Copper oxide solid for use in plating of a substrate, method of producing the copper oxide solid, and apparatus for supplying a plating solution into a plating tank
The present invention relates to a copper oxide solid for use in plating of a substrate using an insoluble anode. Further the present invention relates to a method of producing the copper oxide solid. Further the present invention relates to an apparatus for supplying a plating solution in which the copper oxide solid is dissolved into a plating tank. A copper oxide solid (CS) to be supplied into a plating solution for plating a substrate (W) includes a copper oxide powder and a liquid as a binder to solidify the copper oxide powder.
1. An apparatus for supplying a plating solution, the plating solution dissolving a compression molded copper oxide solid into a plating tank, the compression molded copper oxide solid comprising a copper oxide powder and a liquid as a binder to bind the copper oxide powder, comprising:
a dissolution tank configured to dissolve the compression molded copper oxide solid to the plating solution;
a feeding mechanism configured to feed the compression molded copper oxide solid into the dissolution tank; and
an agitator configured to agitate the plating solution while feeding the compression molded copper oxide solid into the dissolution tank, and
wherein the feeding mechanism comprises:
a storage case configured to store a plurality of compression molded copper oxide solids comprising the compression molded copper oxide solid, the plurality of compression molded copper oxide solids stored in an overlapped or stacked configuration; and
an actuator configured to move the compression molded copper oxide solid in the storage case until immersing the compression molded copper oxide solid from the storage case into the plating solution in the dissolution tank.
2. The apparatus according to claim 1 , wherein the storage case comprises:
a supply port having a size for the compression molded copper oxide solid to pass through; and
a communication hole having a size for the actuator to contact the compression molded copper oxide solid in the storage case, and
wherein the actuator is a push-out device configured to push out the compression molded copper oxide solid to the plating solution in the dissolution tank through the communication hole.
3. The apparatus according to claim 2 , wherein the feeding mechanism comprises an inert-gas supply mechanism configured to supply an inert gas toward the supply port.
4. The apparatus according to claim 3 , wherein the inert-gas supply mechanism comprises a gas nozzle coupled to the storage case.
5. The apparatus according to claim 1 , wherein the liquid comprises the plating solution to which no additives have been added.
6. The apparatus of claim 1 wherein the plurality of compression molded copper oxide solids are stacked in a columnar configuration.
7. The apparatus of claim 1 wherein the plurality of compression molded copper oxide solids are overlapped in a vertical configuration.