Bottom barrier free interconnects without voids
Bottom barrier free interconnects are provided. In one aspect, an interconnect structure includes: metal lines embedded in a dielectric; an interlayer dielectric (ILD) disposed over the metal lines; interconnects formed in the ILD on top of the metal lines; a barrier layer separating the interconnects from the ILD, wherein the barrier layer is absent in between the interconnects and the metal lines; and a selective capping layer disposed on the interconnects.
1. An interconnect structure, comprising:
a metal line embedded in a dielectric;
an interlayer dielectric (ILD) disposed over the metal line;
a first interconnect formed in the ILD on top of the metal line, wherein:
the first interconnect directly contacts the metal line;
the first interconnect comprises a plurality of vias; and
all sidewalls of the plurality of vias are parallel to one another;
a barrier layer separating the first interconnect from the ILD;
a selective capping layer disposed on the first interconnect;
a blanket capping layer disposed (i) on the selective capping layer and the ILD and (ii) over the first interconnect and a second interconnect, wherein:
the selective capping layer and the blanket capping layer are different materials; and
top surfaces of the selective capping layer and the ILD are coplanar; and
a second plurality of vias passing through the blanket capping layer and the selective capping layer, wherein the second plurality of vias directly contact the first interconnect.
2. The interconnect structure of claim 1 , wherein the first interconnect is void-free.
3. The interconnect structure of claim 1 , wherein the first interconnect comprises a conductor selected from the group consisting of: cobalt (Co), ruthenium (Ru), rhodium (Rh), and iridium (Ir).
4. The interconnect structure of claim 1 , wherein the first interconnect comprises a conductor selected from the group consisting of: Co and Ru.
5. The interconnect structure of claim 1 , wherein the selective capping layer is nickel (Ni).
6. The interconnect structure of claim 1 , wherein the selective capping layer comprises Ru.
7. The interconnect structure of claim 1 , wherein the barrier layer comprises tantalum nitride (TaN).
8. The interconnect structure of claim 1 , wherein the barrier layer has a thickness of less than 1 nm.
9. The interconnect structure of claim 1 , wherein the ILD comprises porous organosilicate glass (pSiCOH).
10. An interconnect structure, comprising:
a metal line embedded in a dielectric;
an interlayer dielectric (ILD) disposed over the metal line;
a first interconnect formed in the ILD on top of the metal line, wherein:
the first interconnect comprises cobalt (Co);
the first interconnect directly contacts the metal line;
the first interconnect comprises a plurality of vias; and
all sidewalls of the plurality of vias are parallel to one another;
a barrier layer separating the first interconnect from the ILD;
a selective capping layer disposed on the first interconnect;
a blanket capping layer disposed (i) on the selective capping layer and the ILD and (ii) over the first interconnect and a second interconnect, wherein:
the selective capping layer and the blanket capping layer are different materials; and
top surfaces of the selective capping layer and the ILD are coplanar; and
a second plurality of vias passing through the blanket capping layer and the selective capping layer, wherein the second plurality of vias directly contact the first interconnect.
11. The interconnect structure of claim 10 , wherein the first interconnect is void-free.
12. The interconnect structure of claim 10 , wherein the selective capping layer is nickel (Ni).
13. The interconnect structure of claim 10 , wherein the selective capping layer comprises Ru.
14. The interconnect structure of claim 10 , wherein the barrier layer comprises tantalum nitride (TaN).
15. The interconnect structure of claim 10 , wherein the barrier layer has a thickness of less than 1 nm.
16. The interconnect structure of claim 10 , wherein the blanket capping layer comprises a nitride material.
17. The interconnect structure of claim 16 , wherein the nitride material is selected from the group consisting of: silicon nitride (SiN), silicon carbonitride (SiCN), and silicon oxycarbonitride (SiOCN).
18. The interconnect structure of claim 10 , wherein the ILD comprises porous organosilicate glass (pSiCOH).