IP Library Granted Patent US 11,705,695
Granted Patent B2
US 11,705,695 · App. 17/528,177 · Granted Jul 18, 2023

Light emitting device

Inventors: Kazuhiro Sakai (Kanagawa, JP); Daisuke Iguchi (Kanagawa, JP); Takeshi Minamiru (Kanagawa, JP); Yoshinori Shirakawa (Kanagawa, JP); Tomoaki Sakita (Kanagawa, JP); Tsutomu Otsuka (Kanagawa, JP)
Assignee: FUJIFILM Business Innovation Corp.
H01S5/423G02B5/0278G02B27/4205G06V10/145G06V20/64G06V40/166H01S5/02255H01S5/02325H01S5/0687H01S5/06804H01S5/0206H01S5/04252H01S5/04254H01S5/18347H01S5/18361H01S5/2054H01S5/3054H01S5/34353
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Quick Facts
Patent No.
US 11,705,695
App. No.
17/528,177
Granted
Jul 18, 2023
Kind
B2
Abstract

A light emitting device includes a wiring substrate, a light emitting element array that includes a first side surface and a second side surface facing each other, and a third side surface and a fourth side surface connecting the first side surface and the second side surface to each other and facing each other, the light emitting element array being provided on the wiring substrate, a driving element that is provided on the wiring substrate on the first side surface side and drives the light emitting element array, a first circuit element and a second circuit element that are provided on the wiring substrate on the second side surface side to be arranged in a direction along the second side surface, and a wiring member that is provided on the third side surface side and the fourth side surface side and extends from a top electrode of the light emitting element array toward an outside of the light emitting element array.

Claims (50)

1. A light emitting device comprising:

a wiring substrate;

a light emitting element array, provided on a first side of the wiring substrate;

a driving element, provided on the first side of the wiring substrate; and

a wiring pattern, provided on the first side of the wiring substrate;

wherein the wiring pattern connects the light emitting element array to the driving element, the wiring pattern is provided between the wiring substrate and a portion of the driving element, and the wiring pattern is provided between the wiring substrate and an entire light emitting element array, and the wiring pattern does not connect to any circuit elements that provided on an opposite side of the light emitting array to the driving element.

2. The light emitting device according to claim 1 ,

wherein the light emitting element array and the driving element are arranged linearly in a first direction, and

the wiring pattern is provided linearly in the first direction.

3. The light emitting device according to claim 2 ,

wherein the wiring substrate has a plane shape extending in the first direction and a second direction orthogonal to the first direction, and

in a third direction orthogonal to the first direction and the second direction, an end side of the wiring pattern in the first direction is interposed between the driving element, and an other end side of the wiring substrate in the first direction is interposed between the light emitting array and the wiring substrate.

4. The light emitting device according to claim 3 ,

wherein the wiring pattern is interposed between the wiring substrate and a portion of the driving element, and

the wiring pattern is interposed between the wiring substrate and an entire light emission region of the light emitting element array.

5. The light emitting device according to claim 3 ,

wherein a length in the first direction of a portion of the wiring pattern which is not interposed between the wiring substrate and any one of the light emitting element array and the driving element is shorter than a length in the first direction of a portion of the wiring pattern which is interposed between the wiring substrate and any one of the light emitting array and the wiring substrate.

6. The light emitting device according to claim 1 ,

wherein a planar shape of the wiring pattern is a quadrangle.

7. The light emitting device according to claim 2 , further comprising:

a top electrode of the light emitting element array; and

a second wiring pattern, connected to the top electrode;

wherein the second wiring pattern is arranged in a manner of interposing the wiring pattern therebetween, so that the wring pattern is located between a positive second direction side and a negative second direction side of the second wiring pattern in a second direction, and the second direction is orthogonal to the first direction.

8. The light emitting device according to claim 1 , further comprising:

a base member, provided between a bottom electrode of the light emitting element array and the wiring pattern.

9. The light emitting device according to claim 1 ,

wherein the wiring pattern is formed on a front surface side of the wiring substrate.

10. The light emitting device according to claim 1 ,

wherein the wiring substrate is a multilayer substrate and comprises a via disposed in a lower layer below the wiring pattern.

11. The light emitting device according to claim 1 ,

wherein the wiring substrate is a multilayer substrate and comprises a power source line disposed in a lower layer below the wiring pattern.

12. The light emitting device according to claim 1 ,

wherein the wiring substrate is a multilayer substrate and comprises a ground line disposed in a lower layer below the wiring pattern.

13. The light emitting device according to claim 1 ,

wherein the wiring substrate is a multilayer substrate and comprises a plurality of conductive layers, and the wiring pattern is formed on a first conductive that is a conductive layer of a front surface side.

14. A light emitting device comprising:

a wiring substrate;

a light emitting element array that includes a first side surface and a second side surface facing each other, and a third side surface and a fourth side surface connecting the first side surface and the second side surface to each other and facing each other, the light emitting element array being provided on a first side of the wiring substrate;

a driving element that is provided on the first side of the wiring substrate on the first side surface side and drives the light emitting element array;

a first circuit element and a second circuit element that are provided on the wiring substrate on the second side surface side to be arranged in a direction along the second side surface;

a wiring member that is provided on the third side surface side and the fourth side surface side and extends from a top electrode of the light emitting element array toward an outside of the light emitting element array; and

a wiring pattern that connects the light emitting element array to the driving element.

15. The light emitting device according to claim 14 ,

wherein the wiring pattern is arranged between the light emitting element array and the driving element in a state where no other circuit element is provided between the light emitting element array and the driving element.

16. A light emitting device comprising:

a wiring substrate;

a light emitting element array that includes a first side surface and a second side surface facing each other, and a third side surface and a fourth side surface connecting the first side surface and the second side surface to each other and facing each other, the light emitting element array being provided on a first side of the wiring substrate;

a driving element, provided on the first side of the wiring substrate; and

a wiring pattern, provided on the first side of the wiring substrate and connects the light emitting element array to the driving element;

a wiring member that is provided on the third side surface side and the fourth side surface side and extends from a top electrode of the light emitting element array toward an outside of the light emitting element array.

Priority Claims (1)
JP 2019-076837 · Apr 15, 2019 · national
Continuity (2)
Continuation 16719940 · Dec 18, 2019
Related Publication 20220077659A1 · Mar 10, 2022