Liquid cooling device

1. A liquid cooling device, comprising:

a heat dissipation shell, wherein the heat dissipation shell comprises a cooling cavity;

a chip sealed in the cooling cavity; and

a dual fin module fixed in the cooling cavity to separate the cooling cavity into an upper cooling space and a lower cooling space to allow a cooling fluid entering into the cooling cavity and flowing into the upper cooling space and the lower cooling space to cool the chip located in the lower cooling space of the cooling cavity, wherein the cooling fluid directly contacts the chip located in the lower cooling space of the cooling cavity, wherein the dual fin module comprises:

an isolation plate;

a plurality of first cooling fins formed on the isolation plate and located in the upper cooling space; and

a plurality of second cooling fins formed beneath the isolation plate and located in the lower cooling space,

wherein the lower cooling space further comprises a film space located between the chip and the second cooling fins to form a liquid film for transferring the heat generated by the chip to the second cooling fins of the dual fin module.

2. The liquid cooling device of claim 1 , wherein the heat dissipation shell further comprises a plurality of fixing platforms, and a fixing surface of the isolation plate of the dual fin module is fixed on the fixing platforms to form the film space between the chip and the second cooling fins.

3. The liquid cooling device of claim 2 , wherein a first cooling fin width of the first cooling fins is equal to or different from a second cooling fin width of the second cooling fins.

4. The liquid cooling device of claim 1 , wherein the heat dissipation shell comprises:

an inlet; and

an outlet, wherein a diameter of the outlet is larger than a diameter of the inlet.

5. The liquid cooling device of claim 4 , wherein the heat dissipation shell further comprises:

two inlet guiding surfaces respectively formed on both sides of the inlet to guide the cooling fluid into the cooling cavity.

6. The liquid cooling device of claim 5 , wherein the heat dissipation shell further comprises:

two outlet guiding surfaces respectively formed on both sides of the outlet to guide the cooling fluid out of the cooling cavity.

7. The liquid cooling device of claim 6 , wherein an included angle between the inlet guiding surfaces and the inlet is about 45 degrees to 75 degrees, and an included angle between the outlet guiding surfaces and the outlet is about 45 degrees to 75 degrees.

8. The liquid cooling device of claim 1 , further comprises:

a substrate, wherein the chip is fixed on the substrate; and \

an adhesive layer bonding the substrate to the heat dissipation shell, and the adhesive layer comprises an epoxy adhesive layer.