Semiconductor device having contact plug connected to gate structure on PMOS region
A semiconductor device including a substrate having a NMOS region and a PMOS region; a metal gate extending continuously along a first direction from the NMOS region to the PMOS region on the substrate; a first source/drain region extending along a second direction adjacent to two sides of the metal gate on the NMOS region; a second source/drain region extending along the second direction adjacent to two sides of the metal gate on the PMOS region; a first contact plug landing on the second source/drain region adjacent to one side of the metal gate; a second contact plug landing on the second source/drain region adjacent to another side of the metal gate; and a third contact plug landing directly on a portion of the metal gate on the PMOS region and between the first contact plug and the second contact plug.
1. A semiconductor device, comprising:
a substrate having a NMOS region and a PMOS region;
a metal gate extending continuously along a first direction from the NMOS region to the PMOS region on the substrate;
a first source/drain region extending along a second direction adjacent to two sides of the metal gate on the NMOS region;
a second source/drain region extending along the second direction adjacent to two sides of the metal gate on the PMOS region;
a first contact plug landing on the second source/drain region adjacent to one side of the metal gate;
a second contact plug landing on the second source/drain region adjacent to another side of the metal gate; and
a third contact plug landing directly on a portion of the metal gate on the PMOS region and between the first contact plug and the second contact plug, wherein the first contact plug, the second contact plug, and the third contact plug form a straight line extending along the second direction.
2. The semiconductor device of claim 1 , wherein the third contact plug is disposed on the metal gate directly on top of a channel region between the second source/drain region.
3. A semiconductor device, comprising:
a substrate having a NMOS region and a PMOS region;
a metal gate extending continuously along a first direction from the NMOS region to the PMOS region on the substrate;
a first source/drain region extending along a second direction adjacent to two sides of the metal gate on the NMOS region;
a second source/drain region extending along the second direction adjacent to two sides of the metal gate on the PMOS region;
a first contact plug landing on the second source/drain region adjacent to one side of the metal gate;
a second contact plug landing on the second source/drain region adjacent to another side of the metal gate; and
a third contact plug landing directly on a portion of the metal gate on the PMOS region and between the second source/drain region and a boundary separating the NMOS region and the PMOS region.
4. A semiconductor device, comprising:
a substrate having a NMOS region and a PMOS region;
a metal gate extending continuously along a first direction from the NMOS region to the PMOS region on the substrate;
a first source/drain region extending along a second direction adjacent to two sides of the metal gate on the NMOS region;
a second source/drain region extending along the second direction adjacent to two sides of the metal gate on the PMOS region;
a first contact plug landing on the second source/drain region adjacent to one side of the metal gate;
a second contact plug landing on the second source/drain region adjacent to another side of the metal gate; and
a third contact plug landing directly on a portion of the metal gate on the PMOS region and not between the first source/drain region and the second source/drain region and away from a boundary separating the NMOS region and the PMOS region.
5. The semiconductor device of claim 4 , wherein the third contact plug is landing near an end of the metal gate on the PMOS region.