Probe card device and testing equipment thereof
A probe card device includes a printed circuit board (PCB), a space transformer, and a high-speed flexible printed circuit (FPC). The PCB includes a plurality of first connecting bodies coupled to a tester, and a plurality of second connecting bodies. The space transformer includes a plurality of connecting bodies disposed on a first surface of the space transformer and coupled to the plurality of second connecting bodies of the printed circuit board, a plurality of general contact pads disposed on a second surface of the space transformer and contacted with a plurality of first probes, and a plurality of high-speed contact pads disposed on the second surface of the space transformer and contacted with a plurality of second probes. The high-speed FPC has a first connecting terminal coupled to the tester, and a second connecting terminal coupled to the plurality of high-speed contact pads.
1. A probe card device comprising:
a printed circuit board comprising:
a plurality of first connecting bodies disposed on a first surface of the printed circuit board and coupled to a tester; and
a plurality of second connecting bodies disposed on a second surface of the printed circuit board;
a space transformer comprising:
a plurality of connecting bodies disposed on a first surface of the space transformer and coupled to the plurality of second connecting bodies of the printed circuit board;
a plurality of general contact pads disposed on a second surface of the space transformer and contacted with a plurality of first probes; and
a plurality of high-speed contact pads disposed on the second surface of the space transformer and contacted with a plurality of second probes; and
a high-speed flexible printed circuit having a first connecting terminal coupled to the tester, and a second connecting terminal coupled to the plurality of high-speed contact pads, wherein the second connecting terminal of the high-speed flexible printed circuit is directly coupled to the hi h-speed contact pads.
2. The probe card device of claim 1 , wherein:
a pitch between two of the plurality of connecting bodies of the space transformer is greater than a pitch between two of the plurality of general contact pads and a pitch between two of the plurality of high-speed contact pads.
3. The probe card device of claim 2 , wherein:
the pitch between two of the plurality of connecting bodies of the space transformer is greater than or equal to 250 μm; and
the pitch between two of the plurality of general contact pads and the pitch between two of the plurality of high-speed contact pads is smaller or equal to 50 μm.
4. The probe card device of claim 1 , wherein:
the first connecting terminal of the high-speed flexible printed circuit is connected to a high-speed connector for being coupled to the tester.
5. The probe card device of claim 1 , wherein:
the plurality of general contact pads are disposed in an inner area of the second surface of the space transformer; and
the plurality of high-speed contact pads are disposed in a peripheral area outside of the inner area on the second surface of the space transformer.
6. The probe card device of claim 1 , wherein a pitch of the first connecting terminal is greater than a pitch of the second connecting terminal.
7. The probe card device of claim 1 , wherein:
the first connecting terminal of the high-speed flexible printed circuit is disposed above or beside the first surface of the printed circuit board; and
the second connecting terminal of the high-speed flexible printed circuit is disposed on the second surface of the space transformer.
8. The probe card device of claim 1 , wherein the high-speed flexible printed circuit is configured to deliver signals having frequencies greater than 10 GHz.
9. The probe card device of claim 1 , wherein the second connecting bodies forms a ball grid array (BGA).
10. The probe card device of claim 1 , wherein the plurality of general contact pads and the plurality of high-speed contact pads are controlled collapse chip connection (C4) contact pads.
11. A testing equipment comprising:
a probe card device comprising:
a printed circuit board comprising:
a plurality of first connecting bodies disposed on a first surface of the printed circuit board; and
a plurality of second connecting bodies disposed on a second surface of the printed circuit board;
a space transformer comprising:
a plurality of connecting bodies disposed on a first surface of the space transformer and coupled to the plurality of second connecting bodies of the printed circuit board;
a plurality of general contact pads disposed on a second surface of the space transformer; and
a plurality of high-speed contact pads disposed on the second surface of the space transformer; and
a high-speed flexible printed circuit having a first connecting terminal, and a second connecting terminal coupled to the plurality of high-speed contact pads; and
a plurality of probes respectively contacted with the plurality of general contact pads and the plurality of high-speed contact pads, wherein the second connecting terminal of the high-speed flexible printed circuit is directly coupled to the high-speed contact pads.
12. The testing equipment of claim 11 further comprising:
a tester coupled to the plurality of first connecting bodies of the printed circuit board and the high-speed flexible printed circuit, and configured to generate signals for testing a device under test (DUT) and receive signals outputted by the device under test for analysis.
13. The testing equipment of claim 12 , wherein:
the first connecting terminal of the high-speed flexible printed circuit is connected to at least one high-speed connector for being coupled to the tester.
14. The testing equipment of claim 11 , wherein:
a pitch between two of the plurality of connecting bodies of the space transformer is greater than a pitch between two of the plurality of general contact pads and a pitch between two of the plurality of high-speed contact pads.
15. The testing equipment of claim 14 , wherein:
the pitch between two of the plurality of connecting bodies of the space transformer is greater than or equal to 250 μm; and
the pitch between two of the plurality of general contact pads and the pitch between two of the plurality of high-speed contact pads is smaller or equal to 50 μm.
16. The testing equipment of claim 11 , wherein:
the plurality of general contact pads are disposed in an inner area of the second surface of the space transformer; and
the plurality of high-speed contact pads are disposed in a peripheral area outside of the inner area on the second surface of the space transformer.
17. The testing equipment of claim 11 , wherein a pitch of the first connecting terminal of the high-speed flexible printed circuit is greater than a pitch of the second connecting terminal of the high-speed flexible printed circuit.
18. The testing equipment of claim 11 , wherein:
the first connecting terminal of the high-speed flexible printed circuit is disposed above or beside the first surface of the printed circuit board; and
the second connecting terminal of the high-speed flexible printed circuit is disposed on the second surface of the space transformer.
19. The testing equipment of claim 11 , the high-speed flexible printed circuit is configured to deliver signals having frequencies greater than 10 GHz.
20. The testing equipment of claim 11 , wherein the second connecting bodies forms a ball grid array (BGA).
21. The testing equipment of claim 11 , wherein the plurality of general contact pads and the plurality of high-speed contact pads are controlled collapse chip connection (C4) contact pads.