IP Library › Granted Patent US 12,379,555
Granted Patent B2
US 12,379,555 · App. 17/512,200 · Granted Aug 5, 2025

Detachable connector for co-packaged optics

Inventors: Hesham Taha (Jerusalem, IL); Abraham Israel (Jerusalem, IL)
Assignee: Teramount Ltd.
G02B6/4214G02B6/423G02B6/4239G02B6/4243
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Quick Facts
Patent No.
US 12,379,555
App. No.
17/512,200
Granted
Aug 5, 2025
Kind
B2
Abstract

Apparatus and method for detachably connecting at least one optical fiber of a detachable photonic plug to a photonic integrated circuit (PIC). The detachable photonic plug comprises: a detachable plug die; an optically transparent spacer coupled to the detachable plug die; and at least one optical fiber held between the detachable plug die and the spacer. On the PIC side, apparatus includes a receptacle adapted to receive a detachable photonic plug adapted to couple at least one optical fiber to a photonic integrated circuit (PIC); and a photonic bump of the PIC, the photonic bump having a least one fine alignment feature. The method comprises permanently mounting a receptacle over at least a portion of the PIC; after completion of mounting, inserting the detachable photonic plug into the receptacle; and after the detachable photonic plug is inserted in the receptacle, securing the detachable photonic plug in the receptacle.

Claims (19)

1. A detachable photonic plug for coupling an optical fiber to a photonic integrated circuit (PIC), comprising:

a detachable plug die comprising at least one substantially flat tilted mirror and at least one curved mirror, wherein the at least one substantially flat tilted mirror and the at least one curved mirror are laterally spaced from each other by a predefined distance;

an optically transparent spacer coupled to the detachable plug die; and

at least one optical fiber held between the detachable plug die and the optically transparent spacer.

2. The detachable photonic plug of claim 1 , wherein the detachable plug die further comprises at least one trench, the at least one optical fiber being located within the at least one trench.

3. The detachable photonic plug of claim 2 , wherein the at least one optical fiber is glued within the at least one trench.

4. The detachable photonic plug of claim 2 , wherein the at least one trench has a height that at least equals a diameter of the at least one optical fiber.

5. The detachable photonic plug of claim 2 , wherein a portion of at least one surface of the optically transparent spacer is substantially flat and substantially flush against a portion of at least one surface of the detachable plug die.

6. The detachable photonic plug of claim 2 , wherein a portion of a face of the optically transparent spacer is substantially flat and substantially flush against a portion of a surface of the detachable plug die, the at least one optical fiber, the optically transparent spacer and the detachable plug die being held together by an adhesive.

7. The detachable photonic plug of claim 2 , wherein the at least one tilted mirror is located substantially adjacent to an end of the at least one trench at which an end of the at least one optical fiber is located.

8. The detachable photonic plug of claim 1 , wherein a portion of a first surface of the optically transparent spacer is coupled to a portion of a surface of the detachable plug die, and wherein a portion of a second surface of the optically transparent spacer, located opposite to the portion of the first surface of the optically transparent spacer, is coated with an anti-reflective coating.

9. The detachable photonic plug of claim 1 , wherein the at least one optical fiber is a single mode fiber.

10. The detachable photonic plug of claim 1 , wherein the at least one curved mirror is configured to reflect a plurality of wavelengths of light.

11. The detachable photonic plug of claim 1 , wherein the substantially flat tilted mirror is positioned at a predefined lateral distance from an end of the at least one optical fiber, the substantially tilted flat mirror being oriented so as to change a light beam from a substantially horizontal orientation defined by a trench of the detachable plug die, in which is located the end of the at least one optical fiber, to a an orientation at an angle to the substantially horizontal orientation.

12. The detachable photonic plug of claim 1 , wherein the detachable plug die further comprises at least one fine alignment feature.

13. The detachable photonic plug of claim 1 , wherein the optically transparent spacer further comprises at least one fine alignment feature.

14. The detachable photonic plug of claim 1 , wherein the detachable plug die is adapted to be inserted into a receptacle located over at least a portion of the PIC for coupling light between the at least one optical fiber and the PIC.

