Wearable computing device
A smart ring includes a curved housing having a U-shape interior storing components including: a curved battery approximately conforming to the curved housing, a semi-flexible PCB approximately conforming to the curved housing and having mounted thereon: a motion sensor for generating motion data from physical perturbations of the smart ring, a memory for storing executable instructions, a transceiver for sending data to a client computer, a temperature sensor, and a processor for receiving motion data and performing executable instructions in response thereto, and a potting material disposed in the interior, forming an interior wall of the smart ring, wherein the potting material encapsulates the components and is substantially transparent to visible light, infrared light, and/or ultraviolet light.
1. A wearable electronic device comprising:
a body part made of a material, having an inner surface and an outer surface, wherein a cavity is formed on the inner surface of the body part, the cavity extending from the inner surface of the body part towards the outer surface of the body part and having a depth arranged within the inner surface of the body part,
an electronic part arranged in the cavity, wherein at least a portion of the electronic part has a thickness that is less than the depth of the cavity, and
a coating made of a potting material on the inner surface of the body part, covering the electronic part and the cavity.
2. The wearable electronic device according to claim 1 , wherein the material is a titanium material.
3. The wearable electronic device according to claim 1 , wherein the material is selected from a group consisting of: steel, platinum, gold, silver, aluminum, polymer, plastic, tungsten carbide and a metal alloy.
4. The wearable electronic device according to claim 1 , wherein the electronic part is disposed proximate to a bottom of the cavity.
5. The wearable electronic device according to claim 1 , wherein the potting material is selected from a group consisting of: epoxy material, silicone, a resin, and a polymer.
6. The wearable electronic device according to claim 1 , wherein the electronic part is selected from a group consisting of: a battery, an infrared transmitter, a microcontroller, a radio frequency transceiver, a temperature sensor, a haptic feedback device, a piezo actuator, and an infrared receiver.
7. The wearable electronic device according to claim 1 , wherein the electronic part comprises a circuit board selected from a group consisting of: a rigid-flexible printed circuit board, a flexible printed circuit board.
8. The wearable electronic device according to claim 1 , wherein the body part comprises a ring configured to be worn on a finger.
9. The wearable electronic device according to claim 1 , wherein the electronic part comprises an electromagnetic induction charging coil.
10. A method for forming a wearable electronic device comprising:
providing a body part made of a material, having an inner surface and an outer surface, wherein a cavity is formed on the inner surface of the body part, the cavity extending from the inner surface of the body part towards the outer surface of the body part and having a depth arranged within the inner surface of the body part,
disposing an electronic part in the cavity, wherein at least a portion of the electronic part has a thickness that is less than the depth of the cavity, and
disposing a coating made of a potting material on the inner surface of the body part, covering the electronic part and the cavity.
11. The method according to claim 10 , wherein the material is selected from a group consisting of: titanium, titanium alloy, steel, platinum, gold, silver, aluminum, polymer, plastic, tungsten carbide and a metal alloy.
12. The method according to claim 10 ,
wherein the electronic part is disposed proximate to a bottom of the cavity, and
wherein the electronic part comprises a circuit board selected from a group consisting of: a rigid-flexible printed circuit board, a flexible printed circuit board.
13. The method according to claim 10 , wherein the potting material is selected from a group consisting of: epoxy material, silicone, a resin, and a polymer.
14. The method according to claim 10 , wherein the electronic part is selected from a group consisting of: a battery, an infrared transmitter, a microcontroller, a radio frequency transceiver, a temperature sensor, a haptic feedback device, a piezo actuator, and an infrared receiver.
15. The method according to claim 14 , wherein the potting material comprises a clear material and an opaque material.
16. The method according to claim 10 , wherein the body part comprises a ring configured to be worn on a finger.
17. The method according to claim 10 , wherein the electronic part comprises an electromagnetic induction charging coil.
18. A wearable electronic device configured to be worn on a finger comprising:
a C-shaped body part made of a material, having an inner surface and an outer surface, wherein a cavity is formed on the inner surface of the C-shaped body part, the cavity extending from the inner surface of the C-shaped body part towards the outer surface of the C-shaped body part and having a depth arranged within the inner surface of the C-shaped body part;
an electronic part arranged in the cavity, wherein at least a portion of the electronic part has a thickness that is less than the depth of the cavity, wherein the electronic part comprises: a flexible printed circuit board having an electronic component disposed thereon, wherein the electronic component is selected from a group consisting of: an infrared transmitter, a microcontroller, a radio frequency transceiver, a temperature sensor and an infrared receiver, and a battery coupled to the flexible printed circuit board; and
a coating made of a potting material on the inner surface of the body part, covering the electronic part and the cavity.
19. The wearable electronic device according to claim 18 , wherein the material is selected from a group consisting of: titanium, titanium alloy, steel, platinum, gold, silver, aluminum, polymer, plastic, tungsten carbide and a metal alloy.
20. The wearable electronic device according to claim 18 , wherein the potting material is selected from a group consisting of: epoxy material, silicone, a resin, and a polymer.
21. A wearable electronic device configured to be worn on a finger comprising:
an external portion made of a first material and having an inner surface and an outer surface, wherein the outer surface of the external portion defines an exterior surface of the electronic device;
an interior portion coupled to the external portion, wherein the interior portion is disposed below the inner surface of the external portion, wherein the interior portion is made of a second material, and wherein the interior portion defines an interior surface of the electronic device;
an electronic part disposed within the interior portion, wherein the electronic part comprises:
a rigid-flex printed circuit board comprising at least a first rigid circuit board and a second rigid circuit board coupled via a flexible material; and
at least one electronic component disposed upon the first rigid printed circuit board, wherein the electronic component is selected from a group consisting of: a light emitting diode (LED), a microcontroller, a temperature sensor, a light sensor, an accelerometer, a wireless interface and a haptic feedback device.
22. The wearable electronic device according to claim 21 ,
wherein the first material is selected from a group consisting of: titanium, titanium alloy, stainless steel, platinum, gold, silver, aluminum, polymer, plastic, tungsten carbide and a metal alloy; and
wherein the second material is selected from a group consisting of: epoxy material, silicone, a resin, and a polymer.
23. The wearable electronic device according to claim 21
wherein the electronic part comprises a plurality of electronic components;
wherein the plurality of electronic components are disposed upon portions of the rigid-flex printed circuit board;
wherein the plurality of electronic components comprise: a light emitting diode (LED), a microcontroller, a temperature sensor, a light sensor, an accelerometer, a Bluetooth interface and a haptic feedback device; and
wherein the plurality of electronic components are encapsulated within the interior portion.