Granted Patent B2

US 12,196,624 · App. 17/522,363 · Granted Jan 14, 2025

Inventors: So Young Lee (Suwon-si, KR); Sang Kyu Kim (Yongin-si, KR)

Assignee: SAMSUNG ELECTRONICS CO., LTD.

G01K7/22G01K1/165G01K13/20

Abstract

Claims (46)

1. An apparatus for estimating a temperature of an object, the apparatus comprising:

a sensor comprising:

a first sensor board;

a thermally conductive material provided on an upper end of the first sensor board;

a second sensor board provided on an upper end of the thermally conductive material;

at least one first temperature sensor provided on the first sensor board, the at least one first temperature sensor being configured to measure a surface temperature of the object; and

at least one second temperature sensor provided on the second sensor board, the at least one second temperature sensor being configured to measure a surface temperature of the thermally conductive material; and

a processor configured to:

measure a heat flux based on the surface temperature of the object and the surface temperature of the thermally conductive material;

calculate a correction factor based on a thermal resistance value of the thermally conductive material and the heat flux; and

estimate a core temperature of the object based on a combination of the surface temperature of the object with a ratio between the heat flux and the calculated correction factor.

2. The apparatus of claim 1 , wherein a distance between the first sensor board and the second sensor board is 10 mm or less.

3. The apparatus of claim 1 , wherein the thermally conductive material has a thermal conductivity of 0.1 W/mK or less.

4. The apparatus of claim 1 , wherein the thermally conductive material has a thickness in a range of 0.1 mm to 5 mm.

5. The apparatus of claim 1 , wherein the thermally conductive material comprises air.

6. The apparatus of claim 1 , wherein at least one of the at least one first temperature sensor and at least one of the at least one second temperature sensor are thermistors.

7. The apparatus of claim 1 , wherein at least one of the at least one first temperature sensor and at least one of the at least one second temperature sensor are disposed on a straight line facing each other.

8. The apparatus of claim 1 , wherein the processor is further configured to measure the heat flux based on a value obtained by subtracting the surface temperature of the object and the surface temperature of the thermally conductive material.

9. The apparatus of claim 1 , further comprising a contact layer disposed on a lower end of the first sensor board, the contact layer being configured to contact the object.

10. The apparatus of claim 9 , wherein the contact layer has a thermal conductivity in a range of 1 W/mK to 500 W/mK.

11. The apparatus of claim 1 , further comprising a first convection blocker spaced apart by a predetermined distance from the sensor, the first convection blocker being configured to block convection from an upper end of the sensor, and a second convection blocker configured to block convection from a side surface of the sensor.

12. The apparatus of claim 11 , wherein the predetermined distance is in a range of 0.1 mm to 10 mm.

13. The apparatus of claim 1 , wherein the sensor further comprises a heat flux increasing layer provided on an upper portion of the second sensor board and configured to increase the heat flux.

14. The apparatus of claim 13 , wherein the heat flux increasing layer has a thermal conductivity of 10 W/mK to 500 W/mK.

15. A method of estimating a temperature of an object, the method comprising:

measuring, based on an output of a first temperature sensor disposed on a first sensor board of a sensor, a surface temperature of an object;

measuring, based on an output of a second temperature sensor disposed on a second sensor board of the sensor, a surface temperature of a thermally conductive material disposed between the first sensor board and the second sensor board;

measuring a heat flux based on the surface temperature of the object and the surface temperature of the object of the thermally conductive material;

calculating a correction factor based on a thermal resistance value of the thermally conductive material and the heat flux; and

estimating a core temperature based on a combination of the surface temperature of the object with a ratio between the heat flux and the calculated correction factor.

16. The method of claim 15 , wherein the measuring of the heat flux comprises measuring the heat flux based on a value obtained by subtracting the surface temperature of the object and the surface temperature of the thermally conductive material.

17. An electronic device comprising:

a sensor comprising:

a first sensor board;

a second sensor board which is spaced apart from the first sensor board;

a thermally conductive material provided between the first sensor board and the second sensor board;

a second sensor board provided on an upper end of the thermally conductive material;

at least one first temperature sensor provided on the first sensor board and configured to measure a surface temperature of an object;

at least one second temperature sensor provided on the second sensor board, and configured to measure a surface temperature of the thermally conductive material; and

a heat flux increasing layer provided on the second sensor board and configured to increase a heat flux; and

a processor configured to:

measure the heat flux based on the surface temperature of the object and the surface temperature of the thermally conductive material; and

estimate a core temperature of the object based on the heat flux and the surface temperature of the object.

18. The electronic device of claim 17 , further comprising:

a first convection blocker spaced apart by a predetermined distance from the sensor and configured to block convection from an upper end of the sensor; and

a second convection blocker configured to block convection from a side surface of the sensor.

Assignments (1)

Priority Claims (1)

Continuity (1)

References Cited (39)