15. The detachable photonic plug of claim 1 , wherein the detachable plug die is adapted to be inserted into a receptacle located over at least a portion of the PIC for coupling light between the at least one optical fiber and the PIC, wherein the detachable plug further comprises:

a removably attached clip to secure the detachable photonic plug within the receptacle.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 1, 2021
From: TAHA, HESHAM; ISRAEL, ABRAHAM; HABER, ILAN
To: TERAMOUNT LTD.
Reel/Frame 057978/0792 →
Continuity (1)
Related Publication 20230130045A1 · Apr 27, 2023
References Cited (239)
US 4744618A · Mahlein · 1988 [cited by applicant]
US 4763977A · Kawasaki et al. · 1988 [cited by applicant]
US 5627931A · Ackley et al. · 1997 [cited by applicant]
US 5913002A · Jiang · 1999 [cited by applicant]
US 5939782A · Malladi · 1999 [cited by applicant]
US 6052397A · Jeon et al. · 2000 [cited by applicant]
US 6122417A · Jayaraman et al. · 2000 [cited by applicant]
US 6198864B1 · Lemoff et al. · 2001 [cited by applicant]
US 6253009B1 · Lestra et al. · 2001 [cited by applicant]
US 6271970B1 · Wade · 2001 [cited by applicant]
US 6423956B1 · Mandella et al. · 2002 [cited by applicant]
US 6571039B1 · Al-hemyari et al. · 2003 [cited by applicant]
US 6600845B1 · Feldman et al. · 2003 [cited by applicant]
US 6654533B1 · Koteles et al. · 2003 [cited by applicant]
US 6801693B1 · Jacobowitz et al. · 2004 [cited by applicant]
US 6832031B2 · Smaglinski · 2004 [cited by applicant]
US 6862092B1 · Ibsen et al. · 2005 [cited by applicant]
US 6888988B2 · Vancoille et al. · 2005 [cited by applicant]
US 6941047B2 · Capewell et al. · 2005 [cited by applicant]
US 6960031B2 · McFarland et al. · 2005 [cited by applicant]
US 7050304B2 · Hsu et al. · 2006 [cited by applicant]
US 7058275B2 · Sezerman et al. · 2006 [cited by applicant]
US 7104703B2 · Nagasaka · 2006 [cited by examiner]
US 7139448B2 · Jain et al. · 2006 [cited by applicant]
US 7260328B2 · Kropp · 2007 [cited by applicant]
US 7288756B2 · Sherrer et al. · 2007 [cited by applicant]
US 7317746B2 · Ericson et al. · 2008 [cited by applicant]
US 7358109B2 · Gallup et al. · 2008 [cited by applicant]
US 7366380B1 · Peterson et al. · 2008 [cited by applicant]
US 7447404B2 · Miller · 2008 [cited by applicant]
US 7567391B1 · Strauch, III et al. · 2009 [cited by applicant]
US 7729581B2 · Rolston · 2010 [cited by examiner]
US 7853101B2 · Carothers · 2010 [cited by applicant]
US 7970041B2 · Arimoto et al. · 2011 [cited by applicant]
US 8000565B2 · Liu · 2011 [cited by applicant]
US 8117982B2 · Gruber et al. · 2012 [cited by applicant]
US 8390806B1 · Subramanian · 2013 [cited by applicant]
US 8422836B2 · Riester et al. · 2013 [cited by applicant]
US 8471467B2 · Boerner · 2013 [cited by applicant]
US 8548287B2 · Thacker et al. · 2013 [cited by applicant]
US 8582934B2 · Adler et al. · 2013 [cited by applicant]
US 8803269B2 · Shastri et al. · 2014 [cited by applicant]
US 8834146B2 · Saha et al. · 2014 [cited by applicant]
US 8836942B2 · Quan et al. · 2014 [cited by applicant]
US 8929693B2 · Shin et al. · 2015 [cited by applicant]
US 9039304B2 · Ko et al. · 2015 [cited by applicant]
US 9099581B2 · Na et al. · 2015 [cited by applicant]
US 9285554B2 · Doany et al. · 2016 [cited by applicant]
US 9429725B2 · Shao et al. · 2016 [cited by applicant]
US 9442255B2 · Pommer et al. · 2016 [cited by applicant]
US 9496248B2 · Lee et al. · 2016 [cited by applicant]
US 9500821B2 · Hochberg et al. · 2016 [cited by applicant]
US 9563028B2 · Contag · 2017 [cited by applicant]
US 9658396B2 · Rong et al. · 2017 [cited by applicant]
US 9698564B1 · Shubin et al. · 2017 [cited by applicant]
