Dual-diaphragm assembly having center constraint

1. A microelectromechanical systems (MEMS) diaphragm assembly comprising:

a first diaphragm;

a second diaphragm; and

a stationary electrode assembly spaced between the first and second diaphragms and including a plurality of apertures disposed therethrough;

wherein a plurality of pillars each disposed through one of the plurality of apertures connects the first and second diaphragms; and

wherein at least one of the first and second diaphragms is connected to the stationary electrode assembly at a geometric center of the assembly.

2. The MEMS diaphragm assembly of claim 1 , wherein both of the first and second diaphragms are connected to the stationary electrode assembly at the geometric center of the assembly.

3. The MEMS diaphragm assembly of claim 1 , wherein the at least one of the first and second diaphragms is connected to the stationary electrode assembly at a geometric center of the assembly by an electrically insulative material.

4. The MEMS diaphragm assembly of claim 1 , wherein the at least one of the first and second diaphragms is connected to the stationary electrode assembly at a geometric center of the assembly by an electrically conductive material.

5. The MEMS diaphragm assembly of claim 1 , wherein at least a portion of the at least one of the first and second diaphragms is connected directly to the stationary electrode assembly.

6. The MEMS diaphragm assembly of claim 5 , wherein at least a portion of one of the first and second diaphragms is connected directly to the stationary electrode assembly, and wherein the other of the first and second diaphragms is connected to the stationary electrode assembly by an electrically insulative material.

7. The MEMS diaphragm assembly of claim 5 , wherein at least a portion of one of the first and second diaphragms is connected directly to the stationary electrode assembly, and wherein the other of the first and second diaphragms is connected to the stationary electrode assembly by an electrically conductive material.

8. The MEMS diaphragm assembly of claim 5 , wherein at least a portion of both of the first and second diaphragms is connected directly to the stationary electrode assembly.

9. The MEMS diaphragm assembly of claim 1 , wherein the first diaphragm and the second diaphragm bound a sealed chamber, and wherein the pressure within the sealed chamber is below atmospheric pressure.

10. The MEMS diaphragm assembly of claim 9 , wherein at least one tunnel passes through the first and second diaphragms and the stationary electrode assembly, wherein the at least one tunnel is sealed off from the sealed chamber.

11. The MEMS diaphragm assembly of claim 10 , wherein the at least one tunnel passes through the sealed chamber.

12. The MEMS diaphragm assembly of claim 10 , wherein the at least one tunnel passes through the geometric center of the assembly.

13. The MEMS diaphragm assembly of claim 1 , wherein at least one tunnel passes through the first and second diaphragms and the stationary electrode assembly.

14. A microphone device, comprising:

a MEMS die, comprising:

the MEMS diaphragm assembly of claim 1 ; and

a substrate having an opening formed therethrough;

wherein the diaphragm assembly is attached around the outer periphery thereof to the substrate and over the opening; and

a housing having a sound port, wherein the MEMS die is disposed within the housing, and wherein the sound port is acoustically coupled to the MEMS die.

15. A microelectromechanical systems (MEMS) diaphragm assembly comprising:

a first diaphragm;

a second diaphragm; and

a stationary electrode assembly spaced between the first and second diaphragms, the stationary electrode assembly including a plurality of apertures disposed therethrough, the plurality of apertures including a central aperture disposed through a geometric center of the stationary electrode assembly;

wherein a plurality of pillars is each disposed through one of the plurality of apertures except for the central aperture, wherein the plurality of pillars connects the first and second diaphragms; and

wherein the first and second diaphragms are connected directly to one another within the central aperture.

16. A microphone device, comprising:

a microelectromechanical system (MEMS) die, comprising:

a substrate having an opening formed therethrough; and

a diaphragm assembly attached around a periphery thereof to the substrate and over the opening, wherein the diaphragm assembly comprises:

a first diaphragm;

a second diaphragm; and

a stationary electrode assembly spaced between the first and second diaphragms and including a plurality of apertures disposed therethrough;

wherein a plurality of pillars each disposed through one of the plurality of apertures connects the first and second diaphragms; and

wherein at least one of the first and second diaphragms is connected to the stationary electrode assembly at a geometric center of the assembly; and

a housing having a sound port, wherein the MEMS die is disposed within the housing, and wherein the sound port is acoustically coupled to the MEMS die.

17. The microphone device of claim 16 , wherein at least a portion of the at least one of the first and second diaphragms is connected directly to the stationary electrode assembly.

18. The microphone device of claim 17 , wherein the one of the first and second diaphragms having at least a portion thereof connected directly to the stationary electrode assembly is the one of the first and second diaphragms disposed on a side of the diaphragm assembly away from the opening.

19. The microphone device of claim 16 , wherein both of the first and second diaphragms are connected to the stationary electrode assembly at the geometric center of the assembly.

20. The microphone device of claim 16 , wherein at least one tunnel passes through the first and second diaphragms and the stationary electrode assembly.