Apparatus and method for encapsulating an electronic component

1. An apparatus for encapsulating at least one electronic component disposed on a printed circuit board, the apparatus comprising:

a liquid-tight enclosure that surrounds the at least one electronic component, wherein the liquid-tight enclosure is fixed with respect to the at least one electronic component and the printed circuit board, and wherein the liquid-tight enclosure is in fluid communication with at least one hole extending through the printed circuit board, the liquid-tight enclosure comprising:

at least one sidewall comprising a rigid material, the at least one sidewall further comprising:

a lower edge that is proximal to the printed circuit board;

an upper edge that is distal from the printed circuit board; and

a height above the printed circuit board that is no more than 0.003 inches greater than a height of the at least one electronic component above the printed circuit board;

a top comprising a solid surface disposed on the upper edge of the at least one sidewall,

wherein the at least one sidewall and the top form the liquid-tight enclosure; and

an encapsulating material that extends from the at least one hole and fills the liquid-tight enclosure to encapsulate the at least one electronic component.

2. The apparatus of claim 1 , wherein the at least one electronic component comprises at least one magnetic device.

3. The apparatus of claim 1 , wherein the solid surface comprises a flexible film.

4. The apparatus of claim 3 , wherein the flexible film comprises a polyimide film or an adhesive polyimide tape.

5. The apparatus of claim 1 wherein the height of the at least one sidewall above the printed circuit board is less than or equal to the height of the at least one electronic component above the printed circuit board.

6. The apparatus of claim 5 wherein the height of the at least one sidewall above the printed circuit board is less than the height of the at least one electronic component above the printed circuit board.

7. The apparatus of claim 1 wherein the solid surface is disposed directly on the at least one electronic component.

8. The apparatus of claim 1 wherein the solid surface is a surface of a cold plate.

9. A method for encapsulating at least one electronic component disposed on a printed circuit board, the method comprising:

surrounding the at least one electronic component with a liquid-tight enclosure, the liquid-tight enclosure comprising:

at least one sidewall comprising a rigid material, the at least one sidewall further comprising:

a lower edge that is proximal to the printed circuit board; and

an upper edge that is distal from the printed circuit board; and

a top comprising a solid surface disposed on the upper edge of the at least one sidewall,

wherein the at least one sidewall and the top form the liquid-tight enclosure, and

wherein a height of the at least one sidewall above the printed circuit board is no more than 0.003 inches greater than a height of the at least one electronic component above the printed circuit board;

fixing the liquid-tight enclosure with respect to the at least one electronic component and the printed circuit board, wherein fixing the liquid-tight enclosure places the liquid-tight enclosure in fluid communication with at least one hole extending through the printed circuit board; and

encapsulating the at least one electronic component in the liquid-tight enclosure with an encapsulating material by injecting or pouring the encapsulating material through the at least one hole to fill the liquid-tight enclosure.

10. The method of claim 9 , further comprising, after encapsulating, curing the encapsulating material.

11. The method of claim 10 , wherein the solid surface comprises a flexible film.

12. The method of claim 11 , further comprising supporting the flexible film with a rigid surface during the encapsulating and the curing.

13. The method of claim 12 , further comprising removing the rigid surface after the curing is complete.

14. The method of claim 11 , further comprising removing the flexible film after the curing is complete.

15. The method of claim 9 , wherein the at least one electronic component comprises at least one magnetic device.

16. The method of claim 15 wherein the solid surface is disposed directly on the at least one magnetic device.

17. The method of claim 9 , further comprising inverting the printed circuit board, the at least one electronic component, the sidewall, and the top as one before encapsulating the at least one electronic component.

18. A system for cooling at least one electronic component disposed on a printed circuit board, the system comprising:

a liquid-tight enclosure disposed around the at least one electronic component and fixed to the printed circuit board, the liquid-tight enclosure in fluid communication with at least one hole extending through the printed circuit board, the liquid-tight enclosure comprising:

at least one sidewall comprising a rigid material, the sidewall further comprising:

a lower edge that is proximal to the printed circuit board; and

an upper edge that is distal from the printed circuit board,

wherein a height of the at least one sidewall above the printed circuit board is no more than 0.003 inches greater than a height of the at least one electronic component above the printed circuit board;

a top comprising a solid surface disposed on the upper edge of the at least one sidewall; and

an encapsulating material that extends from the at least one hole and fills the liquid-tight enclosure,

wherein the at least one sidewall and the top form the liquid-tight enclosure; and

a cold plate disposed on the top of the liquid-tight enclosure.