US 9703041B2 · Smith et al. · 2017 [cited by applicant]
US 9739962B2 · Brenner · 2017 [cited by examiner]
US 9791645B2 · Meadowcroft et al. · 2017 [cited by applicant]
US 9804334B2 · Israel et al. · 2017 [cited by applicant]
US 9804348B2 · Badihi et al. · 2017 [cited by applicant]
US 9864133B2 · Patel et al. · 2018 [cited by applicant]
US 9874688B2 · Doerr et al. · 2018 [cited by applicant]
US 9946028B2 · Chen et al. · 2018 [cited by applicant]
US 10054740B2 · Chetrit et al. · 2018 [cited by applicant]
US 10069279B2 · Malcolm et al. · 2018 [cited by applicant]
US 10222552B2 · Djordjevic et al. · 2019 [cited by applicant]
US 10481334B2 · Israel et al. · 2019 [cited by applicant]
US 10502905B1 · Mathai et al. · 2019 [cited by applicant]
US 10641953B1 · Vashishtha · 2020 [cited by examiner]
US 10746934B2 · Patel · 2020 [cited by examiner]
US 10754107B2 · Li et al. · 2020 [cited by applicant]
US 10866363B2 · Israel et al. · 2020 [cited by applicant]
US 11394468B2 · Zhou et al. · 2022 [cited by applicant]
US 11448836B2 · Ji et al. · 2022 [cited by applicant]
US 11585991B2 · Israel et al. · 2023 [cited by applicant]
US 11863917B2 · Meister · 2024 [cited by examiner]
US 20020079430A1 · Rossi · 2002 [cited by applicant]
US 20020118907A1 · Sugama et al. · 2002 [cited by applicant]
US 20020131180A1 · Goodman · 2002 [cited by applicant]
US 20020150320A1 · Kato · 2002 [cited by applicant]
US 20020164129A1 · Jackson · 2002 [cited by applicant]
US 20030002809A1 · Jian · 2003 [cited by applicant]
US 20030043157A1 · Miles · 2003 [cited by applicant]
US 20030044118A1 · Zhou et al. · 2003 [cited by applicant]
US 20030142896A1 · Kikuchi et al. · 2003 [cited by applicant]
US 20030222282A1 · Fjelstad · 2003 [cited by examiner]
US 20040114869A1 · Fike et al. · 2004 [cited by applicant]
US 20040144869A1 · Hennessy · 2004 [cited by applicant]
US 20040184704A1 · Bakir et al. · 2004 [cited by applicant]
US 20050025430A1 · Bhagavatula et al. · 2005 [cited by applicant]
US 20050162853A1 · Jain · 2005 [cited by applicant]
US 20050164131A1 · Yokouchi · 2005 [cited by applicant]
US 20050276613A1 · Welch et al. · 2005 [cited by applicant]
US 20060022289A1 · Badhei et al. · 2006 [cited by applicant]
US 20060239605A1 · Palen et al. · 2006 [cited by applicant]
US 20060251360A1 · Lu et al. · 2006 [cited by applicant]
US 20060280402A1 · Xia et al. · 2006 [cited by applicant]
US 20060285797A1 · Little · 2006 [cited by applicant]
US 20070103682A1 · Yoo · 2007 [cited by applicant]
US 20070160321A1 · Wu et al. · 2007 [cited by applicant]
US 20070223540A1 · Sudmeyer et al. · 2007 [cited by applicant]
US 20090178096A1 · Menn et al. · 2009 [cited by applicant]
US 20090262346A1 · Egloff et al. · 2009 [cited by applicant]
US 20090297093A1 · Webster et al. · 2009 [cited by applicant]
US 20100002987A1 · Hata et al. · 2010 [cited by applicant]
US 20100086255A1 · Ishizaka · 2010 [cited by applicant]
US 20110032598A1 · Horikawa et al. · 2011 [cited by applicant]
US 20110091167A1 · Nishimura · 2011 [cited by applicant]
US 20110170825A1 · Spector et al. · 2011 [cited by applicant]
US 20110280573A1 · Collings et al. · 2011 [cited by applicant]
US 20110293281A1 · Sakurai · 2011 [cited by applicant]
US 20120002284A1 · McColloch et al. · 2012 [cited by applicant]
US 20120063721A1 · Chen · 2012 [cited by applicant]
US 20120280344A1 · Shastri et al. · 2012 [cited by applicant]
US 20130044977A1 · Amit · 2013 [cited by applicant]
US 20130109083A1 · Llobera Adan · 2013 [cited by applicant]
US 20130129281A1 · Son et al. · 2013 [cited by applicant]
US 20130156370A1 · Kim et al. · 2013 [cited by applicant]
US 20130182998A1 · Andry et al. · 2013 [cited by applicant]
US 20130209026A1 · Doany et al. · 2013 [cited by applicant]
