IP Library › Granted Patent US 12,289,823
Granted Patent B2
US 12,289,823 · App. 17/511,292 · Granted Apr 29, 2025

Metamaterial electromagnetic absorber

Inventors: Seung Hyun Han (Suwon-si, KR); Sung Joon Lim (Anyang-si, KR)
Assignees: HYUNDAI MOTOR COMPANY; KIA CORPORATION; CHUNG ANG University industry Academic Cooperation Foundation
H05K1/0231B32B3/266H01F27/288H01G4/40H05K1/0233H05K1/115H05K1/165H05K9/0081H05K2201/10015
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,289,823
App. No.
17/511,292
Granted
Apr 29, 2025
Kind
B2
Abstract

A metamaterial electromagnetic absorber includes a substrate having a first surface on which electromagnetic waves are incident and a second surface opposite the first surface. The substrate is made of a metamaterial. The metamaterial electromagnetic absorber also includes a first inductive conduction pattern and a second inductive conduction pattern formed on the first surface and the second surface, respectively.

Claims (19)

1. A metamaterial electromagnetic absorber comprising:

a substrate having a first surface on which electromagnetic waves are incident and a second surface opposite the first surface, the substrate being made of a metamaterial; and

a first inductive conduction pattern and a second inductive conduction pattern formed on the first surface and the second surface, respectively,

wherein the first inductive conduction pattern and the second inductive conduction pattern are formed in a symmetrical fashion,

wherein opposite ends of the first inductive conduction pattern and the second inductive conduction pattern are electrically connected to each other through a conductive via hole formed through the substrate, and

wherein the via hole directly connects the first inductive conduction pattern and the second inductive conduction pattern.

2. The metamaterial electromagnetic absorber according to claim 1 , further comprising a conductive plate disposed spaced apart from the substrate in a direction away from the second surface, the conductive plate being grounded.

3. The metamaterial electromagnetic absorber according to claim 1 , wherein the metamaterial is one of glass-reinforced epoxy laminate (FR4), polyester, epoxy, silicone, Teflon, or a combination of two or more thereof.

4. The metamaterial electromagnetic absorber according to claim 1 , wherein the first inductive conduction pattern and the second inductive conduction pattern are electrically connected to each other to form a resonance circuit.

5. The metamaterial electromagnetic absorber according to claim 1 , further comprising a capacitor connected to the inductive conduction pattern in series.

6. The metamaterial electromagnetic absorber according to claim 4 , further comprising a capacitor connected to the inductive conduction pattern in series.

7. A metamaterial electromagnetic absorber comprising:

a substrate having a first surface on which electromagnetic waves are incident and a second surface opposite the first surface, the substrate being made of a metamaterial;

a first inductive conduction pattern and a second inductive conduction pattern formed on the first surface and the second surface, respectively, the first inductive conduction pattern and the second inductive conduction pattern being formed in a symmetrical fashion;

a capacitor connected to the inductive conduction pattern in series; and

a conductive plate disposed spaced apart from the substrate in a direction away from the second surface, the conductive plate being grounded,

wherein opposite ends of the first inductive conduction pattern and the second inductive conduction pattern are electrically connected to each other through a conductive via hole formed through the substrate,

wherein a resonance circuit is formed by the first inductive conduction pattern, the second inductive conduction pattern, inductance of the conductive via hole, the capacitor, and capacitance between the first inductive conduction pattern and the second inductive conduction pattern, and

wherein the via hole directly connects the first inductive conduction pattern and the second inductive conduction pattern.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 26, 2021
From: HAN, SEUNG HYUN; LIM, SUNG JOON
To: HYUNDAI MOTOR COMPANY; KIA CORPORATION; CHUNG ANG UNIVERSITY INDUSTRY ACADEMIC COOPERATION FOUNDATION
Reel/Frame 057920/0664 →
Priority Claims (1)
KR 10-2020-0164620 · Nov 30, 2020 · national
Continuity (1)
Related Publication 20220225494A1 · Jul 14, 2022
References Cited (16)
US 6545212B1 · Uchida · 2003 [cited by examiner]
US 8982008B2 · Parsche · 2015 [cited by applicant]
US 20100244999A1 · Ryou · 2010 [cited by examiner]
US 20110163826A1 · Toujo · 2011 [cited by examiner]
US 20110199273A1 · Kim et al. · 2011 [cited by applicant]
US 20120249396A1 · Parsche · 2012 [cited by applicant]
US 20180370197A1 · Nagamune et al. · 2018 [cited by applicant]
KR 20100046579A · 2010 [cited by applicant]
KR 20140026401A · 2014 [cited by applicant]
KR 20180098547A · 2018 [cited by applicant]
KR 20180134033A · 2018 [cited by applicant]
Liu et al. “A Dual-Band Negative Permeability and Near-Zero Permeability Metamaterials for Wireless Power Transfer System, ” in IEEE Transactions on Industrial Electronics, vol. 68, No. 8, pp. 7072-7082, Published Jul. … [cited by examiner]
Jonghoon Kim et al., Electromagnetic interference and radiation from wireless power transfer systems, IEEE Int. Symp. Electromagn. Compat., pp. 171-176, Sep. 2014. [cited by applicant]
Seungyoung Ahn et al., Optimized shield design for reduction of EMF from wireless power transfer systems, IEICE Electronics Express, vol. 11, No. 2, pp. 1-9, Dec. 24, 2013. [cited by applicant]
Tetsu Shijo et al., EMI reduction technology in 85 kHz band 44 kW wireless power transfer system for rapid contactless charging of electric bus, ECCE 2016—IEEE Energy Conversion Congress and Exposition, 2016; 3 pp. [cited by applicant]
Office Action cited in corresponding Korean patent application No. 10-2020-0164620; Dec. 24, 2024; 10 pp. [cited by applicant]