Electronic package and manufacturing method thereof
Provided is an electronic package providing a circuit structure having auxiliary circuit layers. Further, an electronic component is disposed on the circuit structure and electrically connected to the auxiliary circuit layers. In addition, an encapsulant covers the electronic component, and the circuit structure is disposed on the package substrate having a plurality of main circuit layers, such that the main circuit layers are electrically connected to the auxiliary circuit layers. As such, a number of layers of the auxiliary circuit layers is used to replace a layer number configuration of the main circuit layers.
1. An electronic package, comprising:
a package substrate having a plurality of main circuit layers;
a package module disposed on the package substrate and including:
a circuit structure disposed on the package substrate by a plurality of conductive components and having a plurality of auxiliary circuit layers electrically connected to the plurality of main circuit layers, wherein the circuit structure has a first surface and a second surface opposite to each other such that the second surface of the circuit structure is disposed on the package substrate via the plurality of conductive components, and a number of layers of the plurality of auxiliary circuit layers is used to replace a layer number configuration of the plurality of main circuit layers such that a number of layers of the plurality of main circuit layers is less than an original expected number of layers of the plurality of main circuit layers;
an electronic component disposed on the first surface of the circuit structure and electrically connected to the plurality of auxiliary circuit layers, wherein the circuit structure extends out of sides of the electronic component; and
an encapsulant formed on the first surface of the circuit structure to encapsulate the electronic component; and
a packaging material formed between the package substrate and the package module to cover the plurality of conductive components,
wherein the package substrate includes a core layer and build-up structures disposed on opposite sides of the core layer, and each of the build-up structures includes a plurality of dielectric layers and the plurality of main circuit layers bonded to the plurality of dielectric layers.
2. The electronic package of claim 1 , wherein the circuit structure has a vertical projected area smaller than a vertical projection area of the package substrate.
3. The electronic package of claim 1 , wherein the plurality of auxiliary circuit layers have a single layer replacing 2 to 4 layers of the plurality of main circuit layers.
4. The electronic package of claim 1 , wherein the number of layers of the plurality of main circuit layers of the package substrate is at least ten.
5. The electronic package of claim 1 , wherein the package substrate has an area of at least 60×60 mm 2 .
6. The electronic package of claim 1 , wherein the electronic component has a plurality of electrode pads electrically connected to the plurality of auxiliary circuit layers, and a distance between the electrode pads is less than or equal to 60 μm.
7. The electronic package of claim 1 , wherein the plurality of auxiliary circuit layers of the circuit structure facing a side of the package substrate have a plurality of electrical contact pads, and a distance between the electrical contact pads is 200 mm to 300 mm or 80 mm to 150 μm.
8. The electronic package of claim 1 , further comprising a plurality of ball pads disposed on another side of the package substrate opposite to the package module, wherein a distance between the ball pads is 500 mm to 1,000 μm.
9. The electronic package of claim 1 , further comprising a heat sink disposed on the package substrate for heat dissipation of the package module.