US 20130216180A1 · Tan et al. · 2013 [cited by applicant]
US 20140023098A1 · Clarkson et al. · 2014 [cited by applicant]
US 20140064559A1 · Sugasawa et al. · 2014 [cited by applicant]
US 20140176958A1 · Flanders et al. · 2014 [cited by applicant]
US 20140203175A1 · Kobrinsky et al. · 2014 [cited by applicant]
US 20140226988A1 · Shao et al. · 2014 [cited by applicant]
US 20140294342A1 · Offrein et al. · 2014 [cited by applicant]
US 20140363165A1 · Panotopoulos et al. · 2014 [cited by applicant]
US 20150050019A1 · Sengupta · 2015 [cited by applicant]
US 20150124336A1 · Kaufman · 2015 [cited by applicant]
US 20150125110A1 · Anderson et al. · 2015 [cited by applicant]
US 20150155423A1 · Matsuoka et al. · 2015 [cited by applicant]
US 20160109659A1 · Jiang · 2016 [cited by applicant]
US 20160119064A1 · Yamaji et al. · 2016 [cited by applicant]
US 20160131848A1 · Svilans · 2016 [cited by applicant]
US 20160161686A1 · Li et al. · 2016 [cited by applicant]
US 20160195677A1 · Panotopoulos et al. · 2016 [cited by applicant]
US 20160225477A1 · Banine et al. · 2016 [cited by applicant]
US 20160246004A1 · Kachru et al. · 2016 [cited by applicant]
US 20160306117A1 · Middlebrook et al. · 2016 [cited by applicant]
US 20160377821A1 · Vallance et al. · 2016 [cited by applicant]
US 20170017042A1 · Menard et al. · 2017 [cited by applicant]
US 20170017043A1 · Menard et al. · 2017 [cited by applicant]
US 20170102503A1 · Israel et al. · 2017 [cited by applicant]
US 20170131469A1 · Kobrinsky et al. · 2017 [cited by applicant]
US 20170160481A1 · Ling et al. · 2017 [cited by applicant]
US 20170207600A1 · Klamkin et al. · 2017 [cited by applicant]
US 20170294760A1 · Shubin et al. · 2017 [cited by applicant]
US 20180031791A1 · Israel et al. · 2018 [cited by applicant]
US 20180045891A1 · Israel et al. · 2018 [cited by applicant]
US 20180061691A1 · Jain et al. · 2018 [cited by applicant]
US 20180180829A1 · Gudeman · 2018 [cited by applicant]
US 20180217341A1 · Smith et al. · 2018 [cited by applicant]
US 20180259710A1 · Stabile et al. · 2018 [cited by applicant]
US 20180364426A1 · ten Have et al. · 2018 [cited by applicant]
US 20190146162A1 · Evans · 2019 [cited by applicant]
US 20190170937A1 · Menezo et al. · 2019 [cited by applicant]
US 20190265421A1 · Ji et al. · 2019 [cited by applicant]
US 20190324211A1 · Israel et al. · 2019 [cited by applicant]
US 20190339450A1 · Noriki et al. · 2019 [cited by applicant]
US 20200278508A1 · Israel et al. · 2020 [cited by applicant]
US 20200326491A1 · Psaila et al. · 2020 [cited by applicant]
US 20200357721A1 · Sankman · 2020 [cited by examiner]
US 20210149128A1 · Schaevitz et al. · 2021 [cited by applicant]
US 20210165165A1 · Israel et al. · 2021 [cited by applicant]
US 20210239920A1 · Vallance et al. · 2021 [cited by applicant]
US 20210263216A1 · Bishop et al. · 2021 [cited by applicant]
US 20210392419A1 · Meister · 2021 [cited by examiner]
US 20220026649A1 · Vallance et al. · 2022 [cited by applicant]
US 20220226649A1 · Shalev et al. · 2022 [cited by applicant]
US 20220390693A1 · Krähenbühl et al. · 2022 [cited by applicant]
US 20220404546A1 · Krichevsky · 2022 [cited by examiner]
US 20230018654A1 · Winzer et al. · 2023 [cited by applicant]
US 20230021871A1 · Kuznia et al. · 2023 [cited by applicant]
US 20230030105A1 · Aalto · 2023 [cited by applicant]
US 20230043794A1 · Winzer et al. · 2023 [cited by applicant]
US 20230072926A1 · Morrison et al. · 2023 [cited by applicant]
US 20230077979A1 · Winzer · 2023 [cited by applicant]
US 20230079458A1 · Debergh et al. · 2023 [cited by applicant]
US 20230084003A1 · Taha et al. · 2023 [cited by applicant]
US 20230094780A1 · Testa · 2023 [cited by examiner]
