IP Library › Granted Patent US 12,376,291
Granted Patent B2
US 12,376,291 · App. 17/520,789 · Granted Jul 29, 2025

Semiconductor device including shared sense amplification circuit group

Inventors: Erxuan Ping (Hefei, CN); Zhen Zhou (Hefei, CN)
Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
H10B12/50G11C11/4091
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Quick Facts
Patent No.
US 12,376,291
App. No.
17/520,789
Granted
Jul 29, 2025
Kind
B2
Abstract

A semiconductor device is provided. The semiconductor device includes a plurality of memory cell groups and a plurality of sense amplification unit groups, and at least two memory cell groups share a same sense amplification unit group.

Claims (13)

1. A semiconductor device, comprising a plurality of memory cell groups and a plurality of sense amplification circuit groups, at least two memory cell groups sharing a same sense amplification circuit group; and no sense amplification circuit group is arranged between the two memory cell groups;

wherein each memory cell group comprises a plurality of bit lines, each sense amplification circuit group comprises a plurality of sense amplification circuits, and each sense amplification circuit is electrically connected to a respective one of the bit lines;

wherein the plurality of sense amplification circuit groups are respectively located on two sides of the two memory cell groups away from each other; and

wherein the sense amplification circuits are alternately distributed relative to the bit lines.

2. The semiconductor device of claim 1 , wherein each sense amplification circuit group acts on at least two memory cell groups.

3. The semiconductor device of claim 1 , wherein the semiconductor device further comprises a plurality of selection switch groups, each sense amplification circuit group is electrically connected to the memory cell groups through a respective one of the selection switch groups.

4. The semiconductor device of claim 3 , wherein each selection switch group comprises a plurality of selection switches, and each sense amplification circuit is electrically connected to the bit lines through a respective one of the selection switches.

5. The semiconductor device of claim 3 , wherein each selection switch group is arranged between two memory cell groups.

6. The semiconductor device of claim 5 , wherein the two memory cell groups share a same sense amplification circuit group.

7. The semiconductor device of claim 4 , wherein each selection switch comprises an N-channel Metal Oxide Semiconductor (NMOS) transistor and a P-channel Metal Oxide Semiconductor (PMOS) transistor, and each of the NMOS transistor and the PMOS transistor is electrically connected to a respective one of the bit lines in different memory cell groups.

8. The semiconductor device of claim 7 , wherein a gate of the NMOS transistor is electrically connected to a gate of the PMOS transistor.

9. The semiconductor device of claim 8 , wherein each of the NMOS transistor and the PMOS transistor is electrically connected to a respective one of the sense amplification circuits through a wire, and the wire passes through a posterior conductive interconnection layer.

10. The semiconductor device of claim 6 , wherein each sense amplification circuit corresponds to a respective one of the bit lines and a respective one of the selection switches.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 28, 2022
From: PING, ERXUAN; ZHOU, ZHEN
To: CHANGXIN MEMORY TECHNOLOGIES, INC.
Reel/Frame 058801/0553 →
Priority Claims (1)
CN 202010919699.7 · Sep 4, 2020 · national
Continuity (2)
Continuation PCTCN2021100516 · Jun 17, 2021
Related Publication 20220077161A1 · Mar 10, 2022
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