Curved electronic device and method for manufacturing the same
A curved electronic device and a method for manufacturing the same are disclosed. The curved electronic device includes a substrate, a component layer, and a modulation layer. The component layer is disposed on the substrate. The component layer is composed of a plurality of electronic components and their connecting wiring arranged on the substrate. The modulation layer is disposed on the component layer, and includes at least one pattern area and at least one blank area that are formed on the component layer. The blank area allows one part of the electronic components to be exposed out of the modulation layer. The modulation layer and the substrate have different heat absorption rates, so that the positions of the substrate corresponding to the blank area and the pattern area have different degrees of softening, so as to prevent the component layer from being damaged in the process of stretching the substrate.
1. A curved electronic device, comprising:
a substrate;
a component layer, disposed on the substrate, the component layer being composed of a plurality of electronic components and their connecting wiring arranged on the substrate; and
a modulation layer, disposed on the component layer and including at least one pattern area and at least one blank area that are formed on the component layer, wherein the blank area allows one part of the electronic components to be exposed out of the modulation layer, a position of the substrate corresponding to the pattern area and a position of the substrate corresponding to the blank area have different heat absorption rates.
2. The curved electronic device as claimed in claim 1 , wherein each of the electronic components is a light-emitting component, and the connecting wiring enables the light-emitting component to be connected to an outside.
3. The curved electronic device as claimed in claim 1 , wherein each of the electronic components is a light-emitting component and its corresponding touch wiring, and the connecting wiring enables the light-emitting component and the corresponding touch wiring to be connected to an outside.
4. The curved electronic device as claimed in claim 1 , wherein the substrate is an electronic component carrying film.
5. The curved electronic device as claimed in claim 1 , wherein the substrate is a flexible laminate of an electronic component carrying film and a flexible film.
6. The curved electronic device as claimed in claim 1 , wherein the modulation layer is an endothermic material.
7. The curved electronic device as claimed in claim 1 , wherein the position of the substrate corresponding to each pattern area has a different heat absorption rate according to the degree of thermoplastic bending of the substrate.
8. The curved electronic device as claimed in claim 1 , wherein a surface of the pattern area is provided with a microstructure, and the microstructure uniformly conducts surface heat to the substrate to increase heat absorption capacity of the substrate relative to the pattern area.
9. The curved electronic device as claimed in claim 1 , wherein a surface of the pattern area is provided with a microstructure, and the microstructure reflects surface heat to reduce heat absorption capacity of the position of the substrate relative to the pattern area.
10. A method for manufacturing a curved electronic device, comprising the steps of:
providing a component layer on a substrate, wherein the component layer is composed of a plurality of electronic components and their connecting wiring arranged on the substrate;
providing a modulation layer on the component layer, the modulation layer including at least one pattern area and at least one blank area that are formed on the component layer, the substrate, the component layer and the modulation layer constituting a semi-finished product, wherein the position of the blank area corresponds to at least one part of the electronic components, and the pattern area covers all the positions of the component layer except the blank area;
placing the semi-finished product in a thermoforming mold for performing a thermoforming process, wherein in the thermoforming process, according to the difference in the heat absorption rate of the pattern area and the blank area, the degree of stretching of the substrate corresponding to the pattern area and the blank area is different.
11. The method as claimed in claim 10 , wherein the modulation layer is formed on the component layer by a screen printing, inkjet, yellow light lithography, laser or press printing process.
12. The method as claimed in claim 11 , wherein the modulation layer is formed by endothermic materials having different heat absorption rates higher than that of the substrate respectively arranged on pattern areas with different bending degrees, so that the substrate has different stretching degrees due to the difference in the heat absorption rates of the respective different pattern areas.
13. The method as claimed in claim 10 , wherein the modulation layer is formed on the component layer by a screen printing, inkjet, yellow light lithography, laser or press printing process, a surface of the pattern area is provided with a microstructure, and the microstructure uniformly conducts surface heat to the substrate to increase heat absorption capacity of the substrate relative to the pattern area.
14. The method as claimed in claim 10 , wherein the modulation layer is formed on the component layer by a screen printing, inkjet, yellow light lithography, laser or press printing process, a surface of the pattern area is provided with a microstructure, and the microstructure reflects surface heat to reduce heat absorption capacity of the position of the substrate relative to the pattern area.