US 20230130045A1 · Taha et al. · 2023 [cited by applicant]
CA 1253377A · 1989 [cited by applicant]
CN 1387626A · 2002 [cited by applicant]
CN 104459890A · 2015 [cited by applicant]
EP 2639978A1 · 2013 [cited by applicant]
EP 3316012A1 · 2018 [cited by applicant]
EP 3495861A1 · 2019 [cited by applicant]
EP 3521879A1 · 2019 [cited by applicant]
EP 4102273A1 · 2022 [cited by applicant]
JP 6462596B2 · 2019 [cited by applicant]
KR 20050007459A · 2005 [cited by applicant]
KR 20170081265A · 2017 [cited by applicant]
RU 2438209C1 · 2011 [cited by applicant]
RU 2485688C2 · 2013 [cited by applicant]
RU 2577669C2 · 2016 [cited by applicant]
WO 2001067497A1 · 2001 [cited by applicant]
WO 2013048730A1 · 2013 [cited by applicant]
WO 2018067703A1 · 2018 [cited by applicant]
WO 2018140057A1 · 2018 [cited by applicant]
International Search Report and Written Opinion of International Searching Authority for PCT/IB2021/062224,ISA/IL, Jerusalem, Israel, Dated: Mar. 17, 2022. [cited by applicant]
Barwicz, et al., “Assembly of Mechanically Compliant Interfaces Between Optical Fibers and Nanophotonic Chips”, IEEE 64th Electronics Components and Technology Conference, Orlando, Fl., May 27-30, 2014. [cited by applicant]
Bogaerts, “Helios Lecture: Coupling Light to Silicon Photonic Circuits”, Silicon Photonics—PhD Course prepared within FP7-224312 Helios Project, Ghent University-IMECGhent, Belgium, Nov. 2009. [cited by applicant]
Camapa, CD-ROM, pp. 58, 59, 79, Russia, 2012. [cited by applicant]
Chrical Photonics., “Fiber Coupler Overview”, Pinebrook, NJ, Jan. 2013. [cited by applicant]
Cunningham, et al., “Aligning Chips Face-to-Face for Dense Capacitive and Optical Communications”, IEEE Transactions on Advanced Packaging, vol. 33, No. 2, May 2010. [cited by applicant]
First Chinese Foreign Office Action for Chinese Application No. 201980025948.3, Chinese National Intellectual Property Administration (CNIPA), Beijing City, China, Dated: Nov. 15, 2021. [cited by applicant]
Foreign Office Action and Search Report for ROC (Taiwan) Patent Application No. 105121625 dated Sep. 5, 2017 from IPO (Intellectual Property Office) of Taiwan. [cited by applicant]
Hou, et al., “Physics of Elliptical Reflectors at Large Reflection and Divergence Angles I: Their Design for Nano-Photonic Integrated Circuits and Application to Low-loss Low-crosstalk Waveguide Crossing”, Northwestern … [cited by applicant]
International Search Report and Written Opinion of Internationl Searching Authority for PCT/US2019/027871, ISA/RU, Moscow, Russia, Dated: Aug. 22, 2019. [cited by applicant]
Kopp, et al., “Silicon Photonic Circuits: On-CMOS Integration, Fiber Optical Coupling, and Packaging”, IEEE Journal of Selected Topics in Quantum Electronics, Aug. 2010. [cited by applicant]
Kurata, et. al., “Prospect of Chip Scale Silicon Photonics Transceiver for High Density Multi-mode Wiring System”, Photonics Electronics Technology Research Association (PETRA), Japan, 2015, pp. 1-7. [cited by applicant]
Nguyen, et al., “Silicon-based Highly-efficient Fiber-to-waveguide Coupler for High Index Contrast Systems”, Applied Physics Letters, American Institute of Physics, downloaded Feb. 29, 2012, published online Feb. 24, 20… [cited by applicant]
Notice of Deficiencies for EP Application No. 16854021.9 dated Jun. 24, 2019, EPO, Rijswijk, Netherlands. [cited by applicant]
O'Brien, “Silicon Photonics Fiber Packaging Technology”, Photonics Packaging Group, Tyndall National Institute, Cork, Ireland, Sep. 2012. [cited by applicant]
PCL Connections LLC, all rights reserved, “In-Line Coupling Element (ICE) for Bonded Grating Coupling to Silicon PICs”, Columbus, OH., May 2013. [cited by applicant]
