thrombin binding aptamer.
6. The device of claim 1 , wherein the electrode is made in a form of concentric shapes.
7. The device of claim 6 , wherein the concentric shapes comprise squares.
8. The device of claim 6 , wherein the electrode is fabricated on a surface of the complementary metal-oxide semiconductor chip.
9. The device of claim 1 , further comprising glucose oxidase or glucose dehydrogenase on the electrode, the device being configured to measure a current on the electrode, thereby measuring glucose.
10. The device of claim 1 , wherein the complementary metal-oxide semiconductor chip is configured to measure a process of hemostasis and inflammation to identify infections in wounds.
11. A method comprising:
providing a complementary metal-oxide semiconductor sensor chip comprising an electrode having a conductive surface;
attaching the complementary metal-oxide semiconductor sensor chip to a bandage;
attaching a selectively thrombin-binding or selectively fibrinogen-binding aptamer to the conductive surface of the electrode, the conductive surface configured to face a wound;
monitoring an amount of thrombin or fibrinogen in the wound as a function of time by
detecting over time an absence or presence of thrombin or fibrinogen in the wound based on the selectively thrombin-binding aptamer binding or not binding to thrombin or the selectively fibrinogen-binding aptamer binding or not binding to fibrinogen,
generating a corresponding signal, and
monitoring healing of the wound over time based on said corresponding signal.