Substrate processing device
A substrate processing device includes: a chamber; a substrate processing mechanism that has a holding member, and discharges a processing fluid onto a substrate held by the holding member; a joint pipe that has a lower opening provided below the holding member, and an upper opening provided above the holding member, and is disposed such that at least part of the joint pipe from the lower opening to the upper opening passes through the outside of the chamber; and an air flow generator that is provided in the joint pipe. The air flow generator circulates an atmosphere in the chamber by discharging the atmosphere in the chamber from the lower opening to the joint pipe to allow the atmosphere to pass through the joint pipe, thereby introducing the atmosphere again into the chamber via the upper opening so that a downflow of the atmosphere occurs in the chamber.
1. A substrate processing method, comprising the steps of:
(a) operating a substrate processing device including:
a plurality of chambers;
a plurality of substrate processing mechanisms, each having a holding member capable of holding a substrate in a substantially horizontal state each being housed in a respective one of said plurality of chambers and each discharging a processing fluid onto the substrate held by said holding member to process said substrate;
a joint pipe that has a plurality of lower openings, each said lower opening being provided below a respective one of said holding members and facing an inside of a respective one of said plurality of chambers, and a plurality of upper openings, each said upper opening being provided above said respective one of said holding members and facing the inside of said plurality of chambers, and said joint pipe including a section that extends outside of said plurality of chambers; and
an air flow generator that is provided in said joint pipe,
a pipe for an external exhaust equipment, which pipe branches off from said joint pipe to cause said joint pipe to communicate with said external exhaust equipment, and guide an atmosphere discharged to said joint pipe into said external exhaust equipment,
a return pipe defined by a section of said joint pipe extending from a downstream side of a flow of said atmosphere circulated by said air flow generator with respect to said pipe to said plurality of upper openings,
an on-off valve mechanisms controllable to selectively actuate said return pipe and said pipe into an open state and into a closed state, and
a controller for controlling said on-off valve mechanism, said controller including a storage that stores an exhaust amount parameter associated with said substrate processing device,
(b) circulating said atmosphere containing a specific gas in said plurality of chambers by discharging said atmosphere in said plurality of chambers from said plurality of lower openings to said joint pipe to allow said atmosphere to pass through said joint pipe by said air flow generator, thereby introducing said atmosphere into said plurality of chambers via said plurality of upper openings so that a downflow of said atmosphere occurs in said plurality of chambers, and
(c) operating said controller to control said on-off mechanisms by reference to said exhaust amount for bringing said return pipe into an open state and bringing said pipe for exhaust equipment into a closed state when a required exhaust amount of said substrate processing device exceeds said exhaust amount allocated to said substrate processing device and bringing said return pipe into the closed state and bringing said pipe for exhaust equipment into the open state when said required exhaust amount does not exceed said exhaust amount allocated.
2. The substrate processing method according to claim 1 , wherein
said step (c) is performed according to control information, and
said control information includes information in which a process of substrate processing that said substrate processing device is capable of executing and an opening and closing state of said on-off valve mechanism are correlated with each other so that said opening and closing control can be executed.
3. The substrate processing method according to claim 1 , wherein
said step (c) is performed according to control information, and
said control information includes an index value corresponding to the exhaust amount allocated to said substrate processing device by said external exhaust equipment and an index value corresponding to the required exhaust amount of said substrate processing device.
4. The substrate processing method according to claim 1 , further comprising the steps of:
(c) determining whether said step (a) is capable of being performed based on a result preliminarily checked to determine whether said processing fluid can remove a specific chemical substance to a level that satisfies a predetermined quality standard.
5. The substrate processing method according to claim 2 , further comprising the steps of:
(c) determining whether said step (b) is capable of being performed based on a result preliminarily checked to determine whether said processing fluid can be removed a specific chemical substance to a level satisfying a predetermined quality standard.
6. The substrate processing method according to claim 3 , further comprising the steps of:
(c) determining whether said step (b) is capable of being performed based on a result preliminarily checked to determine whether said processing fluid can be removed a specific chemical substance to a level satisfying a predetermined quality standard.