The European Search Report for EP Application No. 16854021.9 dated Aug. 21, 2018, EPO, The Hague. [cited by applicant]
The First Chinese Office Action for Chinese Patent Application No. 2016800557192, Aug. 22, 2019, China, CNIPA. [cited by applicant]
The International Search Report and The Written Opinion for PCT/US2016/038047, ISA/RU, Moscow, Russia, Date of Mailing: Oct. 13, 2016. [cited by applicant]
The International Search Report and The Written Opinion for PCT/US2017/055146, ISA/RU, Moscow, Russia, Date of Mailing: Jan. 31, 2018. [cited by applicant]
Zimmerman, “State of the Art and Trends in Silicon Photonics Packaging”, Silicon Photonics Workshop, Technische Universitat Berlin, May 2011. [cited by applicant]
Second Chinese Foreign Office Action for Chinese Application No. 2019800259483, Chinese National Intellectual Property Administration (CNIPA), Beijing City, China, Dated: May 31, 2022. [cited by applicant]
Noriki et al., “45-degree curved micro-mirror for vertical optical I/O of silicon photonics chip,” Optics Express, vol. 27, No. 14, Dated: Jul. 8, 2019. [cited by applicant]
The International Search Report and the Written Opinion for PCT Application No. PCT/IL2022/051131, ISA/IL dated Jan. 12, 2023. [cited by applicant]
Miller, David “Self-aligning optics for integrated mode separation,” Standfor University, IEEE 2015. [cited by applicant]
Francis, David G. “Laser Instrumentation in AEDC Test Facilities,” Arnold Engineering Development Center, Dec. 1971. [cited by applicant]
McLaughlin, Dennis K. “Laser Doppler Velocmeter Measurements in a Turbulent Jet Exiting into a Cross Flow,” Arnold Engineering Development Center, Jan. 1972. [cited by applicant]
The International Search Report and the Written Opinion for PCT Application No. PCT/IL2022/051360, ISA/IL dated Mar. 5, 2023. [cited by applicant]
The International Search Report and the Written Opinion for PCT Application No. PCT/IL2022/051358, ISA/IL dated Apr. 2, 2023. [cited by applicant]
Notice of Preliminary Rejection dated Jul. 19, 2023 for KR Application No. 10-2018-7007767. [cited by applicant]
Doerr et al. Silicon photonic integrated circuit for coupling to a ring-core multimode fiber for space-division mutliplexing. Bell Laboratories. ECOC Postdeadline Papers. 2011 OSA. (Year: 2011). [cited by applicant]
The International Search Report and the Written Opinion for PCT Application No. PCT/IL2023/051163, ISA/IL dated Jan. 11, 2024. [cited by applicant]
Tom Mitcheltree and Stephen Hardy. “Optical Connectivity Considerations for Co-Packaged Optics”. Time Stamp: 23:42. May 6, 2021. https://event.webcasts.com/viewer/event.jsp?ei=1459224&tp_key=61326889cd. [cited by applicant]
USCONEC. “13950, Ferrule, PRIZM® LT 12F MM” https://www.usconec.com/products/ferrule-prizm-lt-12f-mm. [cited by applicant]
USCONEC. “15214, Mechanical Optical Interface (MOI) 10+ Gbps, PRIZM® LightTurn®”. https://www.usconec.com/products/mechanical-optical-interface-moi-10plus-gbps-prizm-lightturn. [cited by applicant]
USCONEC. “15215, PRIZM® LightTurn® Mini Housing” https://www.usconec.com/products/prizm-lightturn-mini-housing. [cited by applicant]
USCONEC. “16349, Ferrule, PRIZM® LT 8F SM” https://www.usconec.com/products/ferrule-prizm-lt-8f-sm. [cited by applicant]
USCONEC. “Product Catalog” pp. 69 and 70. https://www.usconec.com/umbraco/rhythm/protectedfilesapi/download?path=%2ffiles%2fLiterature%2fUS_Conec_Product_Catalog.pdf. [cited by applicant]
USCONEC. Mechanical Optical Interface Customer Drawings. https://www.usconec.com/umbraco/rhythm/protectedfilesapi/download?path=%2ffiles%2fdrawings%2fC15214.pdf. [cited by applicant]
Cited By (1)
US 12